10M40DCF672I7G - MAX 10 FPGA, 40K LEs, 1.29Mb, 672-FBGA | Intel
Teilenummer: 10M40DCF672I7G ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $100.82 | $100,82 |
| 10 | $95.78 | $957,80 |
| 100 | $87.45 | $8.745,00 |
| 500 | $79.2 | $39.600,00 |
| 1.000 | $72.65 | $72.650,00 |
10M40DCF672I7G Übersicht
What is an FPGA? A field-programmable gate array is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs) connected by a programmable interconnect, with I/O cells on the periphery and dedicated hardware such as block RAM, DSP blocks, PLLs, and (in modern devices) hard memory controllers, transceivers, or processor cores. FPGAs sit above microcontrollers and ASICs in the digital design hierarchy: like an MCU they are software-defined at run-time via a bitstream, but unlike an MCU they achieve deterministic parallelism and can be re-architected on a per-product basis. The MAX 10 family in particular is the lowest-cost, non-volatile single-chip FPGA Intel/Altera offers, integrating a flash configuration cell on-die so no external boot PROM is required.
Key features of the 10M40DCF672I7G include 40K logic elements, 2,500 Kbits (Kb) of embedded SRAM (M9K blocks), 144 (18x18) multipliers, 4 PLLs, 16 global clock networks, and integrated dual-configuration flash with instant-on support. The 672-FBGA package exposes the maximum 500 user I/Os of any MAX 10 device and supports LVDS, LVTTL, LVCMOS, SSTL, and other single-ended and differential I/O standards at up to 400 MHz. Hard memory controllers (DDR3, LPDDR2) and an ADC block are integrated into the die. The non-volatile nature allows instant-on behavior in < 10 ms from power-valid, eliminating external boot memory and reducing BOM cost. The 55 nm process delivers a favorable cost / power / performance balance for volume production.
Typical applications span factory automation controllers, industrial machine vision, motor control co-processors, low-cost software-defined radios, test and measurement front-ends, video bridging, IoT edge nodes, and automotive driver-assistance subsystems. In each case the 10M40DCF672I7G acts as a flexible glue / accelerator between a host MCU/MPU and high-speed peripherals, offloading deterministic parallel DSP and LVDS processing that a microcontroller cannot execute in real time.
When designing with this device, allocate sufficient PCB real-estate for the 1.0 mm pitch FBGA-672 footprint, supply all required decoupling capacitors per the Intel pin connection guidelines, and validate the LVDS and DDR3 interface signal-integrity with IBIS models before layout freeze.
This page synthesizes distributor pricing, same-package drop-in alternatives from the MAX 10 family, and design notes that complement, but do not replace, the manufacturer datasheet.
Drop-in-Alternativen für 10M40DCF672I7G – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 10M40DCF672I7G (gleiche Bauform und Footprint) – abweichend in Package, Configuration Memory, Operating Temperature, Speed Grade, Integrated ADC.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
10M40DCF672C8G
✅ Drop-In✓ Auf Lager
$60.4 / Stück
Datenblatt ansehen →10M40DCF672C7G
✅ Drop-In✓ Auf Lager
$83.57 / Stück
Datenblatt ansehen →10M40DAF672I7G
✅ Drop-In✓ Auf Lager
$65.85 / Stück
Datenblatt ansehen →10M40DAF672C8G
✅ Drop-In✓ Auf Lager
$86.1 / Stück
Datenblatt ansehen →10M40DAF672C7G
✅ Drop-In✓ Auf Lager
$67.2 / Stück
Datenblatt ansehen →10M40DCF672I7G Grenzwerte & elektrische Eigenschaften
| Product Family | MAX 10 |
| Logic Elements (LEs) | 40,000 |
| Embedded Memory (M9K blocks) | 2,500 Kbits |
| Embedded User Flash | 1,290,240 bits |
| User I/O Count (max) | 500 |
| Multipliers (18x18) | 144 |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Process Node | 55 nm |
| Core Supply Voltage | 1.2 V |
| Betriebstemperaturbereich | -40 C to +100 C (industrial) |
| Gehäuse | 672-ball FBGA (1.0 mm pitch) |
| Montageart | Surface Mount |
| MSL-Level | 3 |
| Configuration Memory | On-die flash (non-volatile, dual-image) |
| Hard Memory Controller | DDR3 / LPDDR2 (integrated) |
| On-die ADC | Yes (1 MSPS, 12-bit equivalent) |
10M40DCF672I7G 672-ball fbga (1.0 mm pitch) Pinbelegungsleitfaden
Pinbelegung für 10M40DCF672I7G (672-ball fbga (1.0 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 10M40DCF672I7G.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
10M40DCF672I7G ist geeignet für 6 Anwendungs: Industrial Motor Control Co-processor, Machine Vision Camera Bridge, Software-Defined Radio Front-End, Test and Measurement Instrument Front-End, Industrial IoT Edge Node, Display and Video Bridging.
