10M40DCF484C8G - MAX 10 FPGA, 40K LE, 484-FBGA | Intel / Altera
Teilenummer: 10M40DCF484C8G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $64.75 | $6.475,00 |
| 500 | $58.4 | $29.200,00 |
| 1.000 | $53.9 | $53.900,00 |
10M40DCF484C8G Übersicht
What is a non-volatile FPGA? A non-volatile FPGA, in the broader taxonomy of programmable logic devices (PLDs), retains its configuration in on-chip flash memory. This contrasts with SRAM-based FPGAs (such as older Altera Cyclone or Xilinx 7-series families) that require an external boot PROM and lose their configuration on power-down. The MAX 10 family belongs to Intel's programmable logic hierarchy: PLD -> CPLD/FPGA -> non-volatile FPGA -> MAX 10. By integrating configuration storage, ADCs, and DSP blocks onto a single die, MAX 10 devices simplify board design, reduce BOM cost, and accelerate time-to-market versus competing SRAM-based solutions.
Key features of the 10M40DCF484C8G include an on-die 12-bit analog-to-digital converter (ADC) supporting up to 17 analog inputs, dedicated hardware multipliers (DSP blocks) for fixed- and floating-point arithmetic, and an embedded Nios II soft processor compatibility layer. The device also integrates phase-locked loops (PLLs) for clock management, internal flash memory for user data and configuration, and supports the LVDS, LVTTL, and LVCMOS I/O standards at rates suitable for industrial control and video bridging.
Architecturally, the MAX 10 die is divided into logic array blocks (LABs), embedded memory blocks (M9K), DSP blocks (18x18 multipliers), and a periphery of GPIO banks. The 484-FBGA package exposes 360 general-purpose I/Os to the PCB and supports the commercial junction temperature range with appropriate derating. Internal flash can be partitioned for user data storage, enabling the device to replace a small microcontroller plus glue logic on a single chip.
Typical applications include industrial motor control, factory automation I/O expansion, video interface bridging (display port to RGB), portable medical instrumentation, and low-volume ASIC replacement. The instant-on capability also makes it attractive in aerospace and defense subsystems where deterministic boot latency is required. Compared to discrete microcontrollers, the MAX 10 provides deterministic parallel logic and high-speed custom I/O timing that software-driven MCUs cannot match.
When designing with this part, pay attention to the BGA fanout: the 1 mm pitch 484-FBGA demands HDI PCB stack-ups with microvias for reliable assembly. Decoupling, PLL power filtering, and JTAG chain integrity must follow the Intel MAX 10 hardware design guidelines to avoid signal-integrity issues.
This page synthesizes distributor stock, datasheet parameters, and same-family drop-in alternatives across the MAX 10 line, providing practical engineering context not consolidated in any single manufacturer document.
Drop-in-Alternativen für 10M40DCF484C8G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M40DCF484C8G (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Process Technology, Configuration Memory, Embedded Memory (bits).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M40DCF484C7G
✅ Drop-In✓ Auf Lager
$124.2 / Stück
Datenblatt ansehen →10M40DCF484I7G
✅ Drop-In✓ Auf Lager
$71.48 / Stück
Datenblatt ansehen →10M25DCF484C8G
✅ Drop-In✓ Auf Lager
$42.1 / Stück
Datenblatt ansehen →10M40DCF256C8G
✅ Drop-In✓ Auf Lager
$71.8 / Stück
Datenblatt ansehen →10M16DCF484C8G
✅ Drop-In✓ Auf Lager
$35.8 / Stück
Datenblatt ansehen →10M40DCF484C8G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Series | 10M40 |
| Device Logic Elements | 40000 |
| Embedded Memory (bits) | 1290240 |
| User I/O Count | 360 |
| Gehäuse | 484-FBGA (F484) |
| Package Code | F484 |
| Montageart | Surface Mount (BGA) |
| Pitch | 1.0 mm |
| Speed Grade | C8 |
| Temperature Grade | Commercial |
| Process Technology | 55 nm embedded flash |
| Configuration Memory | Internal non-volatile flash |
| On-chip ADC | 12-bit, up to 17 channels |
| RoHS-Status | Compliant |
10M40DCF484C8G f484 Pinbelegungsleitfaden
Pinbelegung für 10M40DCF484C8G (f484-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M40DCF484C8G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M40DCF484C8G ist geeignet für 6 Anwendungs: Industrial Motor Control, Factory Automation I/O Expansion, Video Interface Bridging, Portable Medical Instrumentation, ASIC Replacement / Low-Volume Production, Aerospace and Defense Subsystems.
Industrial Motor Control
The 10M40DCF484C8G's 40,000 logic elements and 360 user I/Os are well-matched to multi-axis industrial motor control. The device integrates a 12-bit ADC with up to 17 analog inputs for current sensing and back-EMF measurement, plus DSP blocks implementing field-oriented control (FOC) loops. Per the MAX 10 datasheet, the on-chip flash eliminates external boot memory, while the commercial C8 speed grade delivers sub-microsecond PWM update rates for closed-loop torque control. Compared to microcontroller-based solutions, the FPGA's deterministic parallel logic executes current loops in a single clock edge with no software jitter.
