5CSEBA4U23C7N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
Teilenummer: 5CSEBA4U23C7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $164.91 | $164,91 |
| 10 | $156.5 | $1.565,00 |
| 100 | $142 | $14.200,00 |
| 500 | $131.2 | $65.600,00 |
| 1.000 | $124.5 | $124.500,00 |
5CSEBA4U23C7N Übersicht
A System-on-Chip (SoC) FPGA is a class of heterogeneous computing device that fuses a general-purpose microprocessor subsystem with a programmable FPGA fabric on a single silicon die. Within the broader taxonomy of ICs, SoC FPGAs sit at the intersection of microcontrollers (MPU/MCU), application processors, and standalone FPGAs, providing a reconfigurable hardware acceleration path for data-plane workloads. The Cyclone V SE family specifically targets cost- and power-sensitive applications where the integration of ARM cores eliminates a companion processor chip, reduces board area, and simplifies the bill of materials for industrial, automotive, and communications designs.
Key features include 40K logic elements, 224 DSP blocks (18x18 multipliers), approximately 2.7 Mbits of embedded memory (M10K + M9K), six high-speed transceivers operating up to 3.125 Gbps, two PCIe Gen2 hard IP blocks, and an integrated HPS with dual Cortex-A9 cores, NEON media engine, L1/L2 caches, and a multiport SDRAM controller supporting DDR3, DDR3L, and LPDDR2 memories. The package exposes 364 user I/Os plus HPS-specific pins (DDR, NAND, USB, Ethernet MAC, SPI, I2C, UART), giving designers a rich set of peripheral interfaces without external bridges.
The hardened ARM Cortex-A9 MPCore subsystem offloads control-plane tasks and operating-system execution from the FPGA fabric, freeing programmable logic for parallel DSP, packet processing, or sensor-fusion pipelines. Hardware accelerators in the fabric can be reconfigured at runtime via partial reconfiguration, while the HPS boots from QSPI NOR flash, SD card, or NAND, then handshakes with the FPGA portion through a 128-bit wide AXI bridge that supports cache-coherent and non-coherent transactions. The TSMC 28 nm low-power process typically yields static power below 0.5 W for the FPGA portion at room temperature, and the device includes on-die temperature sensing diodes for thermal management.
Typical applications include industrial machine vision cameras, factory automation controllers, automotive driver-assistance ECU prototypes, motor control inverter platforms, video surveillance and broadcast encoder boards, software-defined radio baseband cards, and portable medical diagnostic instruments. The combination of deterministic real-time control in the HPS and parallel processing in the FPGA fabric is particularly attractive for sensor-fusion and protocol-bridging designs.
When designing with this device, allocate at least four PCB layers for power and ground planes, place MLCC decoupling within 5 mm of each supply pin, and ensure the MPU/MPU PLL reference clock meets the +/- 50 ppm jitter specification. Quartus Prime software (Standard or Pro) is required for synthesis, place-and-route, and HPS configuration; Intel also provides Golden System Reference Designs (GSRD) that include prebuilt U-Boot, UEFI, and Linux images to accelerate bring-up.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical SoC FPGA design notes not consolidated in the manufacturer datasheet, offering engineers a faster triage path for Cyclone V SE SoC selection.
Drop-in-Alternativen für 5CSEBA4U23C7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSEBA4U23C7N (gleiche Bauform und Footprint) – abweichend in Package, Logic Elements, Process Technology, Operating Temperature, HPS Peripherals.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSEBA4U23C6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$86.2 / Stück
Datenblatt ansehen →5CSEBA4U23A7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$185 / Stück
Datenblatt ansehen →5CSEBA4U23I7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →5CSEBA4U23C7N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SE SoC FPGA |
| Device Variant | 5CSEA4 (Logic Element density) |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 40,000 |
| HPS Maximum Core Frequency | 800 MHz |
| DSP Blocks (18x18) | 224 |
| Embedded Memory | Approximately 2.7 Mbits (M10K + M9K) |
| Gehäuse | 672-ball UBGAs (UBGA), 23x23 mm |
| Core Voltage | 1.1 V |
| User I/O Count | 364 |
| High-Speed Transceivers | 6 (up to 3.125 Gbps) |
| PCIe Hard IP | 2 Gen2 blocks |
| Betriebstemperatur | Commercial 0C to +85C (C7 speed grade) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Process Technology | TSMC 28 nm low-power |
| HPS Memory Interface | DDR3, DDR3L, LPDDR2 (16-bit + ECC option) |
5CSEBA4U23C7N 672-ball ubgas (ubga), 23x23 mm Pinbelegungsleitfaden
Pinbelegung für 5CSEBA4U23C7N (672-ball ubgas (ubga), 23x23 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSEBA4U23C7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSEBA4U23C7N ist geeignet für 6 Anwendungs: Industrial Machine Vision Camera, Factory Automation Controller (PLC + Motion), Software-Defined Radio Baseband Card, Automotive Driver-Assistance ECU Prototyping, Video Surveillance and Broadcast Encoder, Portable Medical Diagnostic Instrument.
