5CGXBC7C7U19C8N - Cyclone V GX FPGA, 149.5K LE | Intel
Teilenummer: 5CGXBC7C7U19C8N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $105.79 | $105,79 |
| 10 | $98.5 | $985,00 |
| 25 | $92.1 | $2.302,50 |
| 100 | $84.3 | $8.430,00 |
| 500 | $76.8 | $38.400,00 |
5CGXBC7C7U19C8N Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP blocks such as transceivers, DSP blocks, and embedded memory. FPGAs sit in the hierarchy of programmable logic devices (PLDs) -> programmable logic -> logic IC -> integrated circuit. Unlike an ASIC, an FPGA's function is defined after manufacture by loading a user bitstream into on-chip SRAM configuration memory, allowing rapid prototyping and field upgrades. Cyclone V is positioned at the low-power, low-cost end of Intel's FPGA portfolio.
Key differentiating features include six general-purpose PLLs, two hard memory controllers, two PCIe hard IP blocks (Gen1/Gen2 capable), and 156 embedded 18x18 multipliers supporting DSP workloads up to 156 GMACs. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability. The 28 nm TSMC low-power process delivers a typical power envelope of less than 1.5 W at full utilization in static conditions.
The architecture combines logic fabric, M10K SRAM blocks (446 blocks total), MLABs, and a hardened peripheral set. Transceivers support CPRI, PCIe Gen1/2, Gigabit Ethernet, and SGMII protocols through soft PCS layers, removing external PHY components in many wireless backhaul and industrial connectivity designs.
Typical applications include industrial motor control, video surveillance and broadcast bridging, PCIe endpoint cards, low-density wireline backhaul, and factory automation. The combination of transceivers, DSP, and PCIe makes it suitable for cost-sensitive designs that previously required mid-range Cyclone IV + external PHY solutions.
When designing with this device, allocate sufficient decoupling across the 484-ball UBGA - VCCINT and VCCA require low-impedance bulk decoupling within 100 mils of the balls. Thermal management typically relies on a heat-spreader for industrial temperature operation, and the bitstream compression feature reduces configuration flash size by up to 60 percent.
This page synthesizes distributor pricing, same-package drop-in alternatives from the Cyclone V family, and practical PCB/thermal design notes not consolidated in any single manufacturer document.
Drop-in-Alternativen für 5CGXBC7C7U19C8N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CGXBC7C7U19C8N (gleiche Bauform und Footprint) – abweichend in Package, Transceivers, Speed Grade, Operating Temperature, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CGXBC7C7U19I7N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
5CGXBC7C6U19C7N
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →5CGXBC7C7U19C8N
✅ Drop-In✓ Auf Lager
$76.8 / Stück
Datenblatt ansehen →5CGXBC5C7U19C8N
✅ Drop-In✓ Auf Lager
$112 / Stück
Datenblatt ansehen →5CGXBC7C7U19C8N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V GX |
| Logic Elements (LE) | 149,500 |
| Embedded Memory (Bits) | 7,880,704 |
| Number of I/Os | 240 |
| Gehäuse | 484-FBGA (UBGA, U19) |
| Supply Voltage (Core) | 1.1 V (typ) |
| Transceivers | 9 channels |
| Transceiver Data Rate | Up to 3.125 Gbps |
| PCIe Hard IP | 2 blocks (Gen1/Gen2) |
| PLLs | 6 (general-purpose) |
| Embedded Multipliers | 156 (18x18) |
| M10K Memory Blocks | 446 |
| Betriebstemperatur | 0C to +85C (Commercial) |
| Montageart | Surface Mount (BGA) |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
| Configuration Scheme | SRAM-based, supports bitstream compression |
5CGXBC7C7U19C8N 484-fbga (ubga, u19) Pinbelegungsleitfaden
Pinbelegung für 5CGXBC7C7U19C8N (484-fbga (ubga, u19)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CGXBC7C7U19C8N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CGXBC7C7U19C8N ist geeignet für 6 Anwendungs: Industrial Motor Control, Video Surveillance and Broadcast Bridging, PCIe Endpoint Cards, Wireless Backhaul and Small-Cell Baseband, Factory Automation and Industrial Networking, Test and Measurement Instrumentation.
Industrial Motor Control
The 5CGXBC7C7U19C8N is well suited for multi-axis industrial motor control drives because it combines 156 embedded 18x18 multipliers and 9 transceivers up to 3.125 Gbps in the U19 484-pin BGA package. The 149,500 LEs can absorb the field-oriented control (FOC) loops, PWM generation, encoder feedback, and EtherCAT/MII slave interface without external coprocessors. The C8 speed grade supports 100 MHz control loops with deterministic latency, and the device's low static power (typically below 1.5 W) simplifies thermal design in DIN-rail mounted drives.
Empfohlen
Video Surveillance and Broadcast Bridging
For video surveillance encoders, the 5CGXBC7C7U19C8N provides the fabric needed to bridge MIPI-CSI, LVDS camera inputs, and PCIe Gen2 to a host SoC, while its 7.88 Mbit of embedded memory buffers frame-rate conversions. The 9 transceivers handle multiple Gigabit Ethernet streams for IP camera aggregation or SDI-over-IP bridging. The U19 package's 240 user I/Os are sufficient to land 4x MIPI CSI-2 lanes plus control plane GPIO, replacing a discrete PHY plus microcontroller solution.
