5CSXFC2C6U23C8N - Cyclone V SX SoC FPGA, 25K LE, 672-UBGA | Intel
Teilenummer: 5CSXFC2C6U23C8N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $121 | $12.100,00 |
| 500 | $112 | $56.000,00 |
| 1.000 | $105 | $105.000,00 |
5CSXFC2C6U23C8N Übersicht
An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a hybrid device that combines a programmable logic fabric with a hard-application-processor subsystem on a single die. Within the broader taxonomy, an SoC FPGA belongs to programmable logic devices -> FPGAs -> SoC FPGAs -> hybrid processors; the Cyclone V family occupies the low-power, high-functionality tier of Intel's FPGA portfolio. The SX sub-family specifically pairs the ARM Cortex-A9 HPS with FPGA fabric optimized for DSP-rich applications, with variable-precision DSP blocks available alongside the HPS.
Key features for the 5CSXFC2C6U23C8N include 25K logic elements, embedded hard memory controllers, dedicated DDR3 memory interfaces, variable-precision DSP blocks, integrated transceivers (where variant supports), up to 600 MHz HPS clock, and a 1.1 V core operating voltage. The C8 speed grade balances timing performance and power for commercial-temperature applications, and the U23 package designation (UBGA-672, 23x23 mm) provides a generous ball grid for high I/O density designs.
The Cyclone V SX architecture uses TSMC's 28nm low-power process and an enhanced adaptive logic module (ALM) fabric. The HPS integrates dual ARM Cortex-A9 MPCore cores with NEON media engine, single/double-precision floating-point unit, L1/L2 caches, ARM CoreSight debug, and a rich peripheral set (EMAC, USB, NAND, SD/SDIO, SPI, UART, I2C). Tight coupling between the HPS and FPGA fabric via AXI/ Avalon bridges enables deterministic hardware acceleration offload from the application processors.
Typical applications include industrial motor control, machine vision, industrial Ethernet protocols (EtherCAT, PROFINET), smart-grid energy management, portable medical imaging, broadcast video processing, and software-defined radio. The combination of an application processor with deterministic FPGA fabric is well-suited to applications requiring both real-time control loops and high-level OS-based processing.
When designing with this device, ensure that the Quartus Prime design toolchain supports the U23 package and that the HPS-FPGA bridge pin assignments match the chosen AXI/ Avalon topology. Plan for adequate power decoupling and thermal dissipation: even at the C8 speed grade, the SoC can approach 5-8 W under full HPS+FPGA load on a 1.1 V core rail.
This page synthesizes distributor pricing, drop-in alternatives from the Cyclone V SX and SE families, recommended companion ICs, and practical design notes not found in a single source on the manufacturer datasheet.
Drop-in-Alternativen für 5CSXFC2C6U23C8N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSXFC2C6U23C8N (gleiche Bauform und Footprint) – abweichend in Package, DSP Blocks, Logic Elements, Process Technology, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSXFC2C6U23C7N
✅ Drop-In✓ Auf Lager
$18.9 / Stück
Datenblatt ansehen →5CSXFC2C6U23C6N
✅ Drop-In✓ Auf Lager
$142 / Stück
Datenblatt ansehen →5CSXFC2C6U23A7N
✅ Drop-In✓ Auf Lager
$31.75 / Stück
Datenblatt ansehen →5CSEBA6U23C8N
✅ Drop-In✓ Auf Lager
$132 / Stück
Datenblatt ansehen →5CSEBA6U23C7N
✅ Drop-In✓ Auf Lager
$185 / Stück
Datenblatt ansehen →5CSEBA5U23C8N
✅ Drop-In✓ Auf Lager
$88.75 / Stück
Datenblatt ansehen →5CSXFC2C6U23C8N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SX |
| Series | 5CSXC2 |
| Logic Elements | 25,000 |
| Architecture | MCU + FPGA (SoC with dual ARM Cortex-A9 MPCore + FPGA fabric) |
| Core Voltage | 1.1 V |
| Process Technology | 28 nm |
| HPS Clock Frequency (max) | 600 MHz |
| Speed Grade | C8 |
| Gehäuse | 672-pin UBG (UBGA) 23x23 mm |
| Montageart | Surface Mount (BGA) |
| Betriebstemperatur | 0C to +85C (commercial) |
| Memory Interface | DDR3, DDR2, LPDDR2 hard memory controllers |
| DSP Blocks | Variable-precision DSP blocks |
| HPS Peripherals | EMAC, USB 2.0 OTG, NAND, SD/SDIO/MMC, SPI, UART, I2C, GPIO |
| Packaging | Tray |
| RoHS-Status | Compliant |
5CSXFC2C6U23C8N 672-pin ubg (ubga) 23x23 mm Pinbelegungsleitfaden
Pinbelegung für 5CSXFC2C6U23C8N (672-pin ubg (ubga) 23x23 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSXFC2C6U23C8N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSXFC2C6U23C8N ist geeignet für 6 Anwendungs: Industrial Motor Control, Machine Vision and Industrial Imaging, Software Defined Radio Baseband, Smart Grid Energy Management, Portable Medical Imaging, Broadcast Video Processing.
