5CGXBC7B6M15C7N - 149.5K LE Cyclone V GX FPGA | Intel
Teilenummer: 5CGXBC7B6M15C7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245 | $24.500,00 |
| 500 | $220.75 | $110.375,00 |
| 1.000 | $198.4 | $198.400,00 |
5CGXBC7B6M15C7N Übersicht
What is an FPGA? A field-programmable gate array is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnect, and hardened I/O and IP blocks that the designer can re-program after manufacture to implement arbitrary digital functions. FPGAs sit hierarchically between general-purpose microcontrollers (fixed ISA, software-defined) and application-specific integrated circuits (ASICs, fixed hardware): FPGAs offer ASIC-like parallel throughput with microcontroller-like design flexibility, while modern FPGAs increasingly embed hard IP such as transceivers, memory controllers, and DSP blocks to close the gap.
The 5CGXBC7B6M15C7N integrates twelve 3.125 Gbps GX transceivers, 240 maximum user I/O, and 7,880,704 bits (approximately 8 Mbit) of embedded SRAM arranged as M9K/M10K memory blocks. On-board DSP blocks support variable-precision multiplication for signal processing pipelines. The M15 speed grade balances timing margin against Fmax, while the C7 core-voltage variant (1.1V VCCINT) targets the lowest dynamic power in the family. The 484-ball Micro FBGA package uses a wire-bond BGA topology with 1.0 mm ball pitch.
Cyclone V GX FPGAs are typically deployed in industrial motor control, broadcast video processing, wireless baseband pre-processing, PCIe Gen1/Gen2 endpoint bridging, and protocol-conversion line cards. The integrated transceivers eliminate the need for external SerDes chips, reducing BOM cost and board area in mid-range connectivity applications. Designers using Quartus Prime can target this device with a mature IP library including DDR3 controllers, Ethernet MACs, and PCI Express hard IP.
Design consideration: the 1.1V VCCINT core and 2.5V/3.3V VCCIO bank supplies must power up in a sequence documented in the Cyclone V device family pin connection guidelines. Multi-rail sequencing with a supervisor such as the Intel MAX II CPLD or a dedicated sequencer is recommended to avoid latch-up. Decoupling per the reference schematic must follow the family datasheet recommendations of approximately 30-40 low-ESR ceramic capacitors per device.
This page synthesizes distributor pricing, drop-in compatible same-family Intel variants, and practical Quartus Prime design notes not duplicated by the manufacturer datasheet.
Drop-in-Alternativen für 5CGXBC7B6M15C7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CGXBC7B6M15C7N (gleiche Bauform und Footprint) – abweichend in Package, Family, Transceivers, Speed Grade, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CGXBC7B6M15C8N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
5CGXBC7B6M15I7N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
5CGXBC7B7M15C7N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
5CGTFD9A5U19A7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$241.5 / Stück
Datenblatt ansehen →5CEFA9F23I7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$198 / Stück
Datenblatt ansehen →5CGXBC7B6M15C7N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V GX |
| Logic Elements (LE) | 149,500 |
| Embedded Memory Bits | 7,880,704 |
| Process Technology | 28 nm |
| Core Voltage (VCCINT) | 1.1 V |
| Maximum User I/O | 240 |
| Transceivers | 12 (3.125 Gbps) |
| Gehäuse | 484-pin Micro FBGA (BGA-484) |
| Speed Grade | M15 (medium) |
| Core Voltage Variant | C7 (1.1 V, low power) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Configuration Memory | SRAM-based (volatile, external configuration required) |
5CGXBC7B6M15C7N 484-pin micro fbga (bga-484) Pinbelegungsleitfaden
Pinbelegung für 5CGXBC7B6M15C7N (484-pin micro fbga (bga-484)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CGXBC7B6M15C7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CGXBC7B6M15C7N ist geeignet für 6 Anwendungs: Industrial Motor Control, Broadcast Video Processing, Wireless Baseband Pre-Processing, PCIe Gen2 Endpoint Bridging, Test & Measurement Instrumentation, Aerospace Avionics Bridging.
Industrial Motor Control
The 5CGXBC7B6M15C7N fits industrial multi-axis motor control drives where encoder feedback, current-sense sampling, and EtherCAT/CAN-FD comms must converge on one chip. With 149,500 LE the device implements complete FOC (field-oriented control) state machines for 4-6 axes plus safety logic, while the twelve 3.125 Gbps transceivers drive the EtherCAT PHY and a high-speed encoder interface. The 1.1V VCCINT core keeps dynamic power low enough for fan-less cabinet installations. Quartus Prime IP blocks for EtherCAT slave controllers and PWM generation reduce time-to-prototype.
Empfohlen
Broadcast Video Processing
The 5CGXBC7B6M15C7N is well suited to broadcast video routing and processing cards that ingest SDI, HDMI, or DisplayPort streams and apply real-time colour-space conversion or scaling. Its 7,880,704 embedded memory bits buffer line/frame stores for 3G-SDI pipelines, while 240 user I/O accommodate parallel video buses and control GPIO. The integrated transceivers carry 12G-SDI over coax using external cable equalizers. Compared with discrete DSP+ASIC solutions, the 5CGXBC7B6M15C7N collapses the bill of materials and allows field firmware upgrades when broadcast standards evolve.
Empfohlen
Wireless Baseband Pre-Processing
The 5CGXBC7B6M15C7N is a strong fit for small-cell wireless baseband pre-processing, performing CPRI fronthaul aggregation, FFT/iFFT channelization, and digital pre-distortion before handing off to a host ASIC. The twelve 3.125 Gbps transceivers aggregate up to 12 CPRI links without external SerDes, while the 149,500 LE deliver the DSP throughput needed for 20 MHz LTE channelization. Compared with a pure DSP chip, the FPGA offers reconfigurability for evolving 5G NR waveforms via software upgrade.