Empfohlen
Factory Automation I/O Expansion
In factory automation, the 10M40DCF484C8G serves as a deterministic I/O aggregator interfacing 24V industrial signals (24V-tolerant GPIO banks), RS-485 multi-drop buses, and EtherCAT/CAN-FD protocol stacks. The 360 user I/Os handle dense digital I/O without external bus expanders. Per Intel's MAX 10 reference designs, the non-volatile instant-on configuration is critical for production lines requiring immediate deterministic startup after power-on. Compared to discrete PLC cards, a single MAX 10 replaces multiple digital I/O modules.
Empfohlen
Video Interface Bridging
The 10M40DCF484C8G bridges legacy video interfaces (TTL/RGB, LVDS, MIPI-CSI) to modern displays and processors. Its 40K LEs implement color-space conversion, deinterlacing, and pixel-clock multiplication in parallel logic. The 360 user I/Os accept high-speed LVDS pairs at typical display resolutions. Per the MAX 10 datasheet, the integrated PLLs generate pixel clocks up to 150 MHz, sufficient for 1080p60 video. Compared to ASSP bridge chips, this FPGA supports multiple protocols via configuration changes without hardware redesign.
Empfohlen
Portable Medical Instrumentation
In portable medical devices, the 10M40DCF484C8G provides deterministic signal processing for ECG, pulse oximetry, and ultrasound front-end digitization. Its on-chip 12-bit ADC samples up to 17 analog channels for biosignal acquisition, and the DSP blocks implement digital filtering at sample rates exceeding 1 MSPS. Per Intel's MAX 10 datasheet, the embedded flash stores calibration coefficients and patient data securely. The non-volatile instant-on enables <10 ms boot, critical for emergency defibrillators and bedside monitors.
Empfohlen
ASIC Replacement / Low-Volume Production
For low-volume production runs (typically <10K units), the 10M40DCF484C8G serves as a cost-effective ASIC replacement. The 40K LEs accommodate gate-array-class designs that would not justify NRE on a custom ASIC. Per the MAX 10 datasheet, internal flash stores the design IP without external boot memory. Compared to ASIC NRE of $500K-$2M plus 6-month lead time, a single MAX 10 chip with $78 BOM at qty-1 reduces both NRE and time-to-market by 80-90%.
Empfohlen
Aerospace and Defense Subsystems
In aerospace and defense, the 10M40DCF484C8G provides deterministic logic with MIL-spec traceability through authorized distributors like FPGAX. Its non-volatile instant-on configuration is critical for avionics requiring guaranteed startup latency. Per Intel's MAX 10 datasheet, the device supports secure configuration via on-chip flash bitstream authentication. The 360 user I/Os interface to avionics buses (ARINC 429, MIL-STD-1553) and sensor arrays. Compared to ASICs, the FPGA offers field-upgradable IP for evolving requirements.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M40DCF484C8G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M40DCF484C7G | 10M40DCF484I7G | 10M25DCF484C8G | 10M40DCF256C8G | 10M16DCF484C8G |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (F484) | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 256-FBGA (F256) - smaller | 484-FBGA (F484) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40000 | 40000 | 40000 | 25000 | 40000 | 16000 |
| Speed Grade | C8 | C7 (faster) | I7 (industrial) | C8 | C8 | C8 |
| Temperature Grade | Commercial | Commercial | Industrial (-40C to +100C) | Commercial | Commercial | Commercial |
| Configuration Memory | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) |
Wichtigste Unterscheidungsmerkmale
- Largest logic density in MAX 10 family at C8 speed grade (vs. 10M25DCF484C8G)
- Non-volatile instant-on configuration (vs. 10M40DCF256C8G)
- Commercial temperature grade for cost-optimized designs (vs. 10M40DCF484I7G)
Designhinweise
The 484-FBGA at 1.0 mm ball pitch requires HDI PCB stack-ups with laser-drilled microvias. Per the MAX 10 hardware design guide, use at minimum a 4-layer 1+N+1 stack-up with 0.5 mm microvia pads. Full ground and power planes must be unbroken beneath the BGA to maintain power integrity and reference plane continuity for high-speed LVDS pairs. Estimated: BGA escape routing at 4 mil trace/space requires a 0.4 mm microvia capture pad - verify with PCB fabricator capability.
Decouple the 10M40DCF484C8G with bulk capacitors (47 uF or higher) per each power rail (VCCINT, VCCIO, VCCA, VCCPLL). Place 0.1 uF and 1 nF ceramic bypass capacitors within 100 mil of every power pin. Per Intel's MAX 10 pin connection guidelines, each VCCIO bank should have its own decoupling network. PLL analog supplies (VCCA_PLL) require ferrite-bead filtering from the corresponding VCCINT rail to minimize jitter.
Common pitfalls when designing with the 10M40DCF484C8G include: (1) failing to assign all unused I/O pins to a defined state (input tri-stated with weak pull-up) to avoid floating inputs during configuration; (2) neglecting JTAG chain integrity - the TCK line must be clean with proper termination; (3) exceeding the maximum LVDS data rate per I/O bank without proper slew rate and pre-emphasis configuration; (4) ignoring dual-purpose configuration pin requirements (e.g., nCONFIG, nSTATUS, CONF_DONE) which must be pulled to defined states during power-up.
Compliance-Informationen
RoHS and REACH compliant per Altera/Intel product page. AEC-Q100 not applicable - this is a commercial-grade FPGA. Halogen-free requires IMDS verification from Intel. Conflict minerals compliance verified via Intel's CMRT filing.