2VM3104 - Versal Prime Gen 2 Adaptive SoC | AMD | 23x23mm
MPN: 2VM3104 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for 2VM3104 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
2VM3254
⚡ Same Package✓ In Stock
Contact for price
View Datasheet →2VM3454
⚡ Same Package✓ In Stock
Contact for price
View Datasheet →2VM3654
⚡ Same Package📋 Reference alternative (not in catalog)
XC7Z020
⚡ Same Package✓ In Stock
$59.9 / Unit
View Datasheet →XC7A100T
⚡ Same Package✓ In Stock
$25.3 / Unit
View Datasheet →2VM3104 Maximum Ratings & Electrical Characteristics
| Family | Versal Prime Series Gen 2 |
| Processor Subsystem | Quad-core Arm Cortex-A78AE |
| L1 Cache | 64 KB |
| Scalar Compute | Up to 100K DMIPS |
| Package Size | 23 x 23 mm |
| Package Type | [DATA_NEEDED: exact package type] |
| Programmable Logic | [DATA_NEEDED: logic cells] |
| DSP Slices | [DATA_NEEDED: DSP slices] |
| Memory | [DATA_NEEDED: on-chip memory] |
| I/O Count | [DATA_NEEDED: I/O count] |
| Operating Temperature | [DATA_NEEDED: temperature range] |
| Supply Voltage | [DATA_NEEDED: supply voltage] |
| Power Dissipation | [DATA_NEEDED: power dissipation] |
| RoHS Status | unknown |
| Availability | Expected 2027 |
2VM3104 [data_needed: exact package type] Pin Configuration Guide
Complete pinout information for 2VM3104 ([data_needed: exact package type] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: exact package type] package pinout diagram for 2VM3104](/assets/package-diagrams/default.svg?v=1787288525)
No detailed pinout data available for 2VM3104.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
2VM3104 is suitable for 6 applications: Pro AV Equipment, Broadcast Infrastructure, Industrial IoT Gateways, Edge AI and Machine Vision, Test and Measurement, Aerospace and Defense.
Pro AV Equipment
The 2VM3104 is ideal for Pro AV equipment such as video processors, audio mixers, and signal distribution units. Its compact 23x23 mm package allows integration into space-constrained AV hardware, while the quad-core Arm Cortex-A78AE APU and programmable logic handle real-time video processing, scaling, and audio mixing. The device's up to 100K DMIPS scalar compute ensures smooth operation of complex AV algorithms, and the programmable logic enables custom video interfaces and codecs. With high compute density, the 2VM3104 supports multiple video streams and low-latency processing, making it suitable for professional broadcast and AV installations.
Recommended
Broadcast Infrastructure
In broadcast infrastructure, the 2VM3104 excels in encoding, transcoding, and signal processing applications. Its programmable logic can implement custom video codecs and transport stream processors, while the APU handles control plane tasks. The 23x23 mm package is ideal for dense broadcast equipment like encoders and switchers. With up to 100K DMIPS, the device can manage multiple channels of video processing simultaneously. The small footprint reduces board space, enabling more channels per rack unit. The Versal Prime Gen 2 architecture provides the performance needed for high-quality video delivery.
Recommended
Industrial IoT Gateways
The 2VM3104 is well-suited for industrial IoT gateways that require edge computing, machine vision, and real-time control. Its quad-core Arm Cortex-A78AE APU provides powerful general-purpose processing, while the programmable logic can implement custom sensor interfaces and acceleration engines. The compact 23x23 mm package fits into rugged industrial enclosures. With up to 100K DMIPS, the device can handle complex analytics and protocol conversion. The small size and high compute density make it ideal for distributed edge nodes in factories and smart buildings.
Recommended
Edge AI and Machine Vision
The 2VM3104 enables edge AI and machine vision applications by combining a powerful APU with programmable logic for custom neural network accelerators. The quad-core Arm Cortex-A78AE can run inference frameworks, while the PL implements high-throughput preprocessing. The 23x23 mm package is suitable for cameras and smart sensors. With up to 100K DMIPS, the device can process multiple video streams for object detection and classification. The small form factor allows integration into compact vision systems, and the adaptive nature of the SoC allows algorithm updates in the field.
Recommended
Test and Measurement
The 2VM3104 is suitable for test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators. Its programmable logic can implement high-speed data acquisition and triggering, while the APU handles user interface and data processing. The compact 23x23 mm package enables portable instruments. With up to 100K DMIPS, the device can perform real-time signal analysis and waveform generation. The small size reduces instrument footprint, and the adaptive SoC allows firmware updates to add new measurement capabilities.
Recommended
Aerospace and Defense
The 2VM3104 can be used in aerospace and defense applications such as radar processing, secure communications, and flight control. Its programmable logic allows custom signal processing and encryption, while the APU provides general-purpose computing. The compact 23x23 mm package is suitable for avionics and unmanned systems. With up to 100K DMIPS, the device can handle complex algorithms in real-time. The small size reduces weight and power consumption, critical for airborne platforms. AMD's Versal family is designed for high-reliability applications.
Recommended
Recommended Products Summary
Engineering reference data for 2VM3104 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 2VM3254 | 2VM3454 | 2VM3654 |
|---|---|---|---|---|
| Package | 23x23 mm | 23x23 mm | 23x23 mm | 23x23 mm |
| Brand | AMD | AMD | AMD | AMD |
| Processor Subsystem | Quad-core Arm Cortex-A78AE | Quad-core Arm Cortex-A78AE | Quad-core Arm Cortex-A78AE | Quad-core Arm Cortex-A78AE |
| Scalar Compute | Up to 100K DMIPS | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Availability | Expected 2027 | Expected 2027 | Early access now | Early access now |
| Package Size Reduction | 27% smaller than previous gen | 27% smaller | 27% smaller | 27% smaller |
| Programmable Logic Density | Higher per mm2 than 8-core devices | Higher per mm2 | Higher per mm2 | Higher per mm2 |
| Target Applications | Pro AV, broadcast, industrial IoT | Pro AV, broadcast, industrial IoT | Pro AV, broadcast, industrial IoT | Pro AV, broadcast, industrial IoT |
Key Differentiators
- Compact 23x23 mm package (vs Previous Versal Prime Gen 2 devices)
- Up to 100K DMIPS scalar compute (vs Existing AMD adaptive SoCs)
- Higher programmable logic density (vs Similarly sized 8-core Versal Prime devices)
Design Notes
The 2VM3104's high compute density in a 23x23 mm package requires careful thermal management. Ensure adequate airflow or a heatsink to dissipate heat, especially under sustained loads. Use thermal vias and a solid ground plane to improve heat spreading. Consider the ambient temperature and derating curves once available.
Design a robust power delivery network for the 2VM3104, with multiple voltage rails for the APU, PL, and I/O. Use low-ESR decoupling capacitors close to the power pins. Follow AMD's power sequencing requirements, which will be detailed in the datasheet. Consider using PMICs designed for adaptive SoCs.
For the 23x23 mm package, ensure the PCB layout accommodates high-density BGA or LGA pads. Use fine-pitch routing and controlled impedance for high-speed signals. Follow AMD's layout guidelines for signal integrity, including ground planes and via placement. The small package may require microvias or HDI techniques.
Compliance Information
Compliance information not yet available for this pre-release device.