Empfohlen
PCIe Gen2 Endpoint Bridging
For protocol-conversion line cards that bridge PCIe Gen2 endpoints to legacy parallel buses or custom backplanes, the 5CGXBC7B6M15C7N integrates the PCIe hard IP block plus ample fabric for state machines and FIFOs. The device supports up to x4 Gen2 (2.5 GT/s) lanes natively, allowing drop-in deployment as a PCIe endpoint without an external PHY. The C7 core-voltage variant minimizes power in always-on server backplane slots.
Empfohlen
Test & Measurement Instrumentation
The 5CGXBC7B6M15C7N fits mid-range bench instruments such as protocol analysers, mixed-signal oscilloscope capture cards, and ATE pin electronics where flexible real-time signal processing is required. The 240 user I/O sample high-speed parallel buses; embedded M10K memory blocks implement deep capture FIFOs; the transceiver channels interface to high-speed serial triggers. Compared with a fixed-function ASIC instrument chip, the FPGA lets one board serve multiple instrument personalities through firmware reload.
Empfohlen
Aerospace Avionics Bridging
The 5CGXBC7B6M15C7N is suitable for avionics protocol bridges (ARINC 429, MIL-STD-1553, ARINC 664/AFDX) where deterministic latency and DO-254 design assurance are required. The Cyclone V family supports the -I industrial temperature grade and is supported by Intel's DO-254 compliance documentation, easing certification. The integrated transceivers implement AFDX links natively, while the FPGA fabric runs protocol stacks and traffic-shaping state machines. The 484-ball Micro FBGA package is compatible with avionics-grade PCB stack-ups using microvia technology.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CGXBC7B6M15C7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CGXBC7B6M15C8N | 5CGXBC7B6M15I7N | 5CGXBC7B7M15C7N | 5CGTFD9A5U19A7N | 5CEFA9F23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | BGA-484 (Micro FBGA, 1.0 mm pitch) | BGA-484 - same | BGA-484 - same | BGA-484 - same | UBGA-484 (Cyclone V GT - same ball footprint) | FBGA-484 - same |
| Logic Elements | 149,500 | 149,500 | 149,500 | 149,500 | 301,000 | 301,000 |
| Embedded Memory Bits | 7,880,704 | 7,880,704 | 7,880,704 | 7,880,704 | 13,917,696 | 17,133,568 |
| Transceivers | 12 x 3.125 Gbps (GX) | 12 x 3.125 Gbps | 12 x 3.125 Gbps | 12 x 6.144 Gbps (GX) | 9 x 5 Gbps (GT) | 0 (no transceivers) |
| Maximum User I/O | 240 | 240 | 240 | 240 | 224 | 224 |
| Core Voltage (VCCINT) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Commercial | Industrial | Industrial |
Wichtigste Unterscheidungsmerkmale
- Higher logic capacity at same 484-BGA footprint vs Cyclone V E (vs. 5CEFA9F23I7N)
- Lower-cost transceiver vs Cyclone V GT (vs. 5CGTFD9A5U19A7N)
- Industrial temperature upgrade path (vs. 5CGXBC7B6M15I7N)
- Higher transceiver rate variant in same package (vs. 5CGXBC7B7M15C7N)
Designhinweise
Estimated: at typical utilization (60% LE, 50% memory, 8 active transceivers at 3.125 Gbps) the 5CGXBC7B6M15C7N consumes approximately 3.5-4.5 W. Designers should provision a 5W VRM budget for VCCINT and an additional 2-3W for VCCIO banks. The Cyclone V PowerPlay Early Power Estimator (EPE) spreadsheet is mandatory before committing the PCB stack-up, and Intel's pin connection guidelines mandate at least 30-40 low-ESR ceramic decoupling capacitors distributed around the package perimeter.
The 484-ball Micro FBGA uses 1.0 mm ball pitch and requires a high-density PCB stack-up with microvia (laser-drilled) interconnects for the inner signal layers. Per Intel's Cyclone V hardware design guidelines, use a minimum 6-layer stack-up with dedicated ground and power planes; signal layers should be routed 50 ohm controlled impedance. Matched-length tuning is required for all 12 transceiver channels, with intra-pair skew under 5 mil and channel-to-channel skew under 150 mil.
Cyclone V devices require power-up sequencing of VCCINT (1.1V), then VCCAUX (2.5V), then VCCIO (per bank). Reverse sequence or simultaneous ramp-up can latch-up the device or trigger inrush current that exceeds the VRM rating. Use a dedicated sequencer or MAX II/MAX 10 CPLD to enforce the order. Also: do not connect any I/O bank to a voltage outside its VCCIO range - the device will be damaged. JTAG chain configuration should include the TDO pull-up recommended in the family datasheet to avoid floating-TDO debug session errors.
Transceiver channels share PCB real estate with the FPGA fabric. Per Intel reference designs, place AC-coupling capacitors within 100 mil of the FPGA transmitter balls, and keep transmit-receive differential pairs separated by at least 3W (3x trace-to-trace spacing) to minimize crosstalk. Ground-fill stitching vias should be placed every lambda/10 along all high-speed serial traces. Reference clocks to the transceiver PLLs require ultra-low jitter (<100 fs RMS) - use a dedicated clock synthesizer like the Intel CDCM61004.
Compliance-Informationen
RoHS and REACH compliant per Intel product ordering information page. Not AEC-Q100 qualified (FPGAs are not automotive-grade unless explicitly ordered as such). Halogen-free per Intel material declaration.
