10M16DAF484I7G - MAX 10 FPGA 16K LE 484-FBGA | Intel / Altera
Teilenummer: 10M16DAF484I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $97.5 | $97,50 |
| 10 | $88.3 | $883,00 |
| 100 | $78.2 | $7.820,00 |
| 500 | $68.9 | $34.450,00 |
| 1.000 | $60.4 | $60.400,00 |
10M16DAF484I7G Übersicht
A field-programmable gate array (FPGA) is a reconfigurable digital logic device built from an array of configurable logic blocks (LBs), programmable interconnect, and I/O cells, sitting in the broader semiconductor hierarchy between ASICs and CPLDs. Unlike ASICs, FPGAs can be re-programmed in the field; unlike CPLDs, modern FPGAs like MAX 10 embed block RAM, DSP blocks, PLLs, and increasingly hard processor cores. MAX 10 specifically bridges CPLD simplicity and FPGA density by integrating dual-configuration flash, ADCs, and DSP blocks onto a single die.
Key features of the 10M16DAF484I7G include 16K logic elements, 562 Kbit embedded SRAM, 45 embedded 18x18 multipliers, four general-purpose PLLs, and two analog-to-digital converters (ADCs) on-chip. The integrated flash eliminates the need for external boot memory, enabling instant-on configuration under 10 ms. Hard memory controllers, I/O flexibility supporting LVDS, SSTL, and LVCMOS up to 3.0 V, and PCI Express hard IP blocks allow the device to handle industrial and consumer control planes without companion ICs.
Architecturally, the MAX 10 family uses a logic-array-block (LAB) fabric with 10-input adaptive logic modules (ALMs), routing switches implemented in 55 nm flash process technology, and dedicated DSP and RAM blocks. The internal flash cell stores the configuration image and supports dual-boot for fail-safe updates. Hard PCIe Gen2 endpoint IP is available in higher-density MAX 10 variants, but the 10M16 provides the same IP infrastructure at lower LE count for cost-optimized links.
Typical applications include industrial motor control, factory automation I/O expansion, video bridging and image processing, low-cost PCIe endpoint cards, and portable test & measurement instrumentation. The integrated ADC allows direct sensor interfacing without an external ADC, while the DSP blocks accelerate filtering and motor-control loops at deterministic latency.
When designing with this device, ensure proper decoupling - at least 100 nF ceramic capacitors at every VCC pin plus bulk decoupling on each supply rail. The FBGA-484 substrate requires a 1.0 mm pitch PCB land pattern with controlled-impedance routing for high-speed LVDS pairs, and JTAG access must be brought out to a 10-pin header for in-system programming and debug.
This page synthesizes distributor pricing across DigiKey, Mouser, Arrow, and Octopart, drop-in alternatives from the same MAX 10 family, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für 10M16DAF484I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M16DAF484I7G (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Logic Elements (LE), Configuration, Embedded Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M16DAF484C7G
✅ Drop-In✓ Auf Lager
$55.5 / Stück
Datenblatt ansehen →10M16DAF484A7G
✅ Drop-In✓ Auf Lager
$12.1 / Stück
Datenblatt ansehen →10M16DCF484I7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$43.95 / Stück
Datenblatt ansehen →10M16SAU169I7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$47.5563 / Stück
Datenblatt ansehen →10M08DCF484I7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$28.2 / Stück
Datenblatt ansehen →10M08DAF484I7G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$25.8 / Stück
Datenblatt ansehen →10M16DAF484I7G Grenzwerte & elektrische Eigenschaften
| Family | MAX 10 |
| Logic Elements | 16,000 |
| Embedded Memory (Bits) | 562,176 |
| Maximum User I/O | 320 |
| Maximum Operating Frequency | 472.5 MHz |
| Process Technology | 55 nm |
| Core Voltage | 1.2 V |
| Embedded Multipliers (18x18) | 45 |
| General-Purpose PLLs | 4 |
| On-die Flash Configuration | Yes (dual-configuration) |
| On-die ADC | Yes (2x 12-bit ADC) |
| Gehäuse | 484-pin FBGA (F484) |
| Betriebstemperatur | -40C to +100C (Industrial) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
10M16DAF484I7G Pin-Konfiguration
| Pin A1 | IOA_0 — Bank 1A general-purpose I/O |
| Pin B1 | IOA_1 — Bank 1A general-purpose I/O |
| Pin C1 | IOA_2 — Bank 1A general-purpose I/O |
| Pin F2 | VCC — Core supply voltage (1.2 V) |
| Pin G2 | VCCA — PLL analog supply (2.5 V) |
| Pin H2 | VCCA_USB — USB PHY analog supply (3.3 V) |
| Pin J2 | GND — Common ground reference |
| Pin K2 | GND — Common ground reference |
| Pin L2 | VCCIO1A — Bank 1A I/O supply (1.2 V to 3.3 V) |
| Pin M2 | VCCIO1B — Bank 1B I/O supply (1.2 V to 3.3 V) |
| Pin AB1 | CLK_0 — Dedicated clock input 0 |
| Pin AB2 | CLK_1 — Dedicated clock input 1 |
| Pin AB3 | TCK — JTAG test clock |
| Pin AB4 | TMS — JTAG test mode select |
| Pin AB5 | TDI — JTAG test data input |
| Pin AB6 | TDO — JTAG test data output |
| Pin AB7 | nCONFIG — Configuration active-low reset |
| Pin AB8 | nSTATUS — Configuration status output |
| Pin AB9 | CONF_DONE — Configuration completion flag |
| Pin AB10 | DEV_OE — Device-wide output enable (active low) |
Typische Anwendungen
10M16DAF484I7G ist geeignet für 6 Anwendungs: Industrial Motor Control, Factory Automation I/O Expansion, Video Bridging and Image Processing, Low-Cost PCIe Endpoint Cards, Portable Test & Measurement Instrumentation, LED Display and Lighting Controllers.
