5CGXBC9A7U19C8N - Cyclone V GX FPGA, 301K LE, 484-FBGA | Intel
Teilenummer: 5CGXBC9A7U19C8N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245 | $24.500,00 |
| 250 | $232.4 | $58.100,00 |
| 500 | $219.75 | $109.875,00 |
5CGXBC9A7U19C8N Übersicht
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic fabric, routing, and I/O behavior are defined by a user-loaded configuration bitstream. The Cyclone V GX family sits within Intel's broader FPGA hierarchy: it is a low-power variant of the Cyclone V series optimized for ASIC-prototyping, industrial motor control, video bridging, and small-form-factor wireless baseband. Compared with the lower-cost Cyclone V E family, GX devices add 3.125 Gbps transceivers and a PCIe Gen2 hard IP block; compared with the higher-end Cyclone V GT family, GX parts reduce transceiver count and target lower static power.
Key features of the 5CGXBC9A7U19C8N include 14,251,008 bits (approximately 1.66 MB) of embedded SRAM, 240 DSP blocks for fixed- and floating-point signal processing, six 3.125 Gbps transceiver channels suitable for PCIe Gen2 x1/x2 and SGMII, and 560 user I/O pins. The device is fabricated in TSMC's 28 nm low-power process and supports configuration via JTAG, Active Serial (AS), or Passive Serial (PS) modes. Hard memory controllers and PHY blocks support DDR2/DDR3/LPDDR2 external memory interfaces.
Typical applications for the 5CGXBC9A7U19C8N include industrial machine vision frame grabbers, motor-control and encoder-interfacing PLCs, low-cost PCIe I/O cards, video format converters (HDMI/DVI/DisplayPort bridging), and small-cell wireless backhaul. The 484-FBGA package is a standard JEDEC MS-034 footprint family, suitable for high-density 4-layer to 8-layer PCBs with controlled-impedance routing.
When designing with this part, plan the PCB stack-up before pin assignment because the 484-ball FBGA forces strict length-matched routing for the transceiver lanes and the DDR3 byte groups. Quartus Prime Lite (free) supports this device, simplifying low-cost development. The page below synthesizes distributor pricing, same-family Cyclone V drop-in alternatives, and practical design notes that are not collected in the manufacturer handbook.
Drop-in-Alternativen für 5CGXBC9A7U19C8N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CGXBC9A7U19C8N (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Transceivers, Configuration Modes, Embedded Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CGXBC9A6U19C8N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
5CGXBC9A7U19I7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
5CGXBC7C7U19C8N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$76.8 / Stück
Datenblatt ansehen →5CGXBC7C7U19C6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
5CGXFC7C7U19C8N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
5CGXBC9A7U19C8N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V GX |
| Logic Elements (LE) | 301,000 |
| Embedded Memory (bits) | 14,251,008 |
| DSP Blocks | 240 |
| Transceivers | 6 channels, up to 3.125 Gbps |
| Hard PCIe Gen2 Blocks | Yes |
| User I/O | 560 |
| Gehäuse | 484-ball FBGA (UBGA-19) |
| Process Node | TSMC 28 nm low-power |
| Betriebstemperatur | 0C to 85C (commercial) |
| Speed Grade | 8 |
| Configuration Modes | JTAG, AS, PS |
| External Memory Support | DDR2, DDR3, LPDDR2 |
| RoHS-Status | Compliant |
5CGXBC9A7U19C8N 484-ball fbga (ubga-19) Pinbelegungsleitfaden
Pinbelegung für 5CGXBC9A7U19C8N (484-ball fbga (ubga-19)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CGXBC9A7U19C8N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CGXBC9A7U19C8N ist geeignet für 6 Anwendungs: Industrial Motor Control, PCIe I/O Card / Endpoint, Video Format Converter / Display Bridge, Industrial Machine Vision Frame Grabber, Small-Cell Wireless Backhaul, ASIC Prototyping / Emulation.
Industrial Motor Control
The 5CGXBC9A7U19C8N fits industrial multi-axis motor control because its 240 DSP blocks handle field-oriented-control math at typical 16 kHz PWM rates, while the 560 user I/O pins accept incremental encoder, SSI, and BiSS inputs across multiple axes. The 14 Mbit of embedded SRAM holds encoder-capture FIFOs and precomputed SVM lookup tables without external memory traffic. The hard PCIe Gen2 block is not required here but does not impede the design, and the commercial 0C-85C operating range covers most factory-floor enclosures. Designers using the 5CGXBC7C7U19C8N variant lose half the logic but gain cost headroom on lower-channel-count drives.
Empfohlen
PCIe I/O Card / Endpoint
The 5CGXBC9A7U19C8N is a strong fit for low-cost PCIe Gen2 endpoint cards because the device integrates a hard PCIe Gen2 IP block capable of x1 or x2 lane operation, removing the need for soft PCIe cores. The six 3.125 Gbps transceivers can additionally carry SGMII Ethernet, Aurora, or serial RapidIO side channels for hybrid I/O cards. The 301K logic elements absorb medium-complexity DMA engines and protocol stacks (for example, PXIe or custom avionics buses), and the 484-FBGA package keeps the board within a half-length PCIe card outline. Designers needing higher transceiver count step up to the Cyclone V GT family.
Empfohlen
Video Format Converter / Display Bridge
The 5CGXBC9A7U19C8N suits HDMI/DVI/DisplayPort bridging and color-space conversion because the 240 DSP blocks execute chroma resampling and HDR tone-mapping in real time at 4K60 rates, while the 14 Mbit of embedded memory holds multiple line buffers so the design avoids external DDR3 traffic for short pipelines. The 560 user I/O pins expose LVDS, TMDS, and LVCMOS pairs needed for parallel RGB or OpenLDI panels, and the transceiver channels support serial DisplayPort or SDI output. The 484-FBGA is preferred here because it provides sufficient I/O for parallel video at 4K without aggressive multiplexing.