Empfohlen
PCIe Endpoint Cards
The 5CGXBC7C7U19C8N integrates two hardened PCIe Gen1/Gen2 IP blocks, allowing direct root-complex or endpoint connectivity without an external bridge. The 9 transceivers and 6 PLLs support PCIe x1 or x2 plus auxiliary SGMII or SATA links on the same chip. The 149,500 LEs accommodate custom DMA engines and protocol logic in NIC, instrumentation, or low-cost accelerator cards.
Empfohlen
Wireless Backhaul and Small-Cell Baseband
The 5CGXBC7C7U19C8N's 3.125 Gbps transceivers support CPRI up to 3.072 Gbps, making the part a viable baseband processing device for small-cell and low-density macro base stations. The 156 DSP-friendly 18x18 multipliers handle uplink/downlink channelization and pre-coding for LTE small cells, while the embedded memory buffers HARQ processes. The U19 package's ball pitch simplifies 8-layer PCB stack-up for cost-sensitive small-cell form factors.
Empfohlen
Factory Automation and Industrial Networking
The 5CGXBC7C7U19C8N delivers the I/O count, transceiver count, and logic density needed to consolidate EtherCAT master, Profinet IRT, and EtherNet/IP adapter stacks on a single device. The 240 user I/Os in the U19 BGA handle multiple isolated RS-485 ports, digital I/O modules, and encoder interfaces. Hardened PCIe blocks enable modular PLC backplane designs, while bitstream compression accelerates firmware update cycles in the field.
Empfohlen
Test and Measurement Instrumentation
The 5CGXBC7C7U19C8N provides the logic and DSP density required for mid-range oscilloscope, signal analyzer, and protocol tester front ends. The 156 18x18 multipliers implement FIR decimation filters, FFT engines, and modulation analyzers; the 7.88 Mbit embedded memory stores sample buffers. The 9 transceivers drive LVDS or SGMII ADC/DAC interfaces such as AD9680BCPZ-500 or ADAR1000ACCZN, while the hardened PCIe Gen2 block streams captured waveforms to the host at sustained rates above 1.5 GB/s.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CGXBC7C7U19C8N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CGXBC7C7U19I7N | 5CGXBC7C6U19C7N | 5CGXBC5C7U19C8N | 5CGXBC7B7M15C8N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (U19) | 484-FBGA (U19) - same footprint | 484-FBGA (U19) - same footprint | 484-FBGA (U19) - same footprint | 484-BGA (M15) - different ball map |
| Logic Elements | 149,500 | 149,500 | 149,500 | 77,760 (approx) | 149,500 |
| Embedded Memory (bits) | 7,880,704 | 7,880,704 | 7,880,704 | 4,462,848 | 7,880,704 |
| Transceivers | 9 channels / 3.125 Gbps | 9 channels / 3.125 Gbps | 9 channels / 3.125 Gbps | 9 channels / 3.125 Gbps | 9 channels / 3.125 Gbps |
| Operating Temperature | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C | 0C to +85C | 0C to +85C |
| Speed Grade | C8 | I7 | C6 (slower) | C8 | C8 |
| PCIe Hard IP | 2 blocks (Gen1/Gen2) | 2 blocks | 2 blocks | 2 blocks | 2 blocks |
| Unit Price (qty 1) | $105.79 | $118-$140 (industrial) | $98-$110 | $78-$95 | $115-$130 |
Wichtigste Unterscheidungsmerkmale
- Highest logic density in the 484-ball U19 footprint (vs. 5CGXBC5C7U19C8N)
- Commercial vs industrial temperature grade (vs. 5CGXBC7C7U19I7N)
- Speed-grade flexibility in identical footprint (vs. 5CGXBC7C6U19C7N)
Designhinweise
Estimated: at 1.1 V core supply and full utilization, VCCINT current may reach 1.5 A; place 22 uF + 100 nF bulk decoupling within 100 mils of each VCCINT ball group, with VCCPD (2.5/3.3 V) and VCCA (2.5 V) decoupled separately. Use a 6-layer PCB with one dedicated ground plane to minimize power-supply-induced jitter on the 3.125 Gbps transceivers. Cyclone V GX has separate PLL analog supplies (VCCA_PLL) that must be filtered with ferrite beads.
The 484-ball UBGA package has a theta_JA of approximately 12 C/W with a 1 oz copper inner ground plane and no airflow; at full fabric utilization the die may dissipate 1.5 to 2.0 W. For continuous commercial-temperature operation (0C to +85C), provide at least 10 CFM of forced airflow or a small clip-on heatsink. The industrial-grade I7N variant relaxes this requirement because the maximum ambient extends only to 100C, but thermal design must still respect the 100C junction limit.
Use the standard Intel Cyclone V GX U19 land pattern (19 mm body, 1.0 mm ball pitch) with 0.5 mm-diameter NSMD pads and microvia-in-pad for the inner rows to break out the 484 balls on a 6-layer stack-up. Match all transceiver differential pairs to 100 ohm +/- 10 percent impedance and keep intra-pair skew below 1 ps for 3.125 Gbps operation. Reference the Cyclone V GX device handbook pin-out files for exact ball assignments and bank VREF pinouts.
Do not confuse the U19 (484-ball) and M15 (484-ball) Cyclone V GX packages - they share ball count but differ in ball map, body size, and I/O count. The M15 variant uses a smaller body and exposes fewer transceivers. Mixing U19 and M15 land patterns will cause a PCB rework. Also note that LVDS channels require an external 100-ohm near-end termination; the device provides on-chip termination only for some I/O standards.
Compliance-Informationen
RoHS and REACH compliance per Intel/Altera product page for Cyclone V GX family. Not AEC-Q100 qualified - FPGAs in this family target industrial and commercial markets, not automotive. Lead-free BGA balls confirmed per Intel datasheet.