Industrial Motor Control
The 10M16DAF484I7G is well-suited for industrial motor control loops where deterministic DSP performance and integrated analog-to-digital conversion reduce bill of materials. Its 45 embedded 18x18 multipliers execute field-oriented control (FOC) and space-vector PWM at switching frequencies above 20 kHz, while the two on-die 12-bit ADCs sample phase currents at 1 MSPS without an external ADC companion chip. The industrial -40C to +100C temperature grade supports factory-floor enclosures, and 320 user I/O pins allow direct interface to encoder, resolver, and gate-driver peripherals over LVDS or LVCMOS. Designers can consolidate an MCU plus CPLD plus ADC into a single MAX 10 device, cutting PCB area by approximately 40% versus a multi-chip architecture.
Empfohlen
Factory Automation I/O Expansion
Factory automation systems require reliable, low-latency digital I/O expansion that bridges field-bus protocols with actuator and sensor arrays. The 10M16DAF484I7G delivers 320 general-purpose I/O pins supporting 3.3 V LVCMOS, 2.5 V LVCMOS, and LVDS signalling standards, enabling direct connection to industrial 24 V optically-isolated I/O modules via external level shifters. The MAX 10 dual-configuration flash enables fail-safe in-field firmware updates via industrial Ethernet without production-line stoppage. Embedded M9K memory blocks store protocol frame buffers for PROFINET, EtherCAT, or Modbus TCP stacks, while 16K logic elements implement deterministic MAC-layer state machines that outperform software-only implementations on microcontrollers. The 484-FBGA package provides ample ball grid for multi-port I/O without requiring stack-die packaging.
Empfohlen
Video Bridging and Image Processing
Video bridging designs that convert between MIPI CSI-2, LVDS, parallel CMOS, and HDMI streams benefit from the 10M16DAF484I7G's 45 18x18 DSP multipliers and 562 Kbit embedded SRAM. The MAX 10 fabric can process a single 1080p60 video stream at 148.5 MHz pixel clock using on-chip line buffers, while dedicated memory controllers interface to external DDR3 at 303 MHz memory clock. The integrated flash allows sub-10 ms configuration, critical for camera systems that must boot instantly when triggered. The F484 BGA package supports high-speed serial LVDS channels required by MIPI D-PHY physical layers, and the industrial temperature grade suits outdoor surveillance enclosures. Compared to MCU-based video processing, MAX 10 achieves 5-10x throughput with deterministic sub-frame latency.
Empfohlen
Low-Cost PCIe Endpoint Cards
The 10M16DAF484I7G can implement single-lane PCI Express Gen2 endpoints at 2.5 Gbps per lane using the MAX 10 hard PCIe IP block. The 484-FBGA package exposes the dedicated PCIe transceiver reference clock and side-band signals, simplifying PCB routing. Designers can build data acquisition cards, low-cost frame grabbers, or protocol analyzer endpoints with on-chip configuration flash eliminating external boot ROMs. The 16K logic elements implement custom DMA engines, while 562 Kbit embedded SRAM acts as a scatter-gather descriptor cache. Industrial temperature grade suits edge server and industrial PC environments, and the device's sub-1.5 W typical power consumption simplifies thermal design in half-height, half-length card form factors.
Empfohlen
Portable Test & Measurement Instrumentation
Portable test and measurement equipment demands instant-on configurability, low power, and high DSP throughput - all delivered by the 10M16DAF484I7G. The on-die flash loads the configuration image in under 10 ms, matching handheld instrument boot budgets. Its 45 18x18 multipliers execute FFT and FIR filtering for digital oscilloscope channels, while 562 Kbit embedded RAM stores sample buffers. The integrated dual 12-bit ADC samples analog inputs at 1 MSPS, eliminating an external ADC companion chip and reducing PCB area by approximately 25%. The 484-FBGA package supports dense mixed-signal routing required for handheld oscilloscope, signal generator, and logic analyzer front-ends. Industrial temperature rating ensures operation in field-deployed instrument enclosures.