Industrial Machine Vision Camera
The 5CSEBA4U23C7N is well suited to industrial machine vision cameras because it integrates a dual ARM Cortex-A9 HPS running Linux for camera protocol stack, GigE Vision or USB3 Vision handling, and a 40K-LE FPGA fabric for parallel image-processing pipelines. The 224 DSP blocks deliver real-time 2D filtering, color conversion, and defect-detection kernels at line rates up to several hundred MPixels/s, while the six 3.125 Gbps transceivers natively drive Camera Link or CoaXPress links without external bridges. The 364 user I/Os expose parallel sensor interfaces (LVDS, sub-LVDS, MIPI CSI-2 with soft IP), reducing component count. Power consumption of approximately 5 W for the FPGA portion keeps thermal design simple for sealed IP67 enclosures.
Empfohlen
Factory Automation Controller (PLC + Motion)
For factory automation controllers, the 5CSEBA4U23C7N combines deterministic real-time control on the Cortex-A9 HPS with parallel motion-control loops in the FPGA fabric. The HPS runs a Linux real-time extension (PREEMPT-RT) or RTOS for PLC scan cycles under 1 ms, while the FPGA implements up to 16 axes of closed-loop servo control with encoder feedback, PWM generation, and EtherCAT slave IP at sub-microsecond jitter. The 16-bit DDR3 controller with ECC supports reliable boot and code execution in electrically noisy industrial environments. The 672-ball UBGAs package provides 364 user I/Os for direct connection to digital I/O cards, eliminating external bus expanders in compact DIN-rail mounted designs.
Empfohlen
Software-Defined Radio Baseband Card
The 5CSEBA4U23C7N serves as a baseband processing card in software-defined radio systems, with the FPGA fabric implementing channelizers, FFT engines, and digital down/up-converters, while the Cortex-A9 HPS runs network stacks, signal-classification algorithms, and remote-management agents. The 224 18x18 DSP blocks deliver up to 53 GMACS of fixed-point throughput, sufficient for 100 MHz instantaneous bandwidth LTE or 5G NR signal chains. Six 3.125 Gbps transceivers connect to ADC/DAC companion devices such as the AD9680BCPZ-500 or ADAR1000ACCZN over JESD204B, removing the need for parallel LVDS routing. PCI Express Gen2 hard IP simplifies host-card integration over a standard x1 or x2 edge connector.
Empfohlen
Automotive Driver-Assistance ECU Prototyping
In automotive driver-assistance ECUs and ADAS prototyping platforms, the 5CSEBA4U23C7N provides sensor-fusion capability across radar, camera, and lidar streams. The Cortex-A9 HPS runs AUTOSAR or Linux for object classification and vehicle-state logic, while the FPGA fabric implements low-latency sensor-fusion pipelines and CAN-FD or FlexRay bridge interfaces. The 6 transceivers feed multiple 77 GHz radar front-ends over LVDS, while DDR3 with ECC supports deterministic middleware execution. Designers targeting production-grade qualification can step up to the 5CSEBA4U23A7N automotive speed grade, which retains the same 672 UBGAs footprint and pinout. The wide operating temperature and automotive PPAP documentation accelerate ISO 26262 functional-safety prototyping.
Empfohlen
Video Surveillance and Broadcast Encoder
The 5CSEBA4U23C7N fits video surveillance and broadcast encoder applications because the FPGA fabric implements multi-channel H.264/H.265 encode, motion-JPEG, or ONVIF-friendly RTP pipelines, while the Cortex-A9 HPS runs a Linux media stack (GStreamer, v4l2) and analytics software. The six 3.125 Gbps transceivers support SDI (SMPTE 424M), HDMI-over-IP, or bonded cellular uplinks for mobile broadcast. The 2.7 Mbits of embedded memory provides frame-line buffering for 4K resolution pipelines without external SRAM, simplifying PCB layout. The 364 user I/Os interface to MIPI CSI-2 image sensors, HDMI receivers, and audio CODECs, enabling complete 4K encoder boards in a single device.
