5CGXBC7C6F23C7N - Cyclone V GX FPGA, 149.5K LE, FBGA-484 | Intel
Teilenummer: 5CGXBC7C6F23C7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $215 | $215,00 |
| 10 | $195.5 | $1.955,00 |
| 100 | $178.2 | $17.820,00 |
| 250 | $168.75 | $42.187,50 |
| 500 | $161.4 | $80.700,00 |
| 1.000 | $154.9 | $154.900,00 |
5CGXBC7C6F23C7N Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic function is defined after manufacturing via a configuration bitstream loaded into on-chip SRAM. FPGAs sit at the top of the programmable logic hierarchy (FPGA > CPLD > SPLD > PAL/GAL) and offer a parallel fabric of configurable logic blocks (CLBs), embedded multipliers, block RAM, DSP blocks, clock trees, and high-speed transceiver channels. The Cyclone V GX family specifically targets cost-sensitive applications that require integrated transceivers and moderate logic density.
The 5CGXBC7C6F23C7N integrates six 3.125 Gbps GX transceivers, 156 18x18 multipliers, 9.4 Mbit of embedded memory, and 240 user I/Os organized into eight I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. Configuration is supported via active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG modes, enabling flexible boot from EPCS or EPCQ configuration devices. The part also includes dedicated hard IP for PCI Express Gen1 (x1/x2) and an integrated hard memory controller.
From an architecture perspective, the device combines a row/column-based logic fabric with adaptive logic modules (ALMs) and a MultiTrack interconnect that minimizes congestion in fanout-heavy designs. The transceiver tiles support protocols such as Gigabit Ethernet, CPRI, V-by-One, and SMPTE SDI through the Quartus II/Prime transceiver toolkit, allowing engineers to instantiate PHY IPs at design entry rather than buying discrete SERDES.
Typical applications include industrial machine vision cameras, broadcast video processing, low-cost wireless backhaul baseband, factory automation controllers, and entry-level software-defined radio platforms. The combination of integrated transceivers and a moderate logic budget makes the device attractive for designers who need more than CPLD density but cannot justify a Cyclone V GT/E or Stratix part.
When designing with this FPGA, engineers should treat the FBGA-484 land pattern as a fine-pitch layout challenge requiring 1.0 mm ball pitch and microvia/laser-drilled PCB technology. Decoupling must follow Intel's power distribution network guidelines with both bulk and high-frequency capacitors placed within the inductance budget documented in the Cyclone V device handbook.
This page synthesizes distributor pricing, same-package Cyclone V GX drop-in alternatives, and practical board-level design notes that are not compiled in a single place in the manufacturer datasheet.
Drop-in-Alternativen für 5CGXBC7C6F23C7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CGXBC7C6F23C7N (gleiche Bauform und Footprint) – abweichend in Package, Embedded Memory, Transceivers, Family, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CGXBC7B7M15C8N
✅ Drop-In✓ Auf Lager
$149 / Stück
Datenblatt ansehen →5CGXBC7B6M15C7N
✅ Drop-In✓ Auf Lager
$198.4 / Stück
Datenblatt ansehen →5CGXBC7C6F23I7N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
5CGXBC5C7U19C8N
✅ Drop-In✓ Auf Lager
$112 / Stück
Datenblatt ansehen →5CGXBC7C6F23C7N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V GX |
| Logic Elements | 149,500 |
| Embedded Memory | 7,880,704 bits (9.4 Mbit) |
| Maximum User I/O Pins | 240 |
| Number of Transceivers | 6 |
| Transceiver Data Rate | 3.125 Gbps |
| 18x18 Multipliers | 156 |
| Core Voltage | 1.1 V |
| Process Technology | TSMC 28 nm low-power |
| Gehäuse | FBGA-484 (484-pin FineLine BGA) |
| Montageart | Surface Mount |
| Betriebstemperaturbereich | 0C to 85C (Commercial) |
| RoHS-Status | Compliant |
| Hard Memory Controller | Yes |
| PCIe Hard IP | Gen1 x1/x2 |
5CGXBC7C6F23C7N fbga-484 (484-pin fineline bga) Pinbelegungsleitfaden
Pinbelegung für 5CGXBC7C6F23C7N (fbga-484 (484-pin fineline bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CGXBC7C6F23C7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CGXBC7C6F23C7N ist geeignet für 7 Anwendungs: Industrial Machine Vision Cameras, Broadcast Video Processing, Factory Automation Controllers, Software Defined Radio Baseband, Medical Imaging Systems, IoT Edge Gateways, Automotive Driver Assistance Prototyping.
Industrial Machine Vision Cameras
The 5CGXBC7C6F23C7N is well matched to industrial machine vision cameras because it integrates six 3.125 Gbps transceivers for Camera Link HS or CoaXPress uplink, while providing 149,500 logic elements for Bayer-to-RGB conversion, white balance, and JPEG/H.264 compression pipelines. The 1.1 V core plus independent per-bank VCCIO allows direct connection to 1.8 V, 2.5 V, and 3.3 V image sensors without level shifters.
Empfohlen
Broadcast Video Processing
For broadcast video applications the 5CGXBC7C6F23C7N delivers 156 18x18 multipliers and 9.4 Mbit of block RAM, which is sufficient for 3G-SDI de-embedders, color-space converters, and on-screen display overlays at 1080p60. The integrated transceivers drive SMPTE 424M directly without external SERDES, while 240 user I/Os support parallel video buses and audio embedding I/O.