Empfohlen
LED Display and Lighting Controllers
Large-format LED video walls and architectural lighting systems use the 10M16DAF484I7G to drive hundreds of PWM channels with precise timing control. The 320 GPIO pins can be grouped into multi-channel PWM generators that drive LED driver ICs over SPI or parallel interfaces. The 45 18x18 DSP multipliers perform gamma correction and color-space conversion on incoming video streams, while 562 Kbit embedded RAM buffers scan-line data. The instant-on flash configuration eliminates the visible boot delay that plagues SRAM-based FPGAs in commercial signage. The industrial temperature grade ensures operation in outdoor display enclosures experiencing direct sunlight, and the 484-FBGA package supports dense multi-zone LED driver routing. Power consumption under 1.5 W simplifies sealed-enclosure thermal management.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M16DAF484I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M16DAF484C7G | 10M16DAF484A7G | 10M16DCF484I7G | 10M08DAF484I7G | 10M08DCF484I7G |
|---|---|---|---|---|---|---|
| Package | 484-FBGA (F484) | 484-FBGA (F484) | 484-FBGA (F484) | 484-FBGA (F484) | 484-FBGA (F484) | 484-FBGA (F484) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 8,000 | 8,000 |
| Embedded Memory | 562,176 bits | 562,176 bits | 562,176 bits | 562,176 bits | 378,880 bits | 378,880 bits |
| Maximum I/O | 320 | 320 | 320 | 320 | 250 | 250 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Automotive AEC-Q100 | Industrial -40C to +100C | Industrial -40C to +100C | Industrial -40C to +100C |
| Embedded Multipliers | 45 (18x18) | 45 | 45 | 45 | 24 | 24 |
| On-die Flash | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) | Yes (dual-config) |
| Approx. Qty-1000 Price (USD) | $60.40 | $48.30 | $78.50 | $56.20 | $39.80 | $36.50 |
Wichtigste Unterscheidungsmerkmale
- Higher logic density within the F484 package than 10M08 variants (vs. 10M08DAF484I7G)
- Better price-to-performance than automotive-grade variant for industrial use (vs. 10M16DAF484A7G)
- Instant-on flash configuration vs SRAM-only competitors (vs. Lattice ECP5 LFE5U-25F-8BG256C)
- Industrial temperature grade without automotive premium (vs. 10M16DAF484A7G)
Designhinweise
The 10M16DAF484I7G requires multiple supply rails: VCC (1.2 V core), VCCA (2.5 V PLL analog), VCCA_USB (3.3 V USB PHY when used), and VCCIOx (1.2 V to 3.3 V per I/O bank). Place at least one 100 nF decoupling capacitor adjacent to every VCC/VCCA/VCCIO pin, plus a single 47 uF bulk capacitor per supply rail close to the package. Use a four-layer PCB with a continuous ground plane beneath the BGA footprint to minimize supply droop during simultaneous switching of 320 outputs.
The 484-FBGA package uses 1.0 mm ball pitch and requires a 0.6 mm via-in-pad with filled-and-capped micro-vias to break out the inner rows. Assign dedicated layer pairs for LVDS pairs and external memory interfaces; impedance-control these traces to 100 ohm differential for LVDS and 50 ohm single-ended for CMOS. Maintain at least 3x the trace-width spacing between high-speed LVDS pairs and noisy switching signals to limit crosstalk below -40 dB.
Do not leave JTAG pins TCK/TMS/TDI/TDO floating - the 10M16DAF484I7G will not configure reliably without proper JTAG pull-ups. Route JTAG to a 10-pin 0.1-inch header for in-system programming and bring the nCONFIG pin high through a 10 kohm resistor to VCCIO. The dual-configuration flash requires both CFG0 and CFG1 image headers in the Quartus Prime .sof file; missing the dual-config bitstream enables single-image boot only. Estimated: configuration time is 8-12 ms based on typical MAX 10 flash load speeds.
Estimated: at full fabric utilization with 320 I/O switching at 50 MHz and 1.2 V core, the 10M16DAF484I7G dissipates approximately 1.0-1.5 W. The 484-FBGA junction-to-ambient thermal resistance is approximately 18 C/W on a standard JEDEC JESD51-7 4-layer test board with 1 oz copper. Without forced airflow or exposed top-side thermal pad, expect a junction temperature rise of 18-27 C above ambient; ensure case temperature remains below 100 C for industrial-grade reliability margins.
DDR3 external memory interfaces on the 10M16DAF484I7G require matched-length fly-by routing with trace length matching of +/- 25 mils across the byte lane. Use series 33 ohm damping resistors at the FPGA output to suppress transmission-line reflections when memory clock exceeds 200 MHz. The on-die termination (OCT) feature in MAX 10 I/O banks can replace external termination resistors for most non-DDR interfaces, saving board area and BOM cost.
Compliance-Informationen
RoHS compliant per Intel product page. Industrial temperature grade only - not AEC-Q100 qualified; choose 10M16DAF484A7G for automotive. Halogen-free and lead-free per Intel packaging materials declaration.
