5CSEBA5U23C8SN - Cyclone V SE SoC FPGA, 85K LE, ARM Cortex-A9
Teilenummer: 5CSEBA5U23C8SN ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245 | $24.500,00 |
| 500 | $222 | $111.000,00 |
| 1.000 | $198.5 | $198.500,00 |
5CSEBA5U23C8SN Übersicht
What is an SoC FPGA? An SoC FPGA is a heterogeneous computing device that fuses a general-purpose application processor (typically ARM Cortex-A) with an FPGA fabric on a single die, sharing a coherent interconnect such as AXI. SoC FPGAs occupy a middle ground between pure microcontrollers (firmware-only, fixed peripherals) and traditional FPGAs (logic-only, external processor required). In the taxonomy of programmable logic devices (PLD), an SoC FPGA belongs to FPGAs > FPGAs with hard processor cores > heterogeneous SoC FPGAs. The 5CSEBA5U23C8SN is part of the Cyclone V SE family, which targets industrial, automotive driver-assistance, video surveillance, and motor-control applications.
Key features of the 5CSEBA5U23C8SN include 85K logic elements, integrated single-core ARM Cortex-A9 MPCore at up to 600 MHz with CoreSight debug and trace, a hard memory controller, and on-chip peripherals such as USB, Ethernet MAC, UART, SPI, I2C, and GPIO. The Cyclone V SE fabric delivers variable-precision DSP blocks, embedded M10K memory blocks, and PLL-based clock management. Compared with the larger Cyclone V SX/E/GX variants, the SE tier focuses on low static power and moderate transceiver needs rather than high-speed serial links.
The architecture pairs the ARM Cortex-A9 MPCore subsystem (NEON media engine, single-precision FPU, L1 cache, and 512 KB shared L2) with the Cyclone V logic fabric through a high-bandwidth on-chip interconnect. Multiport memory controllers and DDR3/ DDR3L support (via soft memory controller in the FPGA fabric) enable flexible external memory expansion. The 28 nm low-power process allows typical core voltages near 1.1 V and a junction operating range up to 100 °C for industrial use.
Typical applications include industrial machine vision, motor control, factory automation gateways, HMI panels, video surveillance edge nodes, automotive infotainment and driver-assistance subsystems, and embedded vision. Engineers select this part when they need ARM-class Linux processing plus custom hardware acceleration for image pipelines, deterministic sensor I/O, or proprietary protocols on a single chip.
When designing with the 5CSEBA5U23C8SN, pay close attention to power sequencing between the HPS and FPGA rails and to multi-boot image selection. Quartus Prime with the SoC EDS toolchain is the standard development flow. BGA escape routing requires careful PCB stack-up planning; reference the Cyclone V device handbook for pin-out and pin migration guidelines.
This page synthesizes distributor pricing, drop-in same-package alternatives, comparison parameters, and practical design notes not consolidated in the manufacturer datasheet, helping engineers source and qualify the part faster.
Drop-in-Alternativen für 5CSEBA5U23C8SN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSEBA5U23C8SN (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements, Operating Temperature, DSP Blocks, Embedded Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSEBA5U23C8N
✅ Drop-In✓ Auf Lager
$88.75 / Stück
Datenblatt ansehen →5CSEBA5U23C7SN
✅ Drop-In✓ Auf Lager
$175.2 / Stück
Datenblatt ansehen →5CSEBA5U23C7N
✅ Drop-In✓ Auf Lager
$103.88 / Stück
Datenblatt ansehen →5CSEBA5U23C6N
✅ Drop-In✓ Auf Lager
$122.33 / Stück
Datenblatt ansehen →5CSEBA5U19C8SN
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$162 / Stück
Datenblatt ansehen →5CSEBA5U23C8SN Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 85K |
| Hard Processor Core | Single ARM Cortex-A9 MPCore with CoreSight |
| Processor Frequency | 600 MHz |
| Process Technology | 28 nm low-power |
| Core Voltage (typical) | 1.1 V |
| Gehäuse | 672-UBGA (23x23 mm) |
| Terminal Count | 672 (FBGA / BGA) |
| Terminal Form | Ball |
| Montageart | Surface Mount |
| Operating Temperature Grade | Industrial |
| Memory | M10K embedded memory blocks |
| DSP Blocks | Variable-precision DSP blocks |
| Peripherals | USB, Ethernet MAC, UART, SPI, I2C, GPIO |
| RoHS-Status | Compliant |
| Lebenszyklusstatus | Active (legacy Altera part, supported by Intel) |
5CSEBA5U23C8SN 672-ubga (23x23 mm) Pinbelegungsleitfaden
Pinbelegung für 5CSEBA5U23C8SN (672-ubga (23x23 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSEBA5U23C8SN.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSEBA5U23C8SN ist geeignet für 7 Anwendungs: Industrial Motor Control, Machine Vision Edge Devices, Factory Automation Gateways, Human-Machine Interface (HMI) Panels, Video Surveillance Edge Nodes, Automotive Infotainment / Driver-Assistance Subsystems, Embedded Vision & Custom Protocol Bridging.