Empfohlen
Portable Medical Diagnostic Instrument
In portable medical diagnostic instruments such as handheld ultrasound or point-of-care analyzers, the 5CSEBA4U23C7N delivers the right balance of low power (under 5 W typical), DSP horsepower, and ARM Cortex-A9 processing for control-plane tasks. The 224 DSP blocks accelerate beamforming, FIR filtering, and I/Q demodulation in ultrasound receivers, while the HPS runs the user interface, network connectivity (Ethernet MAC exposed via HPS), and data-management software. The 16-bit DDR3 controller with ECC supports medical-grade data integrity for patient-record storage. The 672-ball UBGAs package footprint allows miniaturized board layouts suitable for battery-powered handheld form factors with limited heatsinking.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSEBA4U23C7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSEBA4U23C6N | 5CSEBA4U23A7N | 5CSEBA4U23I7N | 5CSEBA4U19I7N |
|---|---|---|---|---|---|
| Package | 672-ball UBGAs (U23), 23x23 mm | 672-ball UBGAs (U23) - same | 672-ball UBGAs (U23) - same | 672-ball UBGAs (U23) - same | 484-ball FBGA (U19) - different footprint |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40,000 | 40,000 (same) | 40,000 (same) | 40,000 (same) | 40,000 (same) |
| Hard Processor System | Dual Cortex-A9 MPCore, 800 MHz | Dual Cortex-A9 MPCore, 800 MHz (same) | Dual Cortex-A9 MPCore, 800 MHz (same) | Dual Cortex-A9 MPCore, 800 MHz (same) | Dual Cortex-A9 MPCore, 800 MHz (same) |
| Speed Grade | C7 | C6 (slower) | A7 (automotive) | C7 (same speed) | I7 (industrial, same speed as C7) |
| Operating Temperature | Commercial 0C to +85C | Commercial 0C to +85C | Automotive -40C to +125C | Industrial -40C to +100C | Industrial -40C to +100C |
| DSP Blocks (18x18) | 224 | 224 (same) | 224 (same) | 224 (same) | 224 (same) |
| High-Speed Transceivers | 6 (up to 3.125 Gbps) | 6 (up to 3.125 Gbps) - same | 6 (up to 3.125 Gbps) - same | 6 (up to 3.125 Gbps) - same | 6 (up to 3.125 Gbps) - same |
| User I/O Count | 364 | 364 (same) | 364 (same) | 364 (same) | 224 (U19 reduced footprint) |
Wichtigste Unterscheidungsmerkmale
- Commercial C7 speed grade with industrial upgrade path to A7/I7 (vs. 5CSEBA4U23C6N)
- Hardened dual Cortex-A9 HPS eliminates companion processor chip (vs. Cyclone V E FPGA (no HPS))
- Six 3.125 Gbps transceivers and two PCIe Gen2 hard IP blocks (vs. Cyclone V GX (no HPS, has transceivers))
Designhinweise
The 5CSEBA4U23C7N requires multiple supply rails: 1.1 V core (VCC, VCC_HPS), 2.5 V analog PLL (VCCA_PLL), 1.8 V/2.5 V/3.0 V/3.3 V HPS I/O, and 1.2 V-1.5 V DDR3 supply with separate VREF. Decouple each rail with 0.1 uF X7R MLCCs placed within 5 mm of every supply pin, and bulk 100 uF polymer tantalum capacitors on the 1.1 V core rail. Estimated: at typical utilization (40K LEs, 800 MHz HPS, 5 Gbps transceivers), total board-level power consumption reaches 8-10 W; design thermal mass and heatsinking accordingly. The Cyclone V power estimator in Quartus Prime should be run after place-and-route for accurate budgeting.
Although the Cyclone V 28 nm low-power process yields relatively low static dissipation, dense designs with high toggle rates can drive junction temperatures up. The 672-ball UBGAs package has a junction-to-ambient thermal resistance (theta_JA) of approximately 12 C/W with 4-layer JEDEC JESD51-7 test board. At 10 W dissipation, junction rise is approximately 120C above ambient. For commercial 0C to +85C operation, ensure ambient never exceeds 70C with conservative airflow, or step up to the I7 industrial grade with an extended thermal envelope. Thermal diodes are accessible via the internal hard-macro block for real-time monitoring.
The 672-ball UBGAs uses 1.0 mm ball pitch, which demands 4-6 PCB signal layers with microvia or via-in-pad construction for fan-out. Pair microstrip and stripline impedance control at 50 ohms single-ended for transceivers and 100 ohms differential for DDR3. Match DDR3 trace lengths to within 25 mils (length-matched pairs) per the Cyclone V External Memory Interface Handbook. Place reference clock sources (50 MHz or 100 MHz crystal for HPS PLL) within 200 mils of the REFCLK pin with isolation from noisy digital signals. The High-Speed Transceiver interfaces require AC-coupled coupling capacitors with controlled pad layout per Altera's transceiver layout guidelines.
Common pitfalls include: (1) forgetting to assert the HPS cold or warm reset sequence correctly before firmware loads; (2) configuring the FPGA fabric before the HPS boots causes boot failures because the boot ROM expects MSEL pins set correctly for the chosen boot source (QSPI/NAND/SD); (3) violating the 1.1 V core supply tolerance of +/- 30 mV leads to configuration errors - use a high-accuracy DC-DC regulator; (4) ignoring the HPS-to-FPGA AXI bridge clock-domain crossings causes data corruption; and (5) failing to assign the MSEL[3:0] pins correctly for the desired configuration scheme (AS, PS, JTAG, FPP) results in silent configuration failure.
Compliance-Informationen
RoHS compliant per Altera product page. C7 commercial speed grade is NOT AEC-Q100 qualified; select 5CSEBA4U23A7N for automotive. Lead-free UBGAs suitable for Pb-free reflow per JEDEC J-STD-020.
