10M25DCF484C8G - MAX 10 FPGA 25K LE 484-BGA | Intel
Teilenummer: 10M25DCF484C8G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $58.4 | $58,40 |
| 10 | $54.1 | $541,00 |
| 100 | $49.25 | $4.925,00 |
| 250 | $45.8 | $11.450,00 |
| 500 | $42.1 | $21.050,00 |
10M25DCF484C8G Übersicht
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that engineers can customize after manufacturing. FPGAs sit between fixed-function ASICs and microcontrollers in the semiconductor taxonomy: programmable logic device -> FPGA -> reconfigurable logic IC -> semiconductor. They are widely used for digital glue logic, sensor aggregation, industrial control, motor drive, video bridging, and ASIC prototyping where parallelism and deterministic latency matter more than raw clock speed.
Key features of the 10M25DCF484C8G include 25,000 logic elements, 16 dedicated 18x18 multipliers (DSP blocks), integrated configuration flash, on-chip ADC support, and 360 user I/O pins enabled by the F484 BGA package. It belongs to the 'C8' speed/temperature grade, which targets commercial-temperature operation (0C to 85C) at the -8 speed bin, balancing cost and timing margin for mainstream industrial and consumer designs.
The MAX 10 architecture employs a look-up-table (LUT)-based logic fabric combined with a flash-programmable configuration plane, allowing instant-on behavior at power-up - a critical advantage over SRAM-based FPGAs that require external boot devices. The 484-BGA package also exposes a high number of general-purpose I/O and high-speed LVDS lanes, supporting parallel data capture and bridge applications.
Typical applications include industrial machine vision, motor control and drive, factory automation backplanes, low-cost video processing, sensor fusion hubs, and portable test instrumentation where instant-on reconfigurable logic is valuable. The integrated flash and ADC blocks reduce bill-of-materials cost for distributed I/O nodes.
When designing with the 484-BGA variant, pay close attention to PCB stack-up and via-in-pad rules for breakout routing. Confirm Quartus Prime device support (Cyclone V / MAX 10 device library) before committing the layout, and verify that the -C8 timing model matches your target fMAX for DSP and external memory interfaces.
Drop-in-Alternativen für 10M25DCF484C8G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M25DCF484C8G (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, PLLs, Configuration Memory, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M25DCF484A7G
✅ Drop-In✓ Auf Lager
$62.5 / Stück
Datenblatt ansehen →10M25DCF484C7G
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
10M25DAF484C8G
✅ Drop-In✓ Auf Lager
$50 / Stück
Datenblatt ansehen →10M25DAF484C7G
✅ Drop-In✓ Auf Lager
$38.5 / Stück
Datenblatt ansehen →10M25DAF484A7G
✅ Drop-In✓ Auf Lager
$52.75 / Stück
Datenblatt ansehen →10M25DAF484I7G
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$99.8 / Stück
Datenblatt ansehen →10M25DCF484C8G Grenzwerte & elektrische Eigenschaften
| Series | MAX 10 |
| Logic Elements | 25,000 |
| Embedded Memory (Bits) | 691,200 |
| Number of I/O | 360 |
| Gehäuse | 484-BGA (FBGA) |
| Speed Grade | -8 |
| Temperature Grade | Commercial (0C to 85C) |
| Configuration Memory | Internal flash (non-volatile) |
| On-chip ADC | Yes (MAX 10 family feature) |
| Betriebstemperatur | 0C to 85C |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
10M25DCF484C8G 484-bga (fbga) Pinbelegungsleitfaden
Pinbelegung für 10M25DCF484C8G (484-bga (fbga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M25DCF484C8G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M25DCF484C8G ist geeignet für 7 Anwendungs: Industrial Machine Vision, Motor Control and Drive, Factory Automation Backplane Bridges, Low-Cost Video Processing and Bridging, Sensor Fusion Hubs for IoT Edge Gateways, Portable Test and Measurement Instrumentation, ASIC Prototyping and Design Validation.
Industrial Machine Vision
The 10M25DCF484C8G's 25,000 logic elements and 360 user I/Os in a 484-BGA package make it well-suited to industrial machine vision pipelines. Designers can implement CoaXPress, GigE Vision, or Camera Link aggregation directly in the fabric, with the abundant M9K block RAM (691 Kbits total) absorbing line buffers and frame headers before forwarding data via LVDS or external DDR memory. The -8 speed grade supports the high fMAX needed for pixel-clock domain crossing at 200-300 MHz, while the on-chip flash configuration enables instant-on for line-scan cameras that must be ready before the conveyor starts moving.
Empfohlen
Motor Control and Drive
Field-oriented control (FOC) loops for three-phase motors demand deterministic, sub-microsecond computation - exactly what the 10M25DCF484C8G delivers via parallel fabric execution. Its 18x18 hardware multipliers (DSP blocks) handle Park/Clarke transforms and PID loops in parallel, while 360 I/Os support encoder, Hall-sensor, and PWM-channel fan-out for multi-axis drives. The instant-on behavior from on-chip flash removes boot latency that SRAM FPGAs incur, critical for safety-rated drive startups. The 484-BGA package also routes cleanly to gate-driver PCBs with controlled impedance.
Empfohlen
Factory Automation Backplane Bridges
Protocol-bridging nodes between Profinet, EtherCAT, Modbus TCP, and legacy fieldbus segments fit naturally on the 10M25DCF484C8G. With 25K logic elements the device can host several soft-IP stacks concurrently, and the 484-BGA provides the pin budget needed for parallel multi-port bridging (RJ45, fiber, RS-485) without external muxing. The non-volatile flash eliminates the boot PROM and lets the bridge come online within milliseconds - important for deterministic industrial restart behavior. The -8 speed grade sustains 100 Mbps Ethernet MAC timing closure comfortably.
