5CSXFC5C6U23I7-N - Cyclone V SX SoC FPGA 85K LE | Intel
Teilenummer: 5CSXFC5C6U23I7-N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395 | $3.950,00 |
| 100 | $365 | $36.500,00 |
| 500 | $335 | $167.500,00 |
| 1.000 | $305 | $305.000,00 |
5CSXFC5C6U23I7-N Übersicht
A System-on-Chip FPGA is a class of programmable logic device that combines a general-purpose applications processor subsystem with an FPGA fabric on a single die, allowing designers to partition workloads between deterministic hardware-accelerated logic in the FPGA and software running on the ARM cores. Within Intel's device taxonomy, the Cyclone V SX family sits under the broader Cyclone V low-power FPGA platform, which itself belongs to Intel's programmable logic group; the SX sub-family is the variant that adds the HPS. The integration reduces board area, BOM, and power compared with a discrete processor-plus-FPGA design.
Key features include 85K logic elements, approximately 4,450 Kbits of embedded memory (M10K + MLAB), 87 variable-precision DSP blocks supporting 18 × 18 and 27 × 27 multipliers, six general-purpose PLLs plus two DLLs and five transceiver PLLs, and integrated transceivers capable of up to 6.144 Gbps. The HPS side exposes two 32-bit Cortex-A9 cores up to 800 MHz with CoreSight debug, NEON media engine, single/double-precision FPU, L1 + 512 KB shared L2 cache, and a rich peripheral set including two EMACs, USB 2.0 OTG, two CAN controllers, two UARTs, two I²C, two SPI, NAND flash controller, and DDR3/DDR3L/LPDDR2/LPDDR3 SDRAM controller with ECC.
Typical applications include industrial motor control, factory automation HMIs, programmable logic controllers, machine vision pre-processing, automotive driver-assistance platforms, broadcast video processing, and embedded vision systems. The combination of a deterministic FPGA fabric with a Linux-capable ARM host simplifies designs that previously required two chips and a complex interconnect.
Design considerations: thermal management in the 672-ball UBGA package relies on the exposed-die top-side heat-spreader attach plus sufficient PCB inner-plane copper; signal-integrity planning for DDR3 at 533 MHz and multi-gigabit transceivers requires controlled-impedance routing, length matching, and reference-plane continuity. The 1.1 V core, 2.5 V/3.3 V I/O, and HPS-side voltage rails must be sequenced per the Intel Cyclone V power management user guide.
This page synthesises distributor pricing, drop-in Cyclone V SX/SE alternatives, and design considerations not collected in any single place in the manufacturer datasheet, helping engineers shorten the BOM-and-feasibility study phase for Cyclone V SX-based SoC designs.
Drop-in-Alternativen für 5CSXFC5C6U23I7-N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5CSXFC5C6U23I7-N (gleiche Bauform und Footprint) – abweichend in Package, Family, Logic Elements, Process Technology, DSP Blocks.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5CSXFC5C6U23C8N
✅ Drop-In✓ Auf Lager
$96.75 / Stück
Datenblatt ansehen →5CSXFC5C6U23C7N
✅ Drop-In✓ Auf Lager
$348 / Stück
Datenblatt ansehen →5CSXFC5C6U23C6N
✅ Drop-In✓ Auf Lager
$175 / Stück
Datenblatt ansehen →5CSXFC5C6U23A7N
✅ Drop-In✓ Auf Lager
$64.4 / Stück
Datenblatt ansehen →5CSXFC4C6U23I7N
✅ Drop-In✓ Auf Lager
$195 / Stück
Datenblatt ansehen →5CSXFC5C6U23I7-N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone V SX (SoC FPGA) |
| Logic Elements | 85,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Core Frequency | 800 MHz |
| Process Technology | TSMC 28 nm low-power |
| Gehäuse | 672-pin UBGA (23 × 23 mm, 1.0 mm pitch) |
| DSP Blocks | 87 variable-precision DSP blocks |
| DSP Multiplier Modes | 18 × 18 and 27 × 27 |
| Transceivers | Up to 6.144 Gbps |
| PLLs | 6 general-purpose + 2 DLL + 5 transceiver PLLs |
| HPS Peripherals | 2× EMAC, USB 2.0 OTG, 2× CAN, 2× UART, 2× I²C, 2× SPI, NAND, DDR3 controller with ECC |
| Core Voltage | 1.1 V |
| Operating Temperature (Industrial) | -40 °C to +100 °C (junction) |
| RoHS-Status | Compliant |
| Montageart | Surface Mount (BGA) |
5CSXFC5C6U23I7-N 672-pin ubga (23 × 23 mm, 1.0 mm pitch) Pinbelegungsleitfaden
Pinbelegung für 5CSXFC5C6U23I7-N (672-pin ubga (23 × 23 mm, 1.0 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für 5CSXFC5C6U23I7-N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
5CSXFC5C6U23I7-N ist geeignet für 7 Anwendungs: Industrial Motor Control, Machine Vision and Embedded Imaging, Programmable Logic Controller (PLC) and HMI, Automotive Driver-Assistance Subsystem, Broadcast Video Processing, Industrial IoT Gateway with Edge Analytics, Test and Measurement Instrumentation.
Industrial Motor Control
The 5CSXFC5C6U23I7-N's combination of 85,000 logic elements and 87 variable-precision DSP blocks makes it well-suited to multi-axis motor-control loops running field-oriented control (FOC) at high PWM rates. Designers can implement current, velocity, and position loops in FPGA fabric for deterministic sub-microsecond latency, while the dual ARM Cortex-A9 HPS runs higher-level motion sequencing, EtherCAT or CANopen master stacks, and the HMI. The DDR3 controller with ECC supports reliable logging and parameter storage, and the six PLLs allow precise PWM frequency synthesis. Industrial-temperature qualification (-40C to +100C junction) enables deployment in factory-floor cabinets without derating.
Empfohlen
Machine Vision and Embedded Imaging
The 5CSXFC5C6U23I7-N is widely used in factory-floor machine-vision pre-processing pipelines where it ingests MIPI CSI-2 or parallel image-sensor data into the FPGA fabric, performs Bayer demosaic, lens distortion correction, and edge detection in hardware, then forwards the processed frame to the HPS for classification. The 6.144 Gbps transceivers enable CoaXPress or GigE Vision uplink. With 85K LE plus 87 DSP blocks, the device has headroom for line-scan triggering, time stamping, and lighting synchronisation alongside the image pipeline. The Linux-capable HPS runs OpenCV or vendor SDKs for inference.
Empfohlen
Programmable Logic Controller (PLC) and HMI
The dual ARM Cortex-A9 cores up to 800 MHz allow the 5CSXFC5C6U23I7-N to host a real-time Linux plus a deterministic RTOS for IEC 61131-3 soft-PLC execution, while the FPGA fabric implements high-speed digital I/O, encoder counters, PWM, and fieldbus links. The two on-chip EMACs enable redundant Ethernet rings such as PROFINET or EtherCAT slave ports. With 85K logic elements and industrial-temperature qualification, the SoC replaces a discrete MCU plus CPLD combo with a single device, simplifying BOM and reducing board area in mid-range PLC and HMI designs.
Empfohlen
Automotive Driver-Assistance Subsystem
For ADAS peripherals such as surround-view ECUs, driver-monitoring pre-processing, and sensor-fusion front-ends, the 5CSXFC5C6U23I7-N integrates FPGA image-processing and an ARM Cortex-A9 host that can run AUTOSAR or Linux. The six PLLs and multi-gigabit transceivers enable direct attach to automotive serializer/deserializer links. The 5CSXFC5C6U23A7N automotive-temperature sibling is the preferred variant for in-cabin and under-hood designs where AEC-Q100 is required; the I7N suits industrial-tier fleet telematics. Designers should validate EMI and thermal envelopes against vehicle-level standards.
Empfohlen
Broadcast Video Processing
The 5CSXFC5C6U23I7-N supports broadcast video processing such as up/down/cross conversion, color-space conversion, and frame-rate conversion, using the FPGA fabric for low-latency pixel pipelines while the HPS runs web interfaces and configuration. With 87 DSP blocks and multi-gigabit transceivers supporting SDI rates, the device targets mid-range broadcast infrastructure including contribution encoders, multiviewers, and production switchers. Industrial-temperature operation allows deployment in equipment rooms without forced-air cooling.
Empfohlen
Industrial IoT Gateway with Edge Analytics
The 5CSXFC5C6U23I7-N acts as a Linux-driven edge gateway where the HPS runs MQTT brokers, protocol translation (Modbus, OPC-UA, BACnet), and lightweight analytics, while the FPGA fabric implements high-speed deterministic data acquisition such as 1 Gsps ADC interfaces, custom sensor preprocessing, and timestamping. The two EMACs allow segregated plant and enterprise network domains, and the industrial temperature grade supports deployment in cabinets with wide thermal swing. This reduces the BOM of a separate MCU plus FPGA design and shortens time-to-market.
Empfohlen
Test and Measurement Instrumentation
The 5CSXFC5C6U23I7-N's DSP blocks and on-chip transceivers allow construction of mid-range bench instruments such as protocol analyzers, mixed-signal testers, and arbitrary waveform generators. The HPS runs the user interface, display, and network interfaces (USB 2.0 OTG, dual EMAC), while the FPGA fabric implements the acquisition engine. The 85K logic elements and 87 DSP blocks enable deep capture memory and real-time DSP. Industrial-temperature operation ensures consistent performance across laboratory thermal environments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5CSXFC5C6U23I7-N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5CSXFC5C6U23C8N | 5CSXFC5C6U23C7N | 5CSXFC5C6U23A7N | 5CSXFC4C6U23I7N |
|---|---|---|---|---|---|
| Package | 672-UBGA (23x23, 1.0 mm pitch) | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Temperature Grade | Industrial (-40C to +100C junction) | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (AEC-Q100) | Industrial (-40C to +100C) |
| Speed Grade | I7 (industrial, fast) | C8 (commercial, fast) | C7 | A7 (automotive) | I7 |
| HPS (ARM Cortex-A9) | Dual 800 MHz Cortex-A9 | Dual 800 MHz Cortex-A9 | Dual 800 MHz Cortex-A9 | Dual 800 MHz Cortex-A9 | Dual 800 MHz Cortex-A9 |
| Transceivers | Up to 6.144 Gbps | Up to 6.144 Gbps | Up to 6.144 Gbps | Up to 6.144 Gbps | Up to 6.144 Gbps |
| RoHS / Lead-Free | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant |
Wichtigste Unterscheidungsmerkmale
- Hard processor system on die (vs. 5CEFA-family Cyclone V E (FPGA-only))
- Higher density within the same UBGA-672 footprint (vs. 5CSXFC4C6U23I7N)
- Industrial temperature qualification at I7 speed grade (vs. 5CSXFC5C6U23C8N)
Designhinweise
The 672-ball UBGA relies primarily on convection and PCB copper for cooling, with the top-side heat-spreader attach (HSA) recommended at higher dissipation. Estimated: at typical SoC-FPGA utilisation around 3-5 W dissipation, the junction-to-ambient thermal resistance of approximately 12-15 C/W with adequate copper means a 50-75 C junction rise above ambient. For sealed enclosures, derate logic utilisation or add a dedicated heatsink. The Intel Cyclone V PowerPlay early power estimator should be run during schematic capture, not after layout.
Plan for controlled-impedance routing on multi-gigabit transceiver lanes (100-ohm differential), DDR3 address/command/data/clock (50-ohm SE, 100-ohm diff for clocks), and USB 2.0 (90-ohm differential). Use at least 6 PCB layers with continuous reference planes under each high-speed route; avoid splits under transceiver and DDR3 areas. Ball pitch is 1.0 mm so escape routing uses micro-via (laser-drilled) stackups; ensure your fab can produce 0.1 mm laser vias with reliable plating.
Sequence the 1.1 V core, 2.5 V/3.3 V I/O banks, and HPS-side voltages per the Cyclone V power management user guide to avoid latch-up and to ensure HPS boots cleanly from the boot ROM. Use the Intel Enpirion or compatible multi-rail PMIC for the typical 1.1 V VCC, 1.1 V VCC_HPS, 1.8 V/2.5 V/3.3 V bank supplies, and the DDR3 VTT termination rail. Decoupling must follow the reference schematic; do not reduce bulk capacitance, as transient response of the HPS core regulator at boot is sensitive to bulk capacitor count.
Common pitfalls include (1) ignoring the HPS-to-FPGA bridge clock domain crossing and missing a reset bridge, causing HPS hangs; (2) assigning high-speed transceiver pins to non-dedicated GPIO, which the fitter will reject; (3) omitting the external boot flash for HPS (QSPI or SD), leaving the part unbootable; (4) selecting a BGA break-out pattern that escapes too few signal layers and forces long stubs on DDR3; and (5) overlooking JTAG chain ordering when the SoC FPGA shares the JTAG bus with other devices, which prevents Quartus from acquiring the device.
Compliance-Informationen
RoHS compliant per Altera/Intel product listing. I7 suffix indicates industrial temperature grade (-40C to +100C junction). AEC-Q100 not qualified on the I7N variant; choose the 5CSXFC5C6U23A7N for automotive.
