10M40DAF672I7G - MAX 10 FPGA 40K LE, 672-BGA | Intel
Teilenummer: 10M40DAF672I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $109.75 | $109,75 |
| 10 | $98.77 | $987,70 |
| 100 | $87.8 | $8.780,00 |
| 500 | $76.82 | $38.410,00 |
| 1.000 | $65.85 | $65.850,00 |
10M40DAF672I7G Übersicht
What is a MAX 10 FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect, allowing hardware functionality to be defined after manufacturing. MAX 10 is Intel's non-volatile, instant-on FPGA family positioned between CPLDs and traditional SRAM FPGAs; it integrates flash configuration memory on-chip so designs load at power-up without an external boot PROM. The MAX 10 family belongs to the broader hierarchy of programmable logic devices (PLD) and is widely used for I/O expansion, bridging, motor control, and industrial glue logic.
Key features of the 10M40DAF672I7G include 40K logic elements, 1.29 Mbit embedded SRAM, 4 Mb user flash, an integrated ADC, dual-configuration flash, and DSP blocks that deliver up to 156 GMACs of fixed-point performance. The -I7G speed/temperature grade specifies an industrial junction range with the 7 speed bin, suitable for fanless industrial enclosures. The 672-ball FBGA package supports the high I/O count needed for parallel bus bridging, video aggregation, and multi-protocol industrial networking.
The MAX 10 architecture combines a logic fabric, embedded 18x18 multipliers, and hard memory controllers. The on-chip flash also enables user-accessible storage for firmware, calibration constants, or soft-core configuration images, which is unique in its class and eliminates the external SPI flash typically required by SRAM FPGAs.
Typical applications include industrial machine vision, motor and motion control, multi-protocol bridging (EtherCAT, PROFINET, EtherNet/IP), test and measurement front-ends, and portable medical or point-of-sale terminals. The integrated ADC and DSP blocks also suit sensor aggregation nodes.
When designing, plan power sequencing carefully: MAX 10 devices support single-supply operation but require proper decoupling and a clean POR ramp. Quartus Prime is the supported toolchain. The 672-BGA requires a 4+ layer PCB with microvia technology for fan-out.
This page synthesizes distributor pricing, same-package MAX 10 alternative OPNs, and practical design notes not found in the standalone datasheet PDF.
Drop-in-Alternativen für 10M40DAF672I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M40DAF672I7G (gleiche Bauform und Footprint) – abweichend in Package, Configuration Memory, Operating Temperature, Integrated ADC, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M40DAF672C8G
✅ Drop-In✓ Auf Lager
$86.1 / Stück
Datenblatt ansehen →10M40DAF672C7G
✅ Drop-In✓ Auf Lager
$67.2 / Stück
Datenblatt ansehen →10M40DAF672I7G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Logic Elements | 40,000 |
| Embedded Memory | 1,290,240 bits |
| User I/Os | 500 |
| Gehäuse | 672-ball FBGA |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Speed Grade | 7 |
| Temperature Grade | Industrial (I) |
| Configuration | Internal flash (non-volatile, instant-on) |
| Integrated ADC | Yes (12-bit, 1 Msps) |
| DSP Blocks | Yes (18x18 multipliers) |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 |
| RoHS-Status | Compliant |
| Montageart | Surface Mount (BGA) |
10M40DAF672I7G 672-ball fbga Pinbelegungsleitfaden
Pinbelegung für 10M40DAF672I7G (672-ball fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M40DAF672I7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M40DAF672I7G ist geeignet für 7 Anwendungs: Industrial Machine Vision, Multi-Axis Motor and Motion Control, Industrial Protocol Bridging, Test and Measurement Front-End, Portable Point-of-Sale Terminals, Sensor Aggregation and IoT Gateways, LED Video Wall Controllers.
Industrial Machine Vision
The 10M40DAF672I7G suits industrial machine vision systems where Camera Link or MIPI CSI-2 aggregation requires wide parallel interfaces. With 500 user I/Os, the FPGA can capture multiple image sensor lanes simultaneously while running defect-detection pipelines in DSP blocks. The integrated 12-bit 1 Msps ADC supports auxiliary illumination control and analog sensor monitoring on the same PCB. Unlike smaller MAX 10 densities (10M08, 10M16), the 10M40 tier provides headroom for convolutional pre-filters and Bayer-to-RGB conversion, reducing load on the downstream CPU.
Empfohlen
Multi-Axis Motor and Motion Control
The 10M40DAF672I7G is well matched to multi-axis motion controllers driving stepper or servo drives over EtherCAT, PROFINET, or EtherNet/IP. The 40K-LE fabric runs multiple PID loops concurrently, while 500 I/Os handle encoder feedback, limit-switch inputs, and PWM outputs across 4-6 axes. MAX 10 instant-on behavior ensures the drive is ready within milliseconds of power-up, critical for safety-rated machinery. The integrated ADC simplifies analog current sensing, eliminating an external ADC IC and reducing BOM cost.
