AMD

2VM3254 - Versal Prime Gen 2 Adaptive SoC | AMD

Teilenummer: 2VM3254 ✓ Aktiv

Auf Lager Versand in 1–3 Werktagen

23x23 mm Package

Kontakt für Preise

MOQ: 1 |

Preis aktualisiert: 2026-08-19

Mengenpreise

Menge	Stückpreis	Gesamt
1	$0	$0,00
10	$0	$0,00
100	$0	$0,00
500	$0	$0,00
1.000	$0	$0,00

ℹ️ Alle Preise sind in USD

Datenblatt anzeigen (PDF) Alternativen ansehen

Menge

2VM3254 Übersicht

The AMD 2VM3254 is a Versal Prime Series Gen 2 adaptive SoC designed for space-constrained embedded applications. It integrates a 4-core Arm Cortex-A78AE application processor with programmable logic, delivering up to 100K DMIPS of scalar compute in a compact 23x23mm package. This device is part of AMD's Versal Prime Gen 2 family, which offers up to 10X scalar compute performance compared to previous generations.

An adaptive SoC (System-on-Chip) combines a hardened application processor (like Arm Cortex-A78AE) with programmable logic (FPGA fabric) and customizable engines on a single device. This architecture allows designers to implement both software-defined and hardware-accelerated functions, bridging the gap between traditional microprocessors and FPGAs. The Versal Prime Series Gen 2 targets embedded systems requiring high compute density, low latency, and flexible I/O.

Key features of the 2VM3254 include a 23x23mm package (27% smaller than the previous minimum), 4-core Cortex-A78AE processor, and support for Pro AV, broadcast, and industrial IoT applications. The device provides high programmable logic density per square millimeter, enabling complex designs in compact form factors. It also supports the Versal Prime Gen 2 ecosystem, including design tools and early access programs.

Technically, the 2VM3254 leverages AMD's adaptive compute acceleration platform (ACAP) architecture, combining scalar engines (Arm cores), adaptable engines (programmable logic), and intelligent engines (AI cores) with a network-on-chip (NoC) interconnect. This heterogeneous architecture allows concurrent execution of software and hardware tasks, optimizing performance per watt for edge applications.

Typical applications include Pro AV video processing, broadcast infrastructure, industrial IoT gateways, and edge AI systems. The compact package makes it ideal for space-constrained designs where board area is critical. The device also serves as an entry point for customers evaluating Versal Prime Gen 2 before migrating to larger devices like the 2VM3654.

When designing with the 2VM3254, consider the power delivery network (PDN) requirements for the multi-rail SoC, including core, I/O, and memory voltages. Use AMD's power estimation tools and reference designs to optimize decoupling and thermal management in the 23x23mm package.

Drop-in-Alternativen für 2VM3254 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit 2VM3254 (gleiche Bauform und Footprint) – abweichend in Availability, Early Access, Package Size.

2VM3454

AMD

Availability: Sampling later in 2026

Early Access: Contact AMD sales for early access program

Package Size: 23 x 23 mm

Vergleichen mit 2VM3254 →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

2VM3104

⚡ Gleiches Gehäuse

AMD

📦 BGA (23x23mm)

Versal Prime Series Gen 2 · Quad-core Arm Cortex-A78AE · 64 KB · Up to 100K DMIPS · 23 x 23 mm

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

ℹ️ 2 Bauteile in anderen Gehäusen ausgeblendet – ein anderes Gehäuse erfordert eine PCB-Überarbeitung und ist kein echter Drop-in-Ersatz. Kontaktieren Sie uns falls Sie Vorschläge für andere Gehäuse benötigen.

2VM3254 Grenzwerte & elektrische Eigenschaften

Product Family	Versal Prime Series Gen 2
Processor Cores	4x Arm Cortex-A78AE
Scalar Compute	Up to 100K DMIPS
Package Size	23x23 mm
Package Type	BGA (Ball Grid Array)
Programmable Logic	Adaptive SoC fabric
Target Applications	Pro AV, broadcast, industrial IoT
Availability	Expected 2027
Compute Performance	Up to 10X vs previous gen
Die Size Reduction	27% smaller than previous minimum
Ecosystem	Versal Prime Gen 2 design tools
Early Access	Contact AMD sales

2VM3254 bga (ball grid array) Pinbelegungsleitfaden

Pinbelegung für 2VM3254 (bga (ball grid array)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für 2VM3254 im bga (ball grid array)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für 2VM3254.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

2VM3254 ist geeignet für 6 Anwendungs: Pro AV Video Processing, Broadcast Infrastructure, Industrial IoT Gateways, Edge AI Systems, Compact Embedded Computing, Test and Measurement.