Empfohlen
Factory Automation Controllers
The 5CGXBC7C6F23C7N suits factory automation PLCs and motion controllers because its 149,500 logic elements, 156 hardware multipliers, and 240 user I/Os provide headroom for EtherCAT, PROFINET, or EtherNet/IP slave stacks plus multi-axis PID loops. The 1.1 V core with sub-1 W typical dynamic power keeps the part within sealed industrial enclosure thermal budgets without active cooling.
Empfohlen
Software Defined Radio Baseband
For low-cost software-defined radio baseband the 5CGXBC7C6F23C7N pairs six 3.125 Gbps transceivers for CPRI or OBSAI fronthaul links with 156 18x18 multipliers that implement FFT, channelization, and digital down-conversion stages for sub-6 GHz radio cards. The 9.4 Mbit block RAM holds coefficient tables and packet buffers, while 240 user I/Os interface to ADC/DAC companion chips.
Empfohlen
Medical Imaging Systems
The 5CGXBC7C6F23C7N supports medical imaging front-ends such as ultrasound beamformers and endoscopy processors where 149,500 logic elements and 156 DSP multipliers implement FIR filtering, envelope detection, and image reconstruction pipelines. The integrated transceivers carry raw ADC data to a host SoC over low-latency serial links, and 240 user I/Os connect to LVDS-based image sensors.
Empfohlen
IoT Edge Gateways
For IoT edge gateways the 5CGXBC7C6F23C7N delivers PCIe Gen1 hard IP for connecting to a host processor, 3.125 Gbps transceivers for wired uplinks, and 149,500 logic elements for protocol translation between Modbus, BACnet, MQTT, and OPC UA. The 1.1 V core plus sub-watt dynamic power keeps the gateway within PoE power budgets while 240 user I/Os serve RS-485, CAN, and GPIO channels.
Empfohlen
Automotive Driver Assistance Prototyping
For pre-production prototyping of ADAS vision and radar preprocessing the 5CGXBC7C6F23C7N provides six 3.125 Gbps transceivers for camera and radar front-end aggregation, plus 156 multipliers for FFT and object detection kernels. Designers can validate algorithms in the lab before porting to a Cyclone V Auto-grade part; the commercial 0C to 85C grade suits non-vehicle-mounted prototype racks.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CGXBC7C6F23C7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CGXBC7B7M15C8N | 5CGXBC7B6M15C7N | 5CGXBC7C6F23I7N | 5CGXBC5C7U19C8N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 | FBGA-484 (same) | FBGA-484 (same) | FBGA-484 (same) | FBGA-484 (same) |
| Logic Elements | 149,500 | 149,500 | 149,500 | 149,500 | ~77,000 |
| Embedded Memory | 7,880,704 bits | 7,880,704 bits | 7,880,704 bits | 7,880,704 bits | ~4,460,000 bits |
| Transceivers / Data Rate | 6 x 3.125 Gbps | 6 x 3.125 Gbps | 6 x 3.125 Gbps | 6 x 3.125 Gbps | 6 x 3.125 Gbps |
| 18x18 Multipliers | 156 | 156 | 156 | 156 | ~78 |
| Maximum User I/O | 240 | 240 | 240 | 240 | 240 |
| Temperature Grade | Commercial 0C to 85C | Commercial 0C to 85C | Commercial 0C to 85C | Industrial -40C to 100C | Commercial 0C to 85C |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
Wichtigste Unterscheidungsmerkmale
- Highest logic density available in the Cyclone V GX 484-FBGA package class (vs. 5CGXBC5C7U19C8N)
- Commercial temperature grade suited to indoor industrial equipment (vs. 5CGXBC7C6F23I7N)
- Six integrated 3.125 Gbps transceivers eliminate external SERDES cost (vs. 5CEFA4F23I7N)
Designhinweise
The FBGA-484 package uses a 1.0 mm ball pitch and requires microvia or laser-drilled PCB technology. Stacked-via designs with 0.4 mm pitch capture pads are recommended for breakout; conventional 0.2 mm mechanical drills do not support the inner-row escape. Designers should follow the Cyclone V device handbook pin connection guidelines and Intel's board design guidelines for high-speed transceiver routing to maintain signal integrity on the GX channels up to 3.125 Gbps.
Estimated: the Cyclone V GX core at 1.1 V draws roughly 0.5-1.5 W depending on toggle rate and transceiver utilization; a design with all six transceivers active at 3.125 Gbps can pull 2-3 W total from the VCCINT and VCCEAL supplies combined. Provide at least four 22 uF/0402 ceramic capacitors plus two 220 uF bulk capacitors within the inductance budget documented in the device handbook PDN guidelines, and route VCCINT and VCCA_FPLL as wide polygons to limit IR drop.
Do not confuse the 5CGXBC7C6F23C7N (FBGA-484, 149.5K LE) with the 5CGXBC5C7F27C8N (FBGA-672, lower density) - they share the same prefix but use different packages and cannot be PCB-swapped. Always verify the package code in the part number matches your footprint, and confirm the configuration flash (EPCS16 / EPCQ32) is sized for your compressed bitstream plus any remote system update images.
Compliance-Informationen
RoHS compliance and PBGA484 package compliance per FindIC product listing; halogen-free status not explicitly stated in verified web data and left as unknown.