Industrial Motor Control
The 5CSXFC2C6U23C8N fits multi-axis industrial motor control because its dual ARM Cortex-A9 MPCore HPS runs real-time control loops and fieldbus stacks (EtherCAT, PROFINET, EtherNet/IP) while the Cyclone V SX FPGA fabric accelerates time-critical PWM generation, encoder decoding, and current-loop math in variable-precision DSP blocks. The 25K LE count supports two to three axes of FOC (field-oriented control) including SVPWM modulators, Hall/encoder interfaces, and protection logic. The UBGA-672 (U23) package exposes enough HPS+FPGA I/O for parallel bus interfaces to power-stage gate drivers, multi-axis ADC sampling, and HMI peripherals.
Empfohlen
Machine Vision and Industrial Imaging
The 5CSXFC2C6U23C8N is a strong fit for machine-vision pre-processing and image-pipeline accelerators. Its SX-class FPGA fabric implements Bayer demosaic, color-space conversion, and Sobel/edge filters in parallel pipelined DSP blocks; the HPS runs classification algorithms, the Linux camera stack, and TCP/IP for result forwarding. With 25K LE plus variable-precision DSP, the device supports one 1080p60 image pipeline at full throughput. The UBGA-672 package exposes MIPI CSI-2 RX, parallel CMOS, and LVDS sensor interfaces alongside GigE-Vision MAC in the FPGA fabric.
Empfohlen
Software Defined Radio Baseband
The 5CSXFC2C6U23C8N suits SDR baseband processing because its SX-class FPGA fabric implements DDC/DUC, channelizers, and PHY-layer modulators in variable-precision DSP blocks, while the dual ARM Cortex-A9 HPS runs upper-layer protocol stacks (MAC, networking, GNU Radio). With 25K LE plus FPGA DSP, the device handles 2x2 MIMO LTE small-cell baseband or single-channel 20 MHz 5G NR baseband pre-processing. The 600 MHz HPS offloads scheduler and networking tasks from the FPGA, accelerating deterministic latency-critical paths.
Empfohlen
Smart Grid Energy Management
The 5CSXFC2C6U23C8N is well-suited to smart-grid energy and substation automation because the dual ARM Cortex-A9 HPS runs IEC 61850 stack and security, while the FPGA fabric accelerates GOOSE-message processing, Sampled Values (SV) stream decoding, and PMU/FFT math. With 25K LE plus variable-precision DSP, the device handles one feeder bay plus metering. The UBGA-672 U23 package supports multi-channel 16-bit ADC interfacing for current/voltage sensing and isolated Ethernet PHYs for process-bus connectivity.
Empfohlen
Portable Medical Imaging
The 5CSXFC2C6U23C8N fits portable ultrasound and point-of-care imaging because the dual ARM Cortex-A9 HPS runs Linux + application layer (DICOM, image rendering, GUI) while the FPGA fabric accelerates beamforming, FIR filters, and envelope-detection in variable-precision DSP blocks. With 25K LE, the device supports a 32-channel portable ultrasound beamformer. The C8 commercial speed grade and 28nm low-power process keep the device within portable-battery thermal envelopes; HPS peripherals (USB 2.0 OTG, SD/SDIO, EMAC) simplify connectivity.