Industrial Motor Control
The 5CSEBA5U23C8SN is a strong fit for multi-axis industrial motor drives because its ARM Cortex-A9 HPS runs the FOC algorithm and industrial Ethernet stacks (EtherCAT, PROFINET, Modbus TCP), while the 85K-LE FPGA fabric handles deterministic PWM generation, encoder quadrature capture, and current-sense ADC interfacing. Using an SoC FPGA eliminates the need for a separate DSP or MCU, reducing BOM count and latency. The 672-UBGA package provides ample GPIO and LVDS pairs for parallel current-sensor and resolver sampling. Designers should allocate at least 20% of LE for safety logic (STO, SBC) when targeting IEC 61800 safety functions.
Empfohlen
Machine Vision Edge Devices
In industrial machine vision systems, the 5CSEBA5U23C8SN's HPS runs Linux plus OpenCV-class pre-processing, while the FPGA fabric accelerates pixel pipelines (debayer, color correction, threshold, morphology) at line rate. The 85K logic elements comfortably fit 720p60 vision pipelines, and the 672-UBGA exposes enough LVDS pairs for direct MIPI-CSI or parallel-camera interfaces. SoC integration simplifies BOM by combining CPU, GPU-free image pre-processing, and timing-critical trigger logic. Plan ~15-25% of fabric for image-line buffers using M10K blocks.
Empfohlen
Factory Automation Gateways
For industrial IoT gateways, the 5CSEBA5U23C8SN's Cortex-A9 HPS runs containerized Linux (Docker / balenaOS) and MQTT/OPC-UA stacks, while the FPGA fabric terminates fieldbuses (RS-485, CAN-FD, IO-Link) and runs deterministic pre-processing. Its 600 MHz HPS performance is sufficient for edge analytics, and the 28 nm low-power process keeps the SoC FPGA below typical 5-8 W envelope at full utilization. The 672-ball package exposes 8/16-bit EMIF for DDR3, supporting the memory needed for time-series buffering at the edge.
Empfohlen
Human-Machine Interface (HMI) Panels
In industrial HMI panels, the 5CSEBA5U23C8SN runs a Qt/HTML5 graphics stack on Linux from the HPS, while the FPGA fabric drives the TFT LCD controller, touch-screen I2C bridge, and backlight PWM. With 85K logic elements, designers can implement 2D acceleration, alpha blending, and multi-layer composition without an external GPU. The industrial temperature grade makes the part suitable for cabinet-mounted panels. Use the HPS Ethernet MAC for plant-network connectivity, and the FPGA fabric to bridge legacy parallel keypads or CANopen peripherals.
Empfohlen
Video Surveillance Edge Nodes
The 5CSEBA5U23C8SN suits edge video analytics: the HPS runs ONNX-based inference engines (e.g. TFLite, OpenVINO for ARM) for person/vehicle detection, while the FPGA fabric performs video decoding, motion detection, and privacy masking in real time. The 85K LE budget is sufficient for H.264 pre-processing plus a small custom CNN accelerator. Use the integrated EMAC for IP-camera RTSP ingest, and the FPGA fabric for SD-card or NVMe buffering. Industrial-grade screening supports outdoor cabinet deployment.
Empfohlen
Automotive Infotainment / Driver-Assistance Subsystems
Although the 5CSEBA5U23C8SN is the industrial-grade variant, the same silicon family is used in automotive-qualified Cyclone V SE SoCs for infotainment head units, digital instrument clusters, and surround-view driver-assistance (ADAS) subsystems. The ARM Cortex-A9 HPS runs QNX / Android Automotive / Linux, while the FPGA fabric handles LVDS camera aggregation, surround-view stitching assist, and graphics composition. The 672-UBGA package supports the pin density required for 4-6 camera inputs plus display outputs. Automotive projects should source the -A temperature grade from the same part family.