📺

Pro AV Video Processing

The 2VM3254's 4-core Cortex-A78AE and programmable logic enable real-time video processing for Pro AV systems. Its 23x23mm package fits compact video switchers and scalers, while the adaptive SoC architecture supports custom video interfaces and processing pipelines. The device delivers up to 100K DMIPS for control plane tasks, ensuring responsive user interfaces and protocol handling.

Empfohlen

MT40A512M16JY-075E · Micron Technology

📡

Broadcast Infrastructure

In broadcast systems, the 2VM3254 handles video encoding, decoding, and transport stream processing. Its programmable logic allows implementation of custom codecs and protocols, while the Arm cores manage system control and network interfaces. The compact package enables dense channel density in broadcast equipment, and the Versal Prime Gen 2 architecture provides up to 10X scalar compute for efficient processing.

Empfohlen

MT40A512M16JY-075E · Micron Technology

🏭

Industrial IoT Gateways

The 2VM3254 serves as an industrial IoT gateway processor, combining real-time control with edge analytics. Its 4-core Cortex-A78AE handles protocol conversion and cloud connectivity, while programmable logic implements custom sensor interfaces and deterministic control loops. The 23x23mm package fits DIN-rail and panel-mounted designs, and the device's compute density supports AI inference at the edge.

Empfohlen

MT40A512M16JY-075E · Micron Technology

🧩

Edge AI Systems

The 2VM3254 enables edge AI inference with its adaptive SoC architecture. The Arm cores run AI frameworks, while programmable logic accelerates custom neural network layers. This heterogeneous approach optimizes performance per watt for vision and sensor processing. The compact package is ideal for embedded vision systems, drones, and robotics where space is limited.

Empfohlen

MT40A512M16JY-075E · Micron Technology

🔧

Compact Embedded Computing

The 2VM3254's 23x23mm package makes it ideal for compact embedded computers. It integrates a 4-core processor and programmable logic, eliminating the need for separate CPU and FPGA devices. This reduces board area and power consumption while improving reliability. The device supports various I/O standards, enabling flexible system design.

Empfohlen

MT40A512M16JY-075E · Micron Technology

🔬

Test and Measurement

In test equipment, the 2VM3254 provides high-speed data acquisition and processing. Its programmable logic implements custom trigger and analysis circuits, while the Arm cores handle user interfaces and data logging. The compact package enables portable instruments, and the Versal Prime Gen 2 architecture delivers the compute needed for real-time signal processing.

Empfohlen

MT40A512M16JY-075E · Micron Technology

Zusammenfassung der empfohlenen Produkte

MT40A512M16JY-075E Micron Technology Verwendet in: Pro AV Video Processing, Broadcast Infrastructure, Industrial IoT Gateways, Edge AI Systems, Compact Embedded Computing, Test and Measurement

What is the 2VM3254?

The 2VM3254 is an AMD Versal Prime Series Gen 2 adaptive SoC with a 4-core Arm Cortex-A78AE processor, delivering up to 100K DMIPS in a 23x23mm package. It is designed for space-constrained Pro AV, broadcast, and industrial IoT applications.

What are the key specifications of the 2VM3254?

The 2VM3254 features 4 Arm Cortex-A78AE cores, up to 100K DMIPS scalar compute, and a 23x23mm package. It is part of the Versal Prime Gen 2 family, offering up to 10X scalar compute over previous generations. Availability is expected in 2027.

Where can I buy the 2VM3254?

The 2VM3254 is not yet available for purchase; AMD expects availability in 2027. To request early access, contact AMD sales. Once released, it will be available through authorized distributors like DigiKey and Mouser.

What is the price of the 2VM3254?

Pricing for the 2VM3254 has not been announced as of 2026-08-20. AMD typically prices Versal devices based on logic density and features. Contact AMD sales for early access pricing or check distributor sites after release.

What is the lead time for the 2VM3254?

The 2VM3254 is expected to be available in 2027, so lead time is not yet defined. For early access, contact AMD sales. Once production begins, lead times will depend on demand and supply chain conditions.

Is the 2VM3254 in stock?

No, the 2VM3254 is not in stock anywhere as of 2026-08-20. AMD announced the device in May 2026 with expected availability in 2027. Check AMD's website or authorized distributors for updates.

2VM3254 vs 2VM3454 - which is better for Pro AV?

The 2VM3254 and 2VM3454 are both Versal Prime Gen 2 devices, but the 2VM3454 is available earlier (2026) and likely has more resources. For Pro AV, choose 2VM3454 if you need immediate availability; choose 2VM3254 for a smaller 23x23mm package if board space is critical.

What is the difference between 2VM3254 and 2VM3104?

The 2VM3254 and 2VM3104 are both Versal Prime Gen 2 devices in 23x23mm packages. The 2VM3254 has 4 Cortex-A78AE cores, while the 2VM3104 likely has fewer resources. The 2VM3254 offers higher compute for more demanding applications.

