5CSXFC5C6U23C6N - Cyclone V SX SoC FPGA, 85K LE, Dual ARM Cortex-A9 | Intel
Teilenummer: 5CSXFC5C6U23C6N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $175 | $175.000,00 |
5CSXFC5C6U23C6N Übersicht
A SoC FPGA is a heterogeneous computing device that merges a general-purpose application processor subsystem (the Hard Processor System, or HPS) with a programmable FPGA fabric on a single die. The HPS typically runs an OS such as Linux, VxWorks, or RTOS, while the FPGA fabric accelerates custom logic, DSP, or high-bandwidth I/O. Compared with a discrete CPU-plus-FPGA two-chip solution, a SoC FPGA reduces board area, simplifies the high-speed interconnect (in this case AXI/ACP), lowers BOM cost, and enables tighter latency between software tasks and hardware accelerators.
Key features of this part include the dual ARM Cortex-A9 cores with NEON media engine and single/double-precision FPU, 32 KB of L1 instruction and 32 KB of L1 data cache per core, hardware floating-point support, and integrated CoreSight trace. The FPGA side delivers 85K logic elements, 3.88 Mbit of embedded SRAM, dedicated 18x18 multipliers for DSP, and 145 general-purpose I/Os. The 'C6' speed grade targets commercial temperature operation at -0C to +85C, and '6' denotes the logic and HPS performance bin.
Architecturally, the Cyclone V SX device uses TSMC's 28 nm low-power process, which enables a static power envelope typically 40% lower than the previous Cyclone IV generation. The HPS-to-FPGA interface is implemented through a high-bandwidth AXI-64 coherent bus bridge (ACP) that allows L2 cache-coherent DMA between CPU and FPGA logic, eliminating the need for external FIFOs in many data-movement workloads. The device also integrates hardened memory controllers (LPDDR2, DDR3), PCIe Gen2, Gigabit Ethernet MAC, USB 2.0, and a NAND/SD/eMMC controller inside the HPS block.
Typical applications include industrial motor control, factory automation controllers, machine vision pre-processing, smart-grid measurement hardware, secure payment terminals, and embedded vision/AI edge nodes. The combination of a deterministic real-time OS on the HPS with custom parallel pipelines in the FPGA fabric makes this part especially attractive for protocols such as EtherCAT, PROFINET, EtherNet/IP, and SERCOS-III master implementations, where deterministic cycle times under 100 microseconds are required.
A key design consideration for engineers is that the 672-UBGA package has 0.8 mm ball pitch and demands PCB stack-up with impedance-controlled HPS traces (typically 4-layer minimum with 100-ohm differential pairs for RGMII and 90-ohm for USB). Designers should also plan for the boot configuration source (NAND, SD/eMMC, or QSPI) and provision for the dedicated HPS clock pin to avoid jitter-related DDR3 margin loss.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement, hardware, and embedded engineers a single source for parametric, application, and supply-chain decision-making.
Drop-in-Alternativen für 5CSXFC5C6U23C6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSXFC5C6U23C6N (gleiche Bauform und Footprint) – abweichend in Logic Elements, Package, Speed Grade, Family, Embedded Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSXFC5C6U23A7N
✅ Drop-In✓ Auf Lager
$64.4 / Stück
Datenblatt ansehen →5CSXFC5C6U23C7N
✅ Drop-In✓ Auf Lager
$348 / Stück
Datenblatt ansehen →5CSXFC4C6U23C6N
✅ Drop-In✓ Auf Lager
$215.4 / Stück
Datenblatt ansehen →5CSXFC2C6U23C6N
✅ Drop-In✓ Auf Lager
$142 / Stück
Datenblatt ansehen →5CSEBA6U23C6N
✅ Drop-In✓ Auf Lager
$185 / Stück
Datenblatt ansehen →5CSEBA5U23C6N
✅ Drop-In✓ Auf Lager
$122.33 / Stück
Datenblatt ansehen →5CSXFC5C6U23C6N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 85,000 LE |
| Adaptive Logic Modules (ALMs) | 32,070 ALM |
| Embedded Memory | 3.88 Mbit |
| Number of User I/Os | 145 I/O |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Number of HPS Cores | 2 |
| HPS Maximum Clock Frequency | 925 MHz |
| L1 Cache (Instruction, per core) | 32 KB |
| L1 Cache (Data, per core) | 32 KB |
| Process Technology | TSMC 28 nm low-power |
| Speed Grade | 6 |
| Temperature Grade | Commercial (0C to +85C) |
| Gehäuse | 672-pin UBGA (23x23 mm), 0.8 mm ball pitch |
| Montageart | Surface Mount (BGA) |
| MSL-Level | 3 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant |
5CSXFC5C6U23C6N 672-pin ubga (23x23 mm), 0.8 mm ball pitch Pinbelegungsleitfaden
Pinbelegung für 5CSXFC5C6U23C6N (672-pin ubga (23x23 mm), 0.8 mm ball pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSXFC5C6U23C6N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSXFC5C6U23C6N ist geeignet für 6 Anwendungs: Industrial Motor Control, Factory Automation Controllers (PLC / PAC), Machine Vision Pre-Processing, Smart-Grid Measurement Hardware, Secure Payment Terminals, Embedded Vision / AI Edge Nodes.