Empfohlen
Broadcast Video Processing
The 5CSXFC2C6U23C8N is appropriate for broadcast video format conversion and overlay processing because the SX-class FPGA fabric implements multi-format scalers, color-space converters, and HDR metadata insertion in parallel pipelines; the ARM Cortex-A9 HPS runs Linux + control software for channel branding and audio mixing. With 25K LE plus embedded DSP, the device handles 1080p60 SDI-to-HDMI bridging with on-screen display overlay. The UBGA-672 U23 package supports multi-channel SDI, HDMI, and audio I/O via FPGA soft IP.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSXFC2C6U23C8N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSXFC2C6U23C7N | 5CSXFC2C6U23C6N | 5CSXFC2C6U23A7N | 5CSEBA6U23C8N | 5CSEBA6U23C7N | 5CSEBA5U23C8N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin UBGA (U23) 23x23 mm | 672-pin UBGA (U23) 23x23 mm - same | 672-pin UBGA (U23) 23x23 mm - same | 672-pin UBGA (U23) 23x23 mm - same | 672-pin UBGA (U23) 23x23 mm - same | 672-pin UBGA (U23) 23x23 mm - same | 672-pin UBGA (U23) 23x23 mm - same |
| Family / Sub-family | Cyclone V SX | Cyclone V SX - same | Cyclone V SX - same | Cyclone V SX - same | Cyclone V SE - different | Cyclone V SE - different | Cyclone V SE - different |
| Logic Elements | 25,000 | 25,000 (same) | 25,000 (same) | 25,000 (same) | 110,000 (+340%) | 110,000 (+340%) | 85,000 (+240%) |
| Speed Grade | C8 | C7 (-1 bin) | C6 (-2 bins) | A7 (automotive) | C8 (same) | C7 (-1 bin) | C8 (same) |
| HPS / Architecture | Dual ARM Cortex-A9 + SX FPGA fabric | Dual ARM Cortex-A9 + SX fabric - same | Dual ARM Cortex-A9 + SX fabric - same | Dual ARM Cortex-A9 + SX fabric - same | Dual ARM Cortex-A9 + SE fabric - same HPS, lower-power FPGA class | Dual ARM Cortex-A9 + SE fabric - same HPS | Dual ARM Cortex-A9 + SE fabric - same HPS |
| HPS Clock (max) | 600 MHz | 600 MHz - same | 600 MHz - same | 600 MHz - same | 925 MHz (higher) | 925 MHz (higher) | 925 MHz (higher) |
| Process / Core Voltage | 28 nm / 1.1 V | 28 nm / 1.1 V - same | 28 nm / 1.1 V - same | 28 nm / 1.1 V - same | 28 nm / 1.1 V - same | 28 nm / 1.1 V - same | 28 nm / 1.1 V - same |
Wichtigste Unterscheidungsmerkmale
- Cyclone V SX sub-family with variable-precision DSP blocks (vs. 5CSEBA6U23C8N (Cyclone V SE))
- 25K LE for cost-effective moderate-density designs (vs. 5CSEBA6U23C8N (110K LE))
- C8 commercial speed grade - fastest commercial timing (vs. 5CSXFC2C6U23C7N (C7 speed grade))
Designhinweise
The Cyclone V SX 5CSXFC2C6U23C8N requires multiple power rails: a 1.1 V core rail (VCCINT), a 1.1 V/1.2 V HPS rail (VCC_HPS), and a 2.5 V/3.3 V I/O rail (VCCIO). The HPS and FPGA core can each draw 1-3 A under load. Use a 4-6 phase buck regulator or a dedicated PMIC (such as the Intel Enpirion EM2130x family) to supply VCCINT, and bulk decoupling with 4-8 ceramic capacitors placed symmetrically around the package periphery. Ensure each VCC_HPS pin has its own 0.1uF + 1uF + 10uF cap stack within 3 mm of the ball.
Estimated: at 1.1 V core, with HPS active (~1.5 W) and FPGA fabric ~75% utilized (~2.5 W), the SoC can dissipate 4 W. The UBGA-672 package theta_JA is approximately 14 C/W on a standard 4-layer JEDEC board with thermal vias, so junction temperature rises ~56 C above ambient. For commercial-temperature (0C to 85C ambient max), this is acceptable in still air but pushes the limit. For industrial enclosures, add 4-6 thermal vias under the package center and consider bottom-side copper pours of at least 4 cm^2. Always derate by 20-30% from the datasheet thermal resistance for production boards.
BGA escape routing demands a 0.8 mm or 1.0 mm pitch fanout. Use microvia (HDI) stack-ups where the top layer routes two rows between balls, then dog-bone fanout from inner rows to via-in-pad on deeper layers. Match length-matched pairs for DDR3: the HPS-side DDR3 controller supports up to DDR3-1066 (533 MHz). Pin-swap is not permitted on HPS peripheral pins without re-validating the Quartus Prime pin assignments; use the Pin Planner to assign and validate all HPS pin locations before tape-out.
Common pitfalls include: (1) forgetting to power-cycle the HPS reset after HPS configuration load (use the warm/cold reset toggles in Quartus); (2) ignoring the C8 vs C7 speed grade in timing closure - C8 (this part) is the fastest commercial grade, so timing margins are tighter than C7 alternatives; (3) not enabling the HPS-to-FPGA bridges (AXI/ Avalon) before software tries to access FPGA peripherals from the ARM cores; (4) using the wrong configuration mode - the 5CSXFC2C6U23C8N supports AS (Active Serial) x4 and JTAG, but defaults vary by board design.
Compliance-Informationen
RoHS compliant per Intel/Altera product page. The C8 commercial speed grade is not AEC-Q100 qualified; for automotive, use the A7 speed variant 5CSXFC2C6U23A7N. Lead-free and halogen-free per package material declarations.
