10M50DCF484C8G - MAX 10 FPGA, 50K LE, 484-FBGA | Intel
Teilenummer: 10M50DCF484C8G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $119.39 | $119,39 |
| 10 | $113.7 | $1.137,00 |
| 100 | $108.29 | $10.829,00 |
| 500 | $107 | $53.500,00 |
| 1.000 | $106.16 | $106.160,00 |
| 10.000 | $106.16 | $1.061.600,00 |
10M50DCF484C8G Übersicht
A field-programmable gate array (FPGA) is a programmable semiconductor device that lets engineers implement custom digital logic, glue logic, and parallel processing functions after PCB fabrication. In the broader hierarchy, an FPGA sits between microcontrollers and ASICs: more flexible than a fixed-function ASIC but more deterministic and parallel than a sequential microcontroller. MAX 10 specifically adds on-chip flash, ADC blocks, and DDR3 memory controllers that bring system-on-chip (SoC) capability to a low-power, non-volatile FPGA fabric.
Key features include up to 1,677 Kbits embedded SRAM, integrated flash configuration memory, on-die ADC blocks, support for DDR3/LPDDR3 external memory interfaces, and hardened DSP and multiplier blocks. Operating junction temperatures range from 0C to +85C (commercial grade), and the part is housed in a 23 mm × 23 mm 484-ball FBGA at 1.0 mm pitch for high-density board designs.
Technically, the 10M50DCF484C8G variant is specified at speed grade 8, with internal core voltages of 1.2V and PLL/IO banks at 2.5V/3.3V. The device supports multiple I/O standards including LVDS, LVCMOS, SSTL, and differential pairs, and integrates embedded multipliers and 18×18 hardware multipliers for high-throughput DSP operations.
Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image processing, low-cost prototyping, and bridge replacement for legacy CPLD-based designs. The combination of non-volatile configuration and high I/O count makes it well suited for designs where board space and BOM integration are priorities.
When designing with this part, allocate a minimum of four PCB layers with a dedicated ground plane to maintain signal integrity on high-speed transceivers, and follow Intel's power plane decoupling recommendations to keep internal rails within ±5% under inrush conditions.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single manufacturer datasheet page, giving procurement engineers and FPGA designers a one-stop reference for the 10M50DCF484C8G.
Drop-in-Alternativen für 10M50DCF484C8G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M50DCF484C8G (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Process Technology, Configuration Memory, Logic Elements.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M50DCF484C7G
✅ Drop-In✓ Auf Lager
$48.9 / Stück
Datenblatt ansehen →10M40DCF484C8G
✅ Drop-In✓ Auf Lager
$53.9 / Stück
Datenblatt ansehen →10M40DCF484C7G
✅ Drop-In✓ Auf Lager
$124.2 / Stück
Datenblatt ansehen →10M25DCF484C8G
✅ Drop-In✓ Auf Lager
$42.1 / Stück
Datenblatt ansehen →10M16DCF484C8G
✅ Drop-In✓ Auf Lager
$35.8 / Stück
Datenblatt ansehen →10M50DCF484C8G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Logic Elements | 50000 |
| Embedded Memory (bits) | 1677312 |
| Maximum User I/O | 360 |
| Process Technology | 55 nm CMOS |
| Core Voltage | 1.2 V |
| Speed Grade | 8 |
| Betriebstemperatur | 0C to +85C (commercial) |
| Configuration Memory | On-chip flash (non-volatile) |
| Gehäuse | 484-ball FBGA (FineLine BGA), 23 × 23 mm, 1.0 mm pitch |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| I/O Standards Supported | LVCMOS, LVTTL, LVDS, SSTL, differential pairs |
10M50DCF484C8G 484-ball fbga (fineline bga), 23 × 23 mm, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für 10M50DCF484C8G (484-ball fbga (fineline bga), 23 × 23 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M50DCF484C8G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M50DCF484C8G ist geeignet für 6 Anwendungs: Industrial Motor Control, Video Bridging and Image Processing, Factory Automation I/O Expansion, CPLD Bridge Replacement, Low-Cost Prototyping, Industrial Communication Gateways.
Industrial Motor Control
The 10M50DCF484C8G fits industrial motor control designs because its 50K logic elements and 18×18 hardware multipliers support high-resolution SVPWM calculations and field-oriented control (FOC) loops in a single device. The 360 user I/O pins accommodate multi-axis encoder feedback (LVDS), PWM channels, and current-sense ADC routing without external bus expanders. On-chip flash eliminates external configuration memory, reducing BOM count and improving mean time between failures (MTBF) in harsh factory environments. Compared with discrete MCU + CPLD architectures, integrating the control loop in this MAX 10 part reduces propagation delay for torque-loop updates below 10 µs, enabling higher switching frequencies for low-inductance PMSM motors.
Empfohlen
Video Bridging and Image Processing
The 10M50DCF484C8G's embedded M9K memory blocks (1,677,312 bits total) and hardware multipliers are well matched to mid-resolution video bridging designs such as HDMI-to-MIPI, dual-camera aggregation, and machine-vision preprocessing pipelines. The integrated DDR3 controller sustains line-buffer bandwidths up to 303 MHz without requiring an external memory controller FPGA. Designers typically instantiate color-space conversion, scaling, and frame-rate conversion in fabric while offloading simple overlay planes to dedicated logic. Compared with a microcontroller + GPU split architecture, this MAX 10 device consolidates bridging logic and color processing on one die, simplifying PCB layout and reducing EMI from high-speed parallel buses.
Empfohlen
Factory Automation I/O Expansion
With 360 user I/O pins supporting LVCMOS 1.2V through 3.3V and LVDS, the 10M50DCF484C8G serves as a programmable I/O aggregator in factory automation PLCs and distributed I/O blocks. Its non-volatile configuration means the device boots instantly on power-up with no external flash, critical for deterministic industrial protocols such as PROFINET, EtherCAT, and EtherNet/IP. The on-die ADC blocks and hardware PLLs simplify sensor conditioning for analog temperature, pressure, and flow inputs. Compared with discrete 74-series logic and CPLDs, consolidating I/O expansion in this MAX 10 part reduces board area by roughly 40% while supporting real-time protocol timestamp stamping at sub-microsecond resolution.
Empfohlen
CPLD Bridge Replacement
The 10M50DCF484C8G is widely used as a drop-in upgrade for aging CPLD-based glue-logic boards. With 50K logic elements versus typical 5K-LE CPLD densities, designers can consolidate multiple CPLDs into a single device while adding soft-core processors (Nios V) and protocol IP. The integrated flash and on-chip ADC blocks remove several companion ICs from the BOM. Compared with legacy MAX II/MAX V CPLD designs, porting to this MAX 10 part typically reduces component count by 30-50% and enables in-system reprogramming via JTAG without external proms. Designers should re-validate pin assignments in the CF484 ball-map because MAX 10 bank voltages differ from legacy CPLD families.
Empfohlen
Low-Cost Prototyping
For prototype builds and university teaching labs, the 10M50DCF484C8G's combination of high logic density, DDR3 support, and free Quartus Prime Lite software makes it an excellent learning platform. Students can implement RISC-V soft cores, simple video pipelines, or DSP algorithms without investing in expensive high-speed transceivers found in larger Cyclone or Arria families. The non-volatile flash allows instant-on demonstrations without bootloader delays. Compared with ASIC prototyping on Cyclone V or Stratix 10, this MAX 10 part is roughly one-tenth the unit cost, making it ideal for classroom use where dozens of boards are deployed simultaneously.
Empfohlen
Industrial Communication Gateways
The 10M50DCF484C8G is well suited for industrial protocol gateway designs (Modbus TCP, PROFINET, EtherCAT, and serial-to-Ethernet conversion). Its 50K logic elements allow simultaneous instantiation of multiple protocol stacks with hardware-accelerated CRC engines, while 360 I/O pins support RS-485, RS-232, CAN, and Ethernet PHY connections without external transceivers. The integrated flash and hardened PLLs enable deterministic boot times under 50 ms, essential for hot-swap industrial backplane applications. Compared with discrete MCU + ASIC gateway designs, this MAX 10 device consolidates routing, protocol bridging, and timestamping in a single programmable device, reducing certification effort for IEC 61508 SIL 2 designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M50DCF484C8G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M50DCF484C7G | 10M40DCF484C8G | 10M40DCF484C7G | 10M25DCF484C8G | 10M16DCF484C8G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (CF484) | 484-FBGA (CF484) - same | 484-FBGA (CF484) - same | 484-FBGA (CF484) - same | 484-FBGA (CF484) - same | 484-FBGA (CF484) - same |
| Logic Elements | 50000 | 50000 | 40000 | 40000 | 25000 | 16000 |
| Speed Grade | 8 | 7 | 8 | 7 | 8 | 8 |
| Maximum User I/O | 360 | 360 | 360 | 360 | 360 | 360 |
| Embedded SRAM (bits) | 1677312 | 1677312 | 1340928 | 1340928 | 837888 | 536256 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
Wichtigste Unterscheidungsmerkmale
- Highest-density MAX 10 variant in the 484-FBGA package (vs. 10M40DCF484C8G)
- Pin-compatible down-grade path for cost-sensitive designs (vs. 10M25DCF484C8G)
- Non-volatile on-chip flash eliminates external configuration memory (vs. CPLD-based legacy designs)
Designhinweise
Use a minimum of six PCB layers for the 10M50DCF484C8G with dedicated ground and 1.2V core power planes. Route all 360 user I/O signals on inner layers with continuous reference planes to maintain return-path continuity. Place all decoupling capacitors (100 nF, 10 µF bulk) within 5 mm of the BGA balls to suppress transient inrush during configuration. The 1.0 mm ball pitch requires laser-drilled micro-vias and 0.4 mm pad-to-pad clearance for reliable assembly.
Although MAX 10 devices do not have explicit junction-to-ambient thermal resistance data sheets in the public datasheet, estimated power consumption at 50% toggle rate is 1.2W typical. Estimated: with ambient 25C and TJ max 100C commercial, the minimum required thermal resistance is roughly 62.5 C/W. For enclosed industrial enclosures, provide at least 4 CFM of forced airflow or attach a small top-side heatsink.
Do not assume the 10M50DCF484C8G and 10M50DCF484C7G are bit-identical timing parts. Speed grade 8 is slower than speed grade 7 in MAX 10 nomenclature, so maximum Fmax targets must be re-validated using Quartus Prime TimeQuest. Also note that the 'I' suffix (industrial, -40C to +100C) is NOT pin-compatible with the 'C' suffix without re-checking I/O bank voltage limits; industrial parts often have different VCCIO tolerances than commercial parts.
Compliance-Informationen
RoHS compliant per Intel product page. Not AEC-Q100 qualified - this is an FPGA, not an automotive-grade analog IC. Industrial-temperature variants (suffix 'I') are available for harsh-environment applications but are NOT AEC-Q100 certified.