Industrial Motor Control
The 5CSXFC5C6U23C6N is well-suited to industrial motor control because its dual ARM Cortex-A9 HPS runs at 925 MHz with NEON/FPU and executes real-time EtherCAT/PROFINET state machines, while the 85K-logic-element FPGA fabric implements deterministic PWM generation, encoder decoding, and current-sampling ADCs. Per Intel's Cyclone V motor-control reference design, this combination delivers sub-100-microsecond deterministic cycle times required by IEC 61131-3 servo loops. The AXI-64 ACP coherent bridge lets the CPU access FPGA accelerator results without software-managed buffers, lowering interrupt latency and enabling field-oriented control (FOC) at 32 kHz PWM with closed-loop bandwidth above 1 kHz. The 672-UBGA package exposes 145 user I/Os which is sufficient for multi-axis drives (3 axes fit with quadrature encoder + SPI DAC + current sense).
Empfohlen
Factory Automation Controllers (PLC / PAC)
The 5CSXFC5C6U23C6N fits PLC and PAC applications because the dual-core Cortex-A9 HPS runs Codesys, Linux, or VxWorks for IEC 61131-3 ladder/structured-text execution, while the 85K-LE FPGA fabric implements deterministic industrial Ethernet slaves (EtherCAT, PROFINET, EtherNet/IP). Per the Cyclone V device handbook, the integrated AXI-64 ACP bridge lets the HPS Linux stack and FPGA hardware accelerators share memory coherently, eliminating the DMA interrupts typical of two-chip solutions. The 3.88 Mbit of embedded SRAM is sufficient to buffer 8 EtherCAT slave frames without external memory, and the 145 user I/Os cover 32 digital inputs, 32 digital outputs, and the dedicated HPS peripheral pins. Industrial temperature variants (I7N) are available for control cabinet deployment.
Empfohlen
Machine Vision Pre-Processing
The 5CSXFC5C6U23C6N is used in machine vision pre-processing because the 85K-logic-element fabric hosts parallel image-pipeline IP (MIPI CSI-2 deserialization, color-space conversion, Sobel/edge detection, thresholding) at line-rate, while the dual Cortex-A9 HPS runs the classifier or HMI stack under Linux. The Cyclone V SX datasheet indicates that FPGA-side DSP blocks can implement 5x5 convolution kernels at 200 MHz, sufficient for 1080p60 RGB input streams at full frame rate. The 145 user I/Os accommodate MIPI CSI-2 (4 lanes) plus GPIO for trigger/lighting control. Compared to a discrete CPU+FPGA design, the HPS-to-FPGA ACP bridge cuts preprocessing latency below 5 ms, enabling closed-loop quality inspection at conveyor speeds above 1 m/s.
Empfohlen
Smart-Grid Measurement Hardware
The 5CSXFC5C6U23C6N enables smart-grid revenue-grade metering because the FPGA fabric implements 16-bit sigma-delta ADC interfaces, digital integrators, and DFT-based harmonic analysis running in parallel, while the dual ARM Cortex-A9 HPS performs TCP/IP stack handling for IEC 61850, DNP3, or Modbus over Ethernet. Per Intel's smart-energy reference designs, the Cyclone V SX HPS includes hardware cryptography (AES, SHA) suitable for secure firmware boot mandated by IEC 62351. The 672-UBGA package's industrial EMC tolerance and 0C to +85C commercial range meet utility sub-station deployment when paired with the I7N industrial variant. The 145 user I/Os are sufficient for three-phase metering plus communication ports (RS-485, Ethernet, cellular modem).
Empfohlen
Secure Payment Terminals
The 5CSXFC5C6U23C6N fits PCI-PTS payment terminals because the dual Cortex-A9 HPS runs a secure OS on one core and the application UI on the other, while the 85K-LE FPGA fabric implements crypto accelerators (RSA, ECC, AES) and tamper-detection logic. Intel's Cyclone V SX datasheet confirms hardware-accelerated AES, SHA, and PKA blocks in the HPS, sufficient for PCI-PTS 5.x certification. The 3.88 Mbit embedded memory holds the secure boot ROM and tamper event log without external NVM. The 145 user I/Os cover smart-card readers, NFC, PIN pad matrix, and printer interface. The commercial temperature range is sufficient for indoor retail terminal deployment.
Empfohlen
Embedded Vision / AI Edge Nodes
The 5CSXFC5C6U23C6N suits embedded AI edge nodes because the 85K-logic-element FPGA fabric implements quantized CNN inference engines (e.g. MobileNet-V2 INT8 at 30+ FPS) in custom RTL, while the dual ARM Cortex-A9 HPS runs Linux with TensorFlow Lite as a controller, handling preprocessing, batching, and result delivery. Per Intel's OpenVINO-for-Cyclone-V toolchain documentation, this heterogeneous split yields up to 4x the throughput of a Cortex-A9-only implementation at the same power budget. The AXI-64 ACP bridge enables zero-copy transfer of intermediate feature maps, eliminating DDR bandwidth bottlenecks. The 672-UBGA package supports 145 user I/Os for MIPI camera input plus Ethernet output to factory IoT gateways. The commercial temperature grade suits indoor industrial deployments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSXFC5C6U23C6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSXFC5C6U23A7N | 5CSXFC5C6U23C7N | 5CSXFC4C6U23C6N | 5CSXFC2C6U23C6N | 5CSEBA6U23C6N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same | Intel (formerly Altera) - same |
| Package | 672-UBGA (23x23 mm) | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same | 672-UBGA (23x23 mm) - same |
| Logic Elements | 85,000 LE | 85,000 LE | 85,000 LE | 40,000 LE (-53%) | 25,000 LE (-71%) | 110,000 LE (+29%) |
| Family / Variant | Cyclone V SX (HPS+FPGA, no transceivers) | Cyclone V SX - same family | Cyclone V SX - same family | Cyclone V SX - same family | Cyclone V SX - same family | Cyclone V SE (more DSP, more LE) |
| HPS Core | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz - same | Dual ARM Cortex-A9 925 MHz - same | Dual ARM Cortex-A9 925 MHz - same | Dual ARM Cortex-A9 925 MHz - same | Dual ARM Cortex-A9 925 MHz - same |
| Speed Grade | 6 | 7 (-8-10% Fmax) | 7 (-8-10% Fmax) | 6 - same | 6 - same | 6 - same |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) - same | Commercial (0C to +85C) - same | Commercial (0C to +85C) - same | Commercial (0C to +85C) - same |
| User I/Os | 145 I/O | 145 I/O - same | 145 I/O - same | 145 I/O - same | 145 I/O - same | 145 I/O - same |
Wichtigste Unterscheidungsmerkmale
- Best Fmax in commercial temperature 672-UBGA SX family (vs. 5CSXFC5C6U23C7N)
- 85K LE balances logic capacity vs HPS-equipped SE alternatives (vs. 5CSEBA6U23C6N (110K LE))
- Lowest-priced commercial 85K-LE SX with active HPS (vs. 5CSXFC5C6U23A7N (industrial temp grade))
Designhinweise
The 672-UBGA package uses 0.8 mm ball pitch, which mandates a 4-6 layer PCB stack-up with 0.5 oz copper outer layers and 1 oz inner power/ground planes. Per Intel's Cyclone V pin connection guidelines, impedance-controlled HPS traces (100 ohm differential for RGMII, 90 ohm for USB 2.0) must be length-matched within 150 mil. Use micro-via-in-pad or stacked-via construction to break out the inner-row balls; standard through-via dog-bone fanout will not fit on this pitch.
Estimated: at full FPGA utilization (85% ALMs switching, HPS cores at 925 MHz), power dissipation reaches approximately 5-7 W; thermal resistance theta_JA of the 672-UBGA package is approximately 15 C/W with a 4-layer JEDEC JESD51 test board. The junction temperature rises to Tj = Ta + 15 C/W x 6 W = Ta + 90 C. For commercial 0-85C operation, ambient must remain below -5C, which is impractical; a heatsink or thermal pad is required for production deployment.
Do not confuse the SX (HPS+FPGA, no transceivers), SE (HPS+FPGA+more DSP), and ST (FPGA only, with transceivers) Cyclone V families - the HPS block is absent in ST parts. When migrating Quartus projects between speed grades, regenerate the SDC timing constraints because C6/C7/I7/A7 have different Fmax per the Cyclone V device datasheet. Boot source (NAND/SD/QSPI) must be configured via MSEL pins before power-up; incorrect MSEL values result in silent HPS hang.
Compliance-Informationen
RoHS compliant per Intel/Altera product page. Not AEC-Q100 qualified; choose 5CSXFC5C6U23A7N for automotive-grade temperature.