Empfohlen
Low-Cost Video Processing and Bridging
The 10M25DCF484C8G can act as a video format converter, color-space transformer, or light scaler between HDMI, MIPI CSI-2, RGB parallel, and LVDS inputs. The 360 I/Os accommodate wide video buses plus sideband control, and the 691 Kbits of embedded SRAM buffers scan-line data without external DDR. The -C8 commercial speed grade supports pixel-clock domain conversions up to 148.5 MHz (720p/1080i timing). Designers building KVM extenders, video walls, or medical imaging front-ends frequently adopt this density point.
Empfohlen
Sensor Fusion Hubs for IoT Edge Gateways
Edge gateways aggregating SPI, I2C, UART, and CAN sensor streams benefit from the 10M25DCF484C8G's abundant I/O and DSP blocks. The fabric can run lightweight FFT and thresholding on vibration, acoustic, or temperature data before forwarding only events upstream. The on-chip flash reduces BOM for fan-less industrial gateways, and the commercial temperature grade fits indoor enclosure deployments. Quartus Prime and Platform Designer accelerate IP reuse across gateway SKUs.
Empfohlen
Portable Test and Measurement Instrumentation
Bench-top oscilloscopes, protocol analyzers, and JTAG debuggers use the 10M25DCF484C8G as a flexible capture-and-display engine. With 360 I/Os the device can sample 16+ digital channels at 500 MSPS alongside analog front-end conditioning, while the 18x18 multipliers perform on-the-fly FIR filtering. The non-volatile configuration means the instrument is ready immediately at power-on, with no boot delay visible to the user. USB and Ethernet interfaces are easily implemented in soft IP.
Empfohlen
ASIC Prototyping and Design Validation
For pre-silicon ASIC validation, the 10M25DCF484C8G offers 25K LEs of capacity - enough to prototype medium-complexity SoC peripherals, custom buses, and glue logic at near-real speed. The Quartus Prime design flow supports rapid RTL iteration, and the 484-BGA package's high I/O count enables ASIC-pin-count emulation including wide memory busses. When the target ASIC exceeds this density, designers move up to the 10M50 tier in the same package family, preserving PCB layout and IP investments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M25DCF484C8G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M25DCF484A7G | 10M25DCF484C7G | 10M25DAF484C8G | 10M25DAF484C7G | 10M25DAF484A7G | 10M25DAF484I7G |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BGA (F484) | 484-BGA (F484) - same | 484-BGA (F484) - same | 484-BGA (F484) - same | 484-BGA (F484) - same | 484-BGA (F484) - same | 484-BGA (F484) - same |
| Logic Elements | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 | 25,000 |
| Speed Grade | -8 | -7 | -7 | -8 | -7 | -7 | -7 |
| Temperature Grade | Commercial (0C to 85C) | Automotive-grade qualified (A7G) | Commercial (0C to 85C) | Commercial (0C to 85C) | Commercial (0C to 85C) | Automotive-grade qualified (A7G) | Industrial (-40C to 100C) |
| On-chip ADC | No (standard DCF) | No | No | Yes (Analog-on-Demand enabled) | Yes | Yes | Yes |
| User I/O Count | 360 | 360 | 360 | 360 | 360 | 360 | 360 |
| Embedded Memory (bits) | 691,200 | 691,200 | 691,200 | 691,200 | 691,200 | 691,200 | 691,200 |
| Config Memory | Internal flash | Internal flash | Internal flash | Internal flash | Internal flash | Internal flash | Internal flash |
Wichtigste Unterscheidungsmerkmale
- Highest commercial speed grade in the 25K-LE F484 family (vs. 10M25DCF484C7G)
- Standard fabric - lower cost than ADC-enabled variant (vs. 10M25DAF484C8G)
- Single supply, instant-on configuration (vs. Cyclone IV EP4CE25F484 (SRAM FPGA))
Designhinweise
The 484-BGA package uses 1.0 mm ball pitch. Designers should adopt a 4-layer or 6-layer PCB stack-up with a dedicated ground plane directly under the device, and use via-in-pad with filled/capped vias for the inner-row BGA balls. Power decoupling requires 100 nF X7R capacitors within 1 mm of every VCCIO/VCCINT ball group, plus bulk 10 uF tantalum or ceramic at each voltage rail. Failure to provide proper decoupling risks power-supply noise coupling into the PLL and SERDES blocks.
Estimated: At -8 speed grade with all 25K LEs running at 200 MHz toggle rate and typical 30% switching activity, internal dissipation reaches approximately 1.5-2.0 W. The 484-BGA package's theta_JA (approximately 12-15 C/W with appropriate thermal vias and copper pour) yields a junction temperature rise of 25-30 C above ambient. Industrial designs should populate the full thermal-via array under the BGA exposed pad region to maintain a low junction-to-ambient thermal resistance.
Do not confuse the 'C8G' suffix ordering code with the -6 or -7 speed grades - the trailing '8' refers to the speed bin, not the temperature grade. Always verify the full OPN against the Intel MAX 10 ordering code reference. Mixing up speed grades can break timing closure on critical paths such as DDR3 interfaces. Also confirm Quartus Prime version supports the specific device-package-pin combination before PCB commitment.
Compliance-Informationen
RoHS and REACH compliant per Intel product page. Not AEC-Q100 qualified - select 10M25DAF484A7G or other A7G OPN for AEC-Q100 automotive-grade applications. MSL level and exact VCCINT are not stated in the verified web data and are marked [DATA_NEEDED] in the specs array.