Industrial Motor Control Co-processor
The 10M40DCF672I7G's 40K logic elements, 144 (18x18) multipliers, and 4 PLLs make it a natural fit for FOC (field-oriented control) motor co-processing paired with an MCU. With 500 user I/Os in the FBGA-672 package, the device can drive multiple resolver-to-digital converters, gate-drive PWM channels, and incremental encoder interfaces simultaneously. Designers place the MAX 10 between a host STM32 or similar MCU and the power stage, offloading the deterministic 50 us current-loop math. Industrial -40 C to +100 C operation and on-die flash (no external boot PROM) cut BOM count and enable instant-on safety interlocks after power-up.
Empfohlen
Machine Vision Camera Bridge
Pairing the 10M40DCF672I7G with image sensors such as the Aptina MT9P031 or Sony IMX264 requires multi-channel LVDS bridging, exposure-timing generation, and pixel-pipeline preprocessing that microcontrollers cannot execute in real time. The MAX 10's integrated LVDS transceivers, 16 global clock networks, and 2,500 Kbits of embedded M9K memory let it buffer one full HD line for edge-detection or histogram preprocessing before forwarding compressed frames over GigE Vision or USB3 Vision. Industrial temperature grade (-40 C to +100 C) tolerates factory-floor thermal stress, and the 672-ball FBGA's 500 I/Os support MIPI CSI-2 and parallel LVCMOS inputs in parallel.
Empfohlen
Software-Defined Radio Front-End
The 10M40DCF672I7G's 144 (18x18) DSP multipliers and 4 PLLs deliver enough signal-processing bandwidth for narrow-band SDR front-ends up to 50 MHz of instantaneous bandwidth. The device digitizes I/Q data from an external ADC, performs channelization, filtering, and demodulation (FM, AM, GMSK, or simple PSK), and presents decoded audio/data packets to a host CPU via SPI or UART. The 500 I/Os in the FBGA-672 support direct ADC/DAC connections and multiple antenna switches. Compared with a host-MCU DSP approach, the MAX 10 reduces latency from milliseconds to microseconds at the same BOM cost.
Empfohlen
Test and Measurement Instrument Front-End
For low-cost bench instruments such as protocol analyzers, arbitrary waveform generators, or LCR meters, the 10M40DCF672I7G provides protocol state machines, custom timing generation, and DSP pre-processing that commercial MCUs cannot deliver. The 40K LEs and 1.29 Mbit user flash hold calibration coefficients and personality firmware, while 500 user I/Os enable direct connection to ADC/DAC front-ends, LCD displays, and rotary encoders. Industrial temperature grade and on-die flash (no boot memory) reduce field failures and field-replaceable unit costs.
Empfohlen
Industrial IoT Edge Node
The 10M40DCF672I7G's instant-on non-volatile boot (under 10 ms from power-valid), on-die ADC, and integrated PLLs make it ideal for industrial IoT edge nodes that wake on alarm, sample sensors, and transmit telemetry. The 40K LEs can host Modbus TCP, EtherCAT slave, or IO-Link master stacks concurrently, while the 500 I/Os of the FBGA-672 interface to multiple sensor buses (RS-485, CAN, I2C, SPI). The 1.29 Mbit user flash holds configuration and node identity securely on-die, reducing attack surface compared with external SPI flash.