Empfohlen
Embedded Vision & Custom Protocol Bridging
The 5CSEBA5U23C8SN is widely used as a protocol-bridging SoC: the HPS runs standard networking (TCP/IP, MQTT, gRPC) while the FPGA fabric implements proprietary or legacy protocols (I2S, SPI, custom LVDS, serial FPGAs links). This dual role avoids the cost of two discrete chips and reduces inter-IC latency to tens of nanoseconds. The 85K LE support medium-complexity bridges with room for diagnostic logic. Designers can also use the FPGA fabric as a hardware accelerator for AES / SHA in security-sensitive bridges.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSEBA5U23C8SN – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSEBA5U23C8N | 5CSEBA5U23C7SN | 5CSEBA5U23C7N | 5CSEBA5U23C6N | 5CSEBA5U19C8SN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-UBGA (U23, 23x23 mm) | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U23, 23x23 mm) - same | 672-UBGA (U19, 19x19 mm) - different |
| Logic Elements | 85K | 85K | 85K | 85K | 85K | 85K |
| HPS Core | Single ARM Cortex-A9 @ 600 MHz | Single ARM Cortex-A9 @ 600 MHz | Single ARM Cortex-A9 @ 600 MHz | Single ARM Cortex-A9 @ 600 MHz | Single ARM Cortex-A9 @ 600 MHz | Single ARM Cortex-A9 @ 600 MHz |
| Speed Grade | 8 | 8 | 7 | 7 | 6 | 8 |
| Operating-Condition Code | SN (industrial) | N | SN (industrial) | N | N | SN (industrial) |
| Process | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
| Pin-to-Pin Drop-In | Reference | Yes (same U23 footprint) | Yes (same U23 footprint) | Yes (same U23 footprint) | Yes (same U23 footprint) | No (U19 footprint, mechanical check required) |
Wichtigste Unterscheidungsmerkmale
- Speed-grade-8 timing margin headroom (vs. 5CSEBA5U23C7SN)
- Operating-condition SN (industrial) qualification (vs. 5CSEBA5U23C8N)
- Largest 672-BGA in the SE 85K-LE lineup (vs. 5CSEBA5U19C8SN)
Designhinweise
Estimated: at 1.1 V core and 85K-LE utilization ~70%, the 5CSEBA5U23C8SN typically draws 1.5-3 W from the FPGA core plus 1-2 W from the Cortex-A9 HPS under load, with peaks to 5-6 W. Design a 4-layer PCB with dedicated power planes, decouple each VCCINT/VCCPD/HPS rail with 10 uF bulk + 100 nF high-frequency ceramic placed within 5 mm of the balls, and consider a load-switch or sequencer for the HPS cold-boot path.
Estimated: the 672-UBGA (23x23 mm) package has theta_JA around 12-15 C/W with a 4-layer JEDEC test board. With 4-5 W typical dissipation, junction-to-ambient rise is 48-75 C, requiring industrial-grade ambient derating above ~50 C. Use thermal vias in the BGA land pattern and a copper spreader on the top-side inner row to keep junction temperature under 100 C in industrial cabinets.
Route all HPS peripheral traces (USB, EMAC, RGMII, DDR3) with 100 ohm differential impedance, keep DDR3 reference-plane unbroken under the BGA, and escape the inner balls using laser-drilled microvias (0.1 mm pitch). Use a 1.0 mm BGA pitch escape with dog-bone fanout for the outer two rows and via-in-pad only if the assembly house supports it. Plan for at least 8 layers (top, GND, signal, signal, power, signal, signal, bottom) on industrial layouts.
Do not assume the HPS can boot from raw NAND without configuring the Boot Select pins - the 5CSEBA5U23C8SN requires BSEL[2:0] strap resistors to choose between SD/MMC, QSPI, or NAND sources. Confirm Quartus Prime and SoC EDS toolchain version compatibility (17.1 or later recommended) before starting the design; older versions may lack device support. Also note that programming files generated for speed-grade 8 do not run on speed-grade 7 devices - regenerate the SOF/JIC for the new speed grade.
Compliance-Informationen
RoHS and REACH compliance are stated on the Intel/Altera Cyclone V product pages. The 5CSEBA5U23C8SN is the industrial-grade variant, not AEC-Q100 qualified — for automotive projects select the -A temperature grade device from the same silicon family. Halogen-free status not explicitly listed; treat as unknown unless confirmed on the lot certificate.