When should I choose the 2VM3254 over the 2VM3454?

Choose the 2VM3254 over the 2VM3454 when you need the smallest package (23x23mm) and can wait for 2027 availability. The 2VM3254 is ideal for space-constrained designs where the 2VM3454's larger package or earlier availability is not required.

Is the 2VM3254 suitable for industrial IoT?

Yes, the 2VM3254 is designed for industrial IoT applications. Its 4-core Cortex-A78AE processor and programmable logic enable edge processing, protocol bridging, and real-time control in compact form factors, making it suitable for smart factory and automation systems.

What is the best drop-in replacement for the 2VM3254?

As of 2026-08-20, no drop-in replacement exists for the 2VM3254 because it is a new device. The closest alternatives are the 2VM3454 (same family, larger package) and 2VM3104 (same package, fewer resources). Verify pin compatibility before use.

Can the 2VM3454 replace the 2VM3254?

The 2VM3454 is a Versal Prime Gen 2 device but likely has a different package and pinout than the 2VM3254. It is not a drop-in replacement. Use it only if you can redesign the PCB to accommodate the larger package and different pinout.

Where can I download the 2VM3254 datasheet PDF?

The 2VM3254 datasheet is not yet publicly available. AMD's Versal Prime Gen 2 product page (amd.com) provides preliminary information. Contact AMD sales for datasheet access through the early access program.

Where can I find the 2VM3254 pinout?

The 2VM3254 pinout is not publicly available as of 2026-08-20. AMD typically releases pinout details in the datasheet or package files. Contact AMD sales for early access documentation.

Is the 2VM3254 the same as the 2VM3454?

No, the 2VM3254 and 2VM3454 are different Versal Prime Gen 2 devices. The 2VM3254 has a 23x23mm package and 4 Cortex-A78AE cores, while the 2VM3454 is likely larger with more resources. They are not the same device.

What are the key specifications of the 2VM3254 that engineers should know?

The 2VM3254 features 4 Arm Cortex-A78AE cores, up to 100K DMIPS scalar compute, and a 23x23mm package. It is part of AMD's Versal Prime Gen 2 family, offering up to 10X scalar compute over previous generations. Availability is expected in 2027.

What is the best Intel equivalent for the 2VM3254?

Intel does not have a direct equivalent to the 2VM3254, as it is an adaptive SoC combining Arm cores and FPGA fabric. Intel's Agilex FPGAs offer similar integration but with different architecture. No pin-compatible cross-brand replacement exists.

Technische Referenzdaten für 2VM3254 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the 2VM3254 when you need a compact adaptive SoC with 4-core Cortex-A78AE processing and programmable logic in a 23x23mm package. It is ideal for Pro AV, broadcast, and industrial IoT applications where board space is critical. If you need immediate availability, choose the 2VM3454 (available 2026) but with a larger package. For lower-cost designs with fewer resources, consider the 2VM3104. For high-end applications requiring maximum performance, the 2VM3654 offers early access but at higher cost and power. All devices share the Versal Prime Gen 2 architecture, but they are not pin-compatible drop-ins.

Vergleich mit Alternativen

Parameter	Dieses Produkt	2VM3454	2VM3104	2VM3654
Package	BGA (23x23mm)	BGA (larger)	BGA (23x23mm)	BGA (larger)
Brand	AMD	AMD	AMD	AMD
Availability	2027	2026	2027	Early access
Target Applications	Pro AV, broadcast, industrial IoT	Pro AV, broadcast, industrial IoT	Pro AV, broadcast, industrial IoT	High-end embedded
Early Access Program	Contact AMD sales	Yes	Contact AMD sales	Yes

Wichtigste Unterscheidungsmerkmale

Compact 23x23mm package (vs. 2VM3454)
4-core Cortex-A78AE (vs. 2VM3104)
Versal Prime Gen 2 architecture (vs. 2VM3654)

Designhinweise

The 2VM3254 is a multi-rail SoC requiring careful power delivery network (PDN) design. Use AMD's power estimation tools to calculate current requirements for core, I/O, and memory rails. Implement proper decoupling with low-ESR ceramic capacitors near each power pin, and consider using power modules for high-current rails.

The 23x23mm package has limited surface area for heat dissipation. Use thermal vias under the package to conduct heat to the PCB ground plane. Consider adding a heatsink or forced airflow for high-power designs. AMD provides thermal models for simulation; use them to verify junction temperature stays within limits.

For the 23x23mm BGA package, use a high-layer-count PCB (8+ layers) to route signals and power. Follow AMD's layout guidelines for impedance-controlled traces and differential pairs. Place decoupling capacitors as close to the BGA pads as possible, and use a solid ground plane for return current paths.