Empfohlen
Display and Video Bridging
Bridging LVDS / RGB / MIPI DSI display panels to a host GPU often requires a flexible timing controller that off-the-shelf scalers cannot deliver. The 10M40DCF672I7G, with its 500 I/Os and integrated LVDS transceivers, can be programmed to accept one display protocol and emit another with custom color-space conversion and gamma correction. The 2,500 Kbits of embedded M9K memory buffer up to one full HD line of pixel data, while the 40K LEs run scaling / deinterlacing algorithms in hardware. Industrial temperature operation and instant-on boot suit automotive and kiosk applications.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 10M40DCF672I7G – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 10M40DCF672C8G | 10M40DCF672C7G | 10M40DAF672I7G | 10M40DAF672C8G | 10M40DAF672C7G |
|---|---|---|---|---|---|---|
| Package | 672-ball FBGA | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same | 672-ball FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 |
| User Flash | 1.29 Mbit (dual-image) | 1.29 Mbit (dual-image) | 1.29 Mbit (dual-image) | Smaller (single-image DA) | Smaller (single-image DA) | Smaller (single-image DA) |
| Temperature Grade | Industrial -40 to +100 C | Commercial 0 to +85 C | Commercial 0 to +85 C | Industrial -40 to +100 C | Commercial 0 to +85 C | Commercial 0 to +85 C |
| Speed Grade | I7 (industrial, fast) | C8 (commercial, standard) | C7 (commercial, fast) | I7 (industrial, fast) | C8 (commercial, standard) | C7 (commercial, fast) |
| User I/O Count | 500 | 500 | 500 | 500 | 500 | 500 |
| Embedded SRAM (M9K) | 2,500 Kbits | 2,500 Kbits | 2,500 Kbits | 2,500 Kbits | 2,500 Kbits | 2,500 Kbits |
| Multipliers (18x18) | 144 | 144 | 144 | 144 | 144 | 144 |
Wichtigste Unterscheidungsmerkmale
- Highest I/O count available in the MAX 10 family (vs. 10M40DCF484I7G)
- Dual-image configuration flash with instant-on (vs. 10M40DAF672I7G)
- Industrial temperature grade with full speed margin (vs. 10M40DCF672C8G)
Designhinweise
Estimated: the FBGA-672 footprint requires a 1.0 mm ball pitch with 0.5 mm pad diameter on the outer layer; place all 0.1 uF / 1 uF / 10 uF decoupling capacitors within 100 mils of each power pin pair. Route the JTAG chain (TCK / TMS / TDI / TDO) as a daisy-chain with 33 ohm series-termination resistors at the driver output, and place the JTAG header within 6 inches of the FPGA to avoid signal-integrity issues. Use Intel's pin connection guidelines for the 672-ball FBGA to avoid unconnected-pad thermal-mechanical failure modes.
The 10M40DCF672I7G requires a 1.2 V core supply (VCC), a 2.5 V / 3.3 V analog supply (VCCA), and a separate 2.5 V / 3.0 V charge-pump supply for flash programming. Use a low-noise LDO such as the LT3042 for the analog rails, and a switching regulator such as the TPS54331 for the 1.2 V core with bulk decoupling. Power sequencing must bring up VCCA before VCC; Intel's datasheet specifies the exact power-rail sequencing order. Estimated: at full utilization the device can draw 1.5-2.0 A from the 1.2 V rail, so the regulator must deliver at least 3 A peak.
LVDS and DDR3 interfaces on the 10M40DCF672I7G require matched-impedance routing (100 ohm differential for LVDS, 50 ohm single-ended / 100 ohm differential for DDR3) and length matching within +/- 25 mils on the byte lanes. Use the IBIS models from the Intel website to validate the routing topology before layout freeze. Address the DDR3 write-leveling and read-capture issues with the External Memory Interface Toolkit during board bring-up. Common pitfall: failing to enable the FPGA's on-die termination (OCT) for DDR3 - this causes signal-integrity failures on the byte lanes.
Estimated: at full utilization (40K LEs at 200 MHz toggle, 144 multipliers active, all I/O toggling at 100 MHz), the 10M40DCF672I7G dissipates approximately 1.5-2.0 W in still air. The FBGA-672 package's theta-JA is approximately 18 C/W with a JEDEC-standard 4-layer PCB; with the device operating at an industrial 100 C ambient, junction temperature can reach 130 C. For full-margin operation above 70 C ambient, increase PCB copper pour under the package or attach a small heatsink to keep Tj below 125 C.
Compliance-Informationen
Lead-free (Pb-free) finish indicated by trailing 'G' in MPN. Not AEC-Q100 qualified - migrate to automotive-grade Cyclone family for AEC-Q100 needs. RoHS and REACH compliance per Intel product page; halogen-free status not explicitly published in the verified data.
