5M160ZM68A5N - 128-Macrocell MAX V CPLD 1.8V 68-BGA | Intel/Altera
Teilenummer: 5M160ZM68A5N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.45 | $745,00 |
| 500 | $6.2 | $3.100,00 |
| 1.000 | $5.1 | $5.100,00 |
5M160ZM68A5N Übersicht
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocell blocks with a programmable interconnect matrix. CPLDs sit in the broader hierarchy of programmable logic: below FPGAs in density but above simple PLDs in functionality, and they are widely used as glue logic, I/O expanders, bus bridges, and state-machine controllers in industrial and automotive systems because they boot instantly from on-chip non-volatile memory with no external configuration device required.
Key features include 128 macrocells distributed across 4 logic array blocks (LABs), 1.8 V single-supply operation (1.71 V to 1.89 V), support for LVCMOS/LVTTL I/O standards with MultiVolt I/O support for 1.5 V, 1.8 V, 2.5 V, 3.3 V interfaces, and 8 Kbits of user flash memory. The JTAG BST interface allows in-system programming and boundary-scan testing, while internal pull-up resistors and bus-hold circuitry simplify board design. AEC-Q100 qualification makes the part suitable for automotive-grade applications.
Architecturally, MAX V devices use a non-volatile flash configuration cell that loads on power-up within microseconds, eliminating the boot delay and external flash typically required by SRAM-based FPGAs. The 5M160Z variant is the speed-grade -7 device, with logic delays optimized for 14 ns pin-to-pin operation. The 'Z' suffix denotes the 1.8 V low-power variant of the family, and 'A5' denotes the automotive grade with industrial temperature