Empfohlen
Industrial Protocol Bridging
The 10M40DAF672I7G acts as a high-speed bridge between industrial fieldbusses such as EtherCAT, PROFINET, Modbus TCP, and legacy RS-485/Profibus. The 1.29 Mbit embedded memory buffers protocol frames without external SRAM for most use cases, and the 500 I/Os support multiple isolated PHY interfaces on the same board. Quartus Prime reference designs for EtherCAT and PROFINET slaves target the MAX 10 family, accelerating development. The non-volatile configuration eliminates boot delays typical of SRAM FPGAs.
Empfohlen
Test and Measurement Front-End
The 10M40DAF672I7G is suitable as a flexible front-end for test and measurement equipment. The 500 user I/Os, many of which support LVDS, enable parallel ADC/DAC interfacing with sub-nanosecond skew matching. The DSP blocks run FFTs and digital down-conversion in real time, freeing the host CPU for analysis. MAX 10 instant-on allows the instrument to be ready immediately at power-up. The integrated 12-bit ADC handles auxiliary analog monitoring such as temperature or supply rail telemetry on the same PCB.
Empfohlen
Portable Point-of-Sale Terminals
The 10M40DAF672I7G supports POS terminals that need display aggregation, secure keypad handling, and multi-protocol connectivity. The on-chip user flash stores firmware and encryption keys safely, while the 500 I/Os drive LCD panels, NFC readers, and thermal printers concurrently. Industrial temperature grade (-40C to +100C junction) tolerates harsh retail environments. Although the 10M40 power budget is higher than smaller MAX 10 densities, mains-powered countertop POS terminals are well within thermal limits.
Empfohlen
Sensor Aggregation and IoT Gateways
The 10M40DAF672I7G fits industrial IoT gateways aggregating multiple sensor types (analog, digital, serial, and bus-based). The integrated 12-bit ADC samples analog sensors directly, eliminating external ADC ICs. The 1.29 Mbit embedded memory buffers data during cloud transmission, and the 500 I/Os support many concurrent UART/SPI/I2C channels. The non-volatile flash enables over-the-air update staging with dual-configuration boot for fallback safety. Industrial temperature grade ensures reliable operation in factory-floor enclosures.
Empfohlen
LED Video Wall Controllers
The 10M40DAF672I7G drives small-to-medium LED video walls where its 500 I/Os provide enough LVDS lanes to drive multiple GCLK scan-board panels. DSP blocks perform brightness correction and gamma mapping in real time, and the 1.29 Mbit embedded memory holds frame buffers for several panels. The non-volatile instant-on boot eliminates visible reconfiguration flashes on power-up, important for commercial display installations. The industrial temperature grade handles enclosed display cabinet environments with limited airflow.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M40DAF672I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M40DAF672C8G | 10M40DAF672C7G |
|---|---|---|---|
| Brand | Intel | Intel | Intel |
| Package | 672-ball FBGA | 672-ball FBGA (same) | 672-ball FBGA (same) |
| Logic Elements | 40,000 | 40,000 | 40,000 |
| Embedded Memory | 1,290,240 bits | 1,290,240 bits | 1,290,240 bits |
| User I/Os | 500 | 500 | 500 |
| Speed Grade | 7 | 8 (faster) | 7 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Configuration Type | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) |
| Integrated ADC | 12-bit, 1 Msps | 12-bit, 1 Msps | 12-bit, 1 Msps |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade with high-density I/O (vs. 10M40DAF672C8G)
- Non-volatile instant-on configuration (vs. Cyclone IV EP4CE40F29 (SRAM FPGA, 780-pin BGA))
- Integrated 12-bit ADC and DSP blocks (vs. CPLD-only solutions (e.g. EPM240))
Designhinweise
The 672-ball FBGA uses a 1.0 mm pitch. Use a 4+ layer PCB with laser-drilled microvias (stacked or staggered) to fan out from inner balls. Maintain a continuous ground plane beneath the device to provide low-impedance return paths for high-speed LVDS pairs. Length-match differential pairs (typically within 150 mil) and reference each layer to an unbroken ground plane to control impedance (100 ohm differential for LVDS). Avoid routing signals across plane splits.
MAX 10 FPGAs require a clean power-on-reset (POR) ramp on VCCINT (1.2 V core). Use a sequenced power supply or a supervisor IC to ensure VCCA (2.5 V analog) and VCCIO (per-bank) come up within the datasheet-defined windows. Place 0.1 uF and 10 uF decoupling capacitors within 100 mil of each power pin. Estimated: total core current at 40K LE utilization with 100 MHz operation can exceed 500 mA; verify thermal dissipation via the Quartus Prime Early Power Estimator before finalizing the design.
Do not confuse the MAX 10 I7G temperature grade with AEC-Q100 automotive qualification; MAX 10 devices are not AEC-Q100 qualified. For automotive designs, verify compliance with a separate AEC-Q100 component. Also note that dual-configuration flash supports two images, but image-switch on boot-failure requires correct CFM0/CFM1 programming via the Quartus Programmer. Finally, JTAG chain integrity must be verified on the assembled board before production programming.
Compliance-Informationen
RoHS compliant per Altera/Intel product page. MSL 3 per Vyrian listing. Not AEC-Q100 qualified - do not use in automotive safety-critical designs without separate verification. Halogen-free status not explicitly stated in the verified web data.