Empfohlen
Industrial Machine Vision Frame Grabber
The 5CGXBC9A7U19C8N fits CoaXPress, Camera Link, and GigE Vision frame grabbers because the 301K logic elements handle wide-data-width deserialization and the 240 DSP blocks run Bayer demosaicing and lens-correction kernels. The 14 Mbit of embedded memory provides line and frame buffers for real-time preprocessing before host transfer, and the integrated PCIe Gen2 x2 endpoint moves frame data to the host at line rate. The commercial 0C-85C operating range is adequate for machine-vision enclosures; vision systems needing harsher thermal margins switch to the I7N speed grade variant.
Empfohlen
Small-Cell Wireless Backhaul
The 5CGXBC9A7U19C8N fits small-cell CPRI or OBSAI backhaul because the six 3.125 Gbps transceivers carry CPRI line rates up to option 4, while the 301K logic elements implement the PHY-layer scrambling, deframing, and packet-mapping functions. The hard PCIe Gen2 block links the FPGA to the baseband SoC on the same carrier board, and the 14 Mbit of embedded SRAM holds CPRI antenna-carrier maps. The 484-FBGA package supports controlled-impedance routing required for the CPRI lanes; designers pushing CPRI option 5 or 6 require Cyclone V GT transceivers.
Empfohlen
ASIC Prototyping / Emulation
The 5CGXBC9A7U19C8N works as a building block in multi-FPGAs ASIC prototypes because the 301K logic elements map roughly 3-5 million gates of ASIC logic with the help of the 240 DSP blocks for arithmetic-heavy RTL. The 14 Mbit of embedded memory holds emulated register files and small caches, and the 560 user I/O pins expose chip-to-chip interconnect channels that split the ASIC into FPGA partitions. The 484-FBGA package is acceptable for high-density interconnect boards; large ASICs use arrays of 9A7 devices stacked through high-speed transceivers.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CGXBC9A7U19C8N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CGXBC9A6U19C8N | 5CGXBC9A7U19I7N | 5CGXBC7C7U19C8N | 5CGXBC7C7U19C6N | 5CGXFC7C7U19C8N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (UBGA-19) | 484-FBGA (UBGA-19) | 484-FBGA (UBGA-19) | 484-FBGA (UBGA-19) | 484-FBGA (UBGA-19) | 484-FBGA (UBGA-19) |
| Logic Elements | 301,000 | 301,000 | 301,000 | 149,500 | 149,500 | 149,500 |
| Embedded Memory (bits) | 14,251,008 | 14,251,008 | 14,251,008 | 7,024,640 | 7,024,640 | 7,024,640 |
| DSP Blocks | 240 | 240 | 240 | 156 | 156 | 156 |
| Transceivers | 6 ch @ 3.125 Gbps | 6 ch @ 3.125 Gbps | 6 ch @ 3.125 Gbps | 6 ch @ 3.125 Gbps | 6 ch @ 3.125 Gbps | 6 ch @ 5 Gbps |
| Hard PCIe Gen2 | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C | -40C to 100C (industrial) | 0C to 85C | 0C to 85C | 0C to 85C |
Wichtigste Unterscheidungsmerkmale
- Higher logic density at the same 484-FBGA footprint (vs. 5CGXBC7C7U19C8N)
- Higher transceiver throughput than GX mid-density (vs. 5CGXFC7C7U19C8N (Cyclone V GT))
- Commercial vs industrial temperature grade (vs. 5CGXBC9A7U19I7N)
Designhinweise
Estimated: the 484-ball FBGA package requires a 4-layer to 8-layer PCB stack-up with microvia or via-in-pad for the inner balls. Ball pitch is 1.0 mm standard for this package. Plan the stack-up before pin assignment so that transceiver lanes and DDR3 byte groups can be routed length-matched; uncontrolled impedance on the transceiver pairs will fail PCIe Gen2 compliance.
The 5CGXBC9A7U19C8N has six transceiver channels up to 3.125 Gbps; AC-coupling capacitors on the serial lines must be placed within 1 inch of the FPGA balls and reference-grounded at the AC cap pads. Use 85-ohm differential routing for the transceiver pairs to meet PCIe Gen2 and SGMII compliance, with intra-pair skew held below 5 ps for the highest line rates.
Estimated: the 5CGXBC9A7U19C8N has a typical junction-to-ambient thermal resistance in the range of 14-18 C/W for the 484-FBGA package with adequate PCB thermal vias. At full fabric utilization in a sealed industrial enclosure the device may dissipate 3-5 W; design a thermal-via array under the central ball grid to keep the junction below 100C for reliability margins.
Configuration mode pin (MSEL) settings must match the chosen boot mode (AS, PS, JTAG); incorrect MSEL strapping is a common cause of first-power-up failure. The dual-purpose configuration pins become user I/O after configuration only if the design enables that option; otherwise the pins remain in high-impedance and pull against the designer's expectations.
The DDR3 interface on the 5CGXBC9A7U19C8N requires matched-length address/command/clock routing within byte groups; use the Quartus Prime pin planner to export the matched-length rules and follow them with +/- 25 mil tolerance on DQ byte lanes. Place the DDR3 termination VTT regulator close to the FPGA to minimize the regulated current loop.
Compliance-Informationen
RoHS compliant per Cyclone V GX family datasheet. Not AEC-Q100 qualified (commercial 0C-85C grade); choose I7N speed-grade variants for industrial -40C to 100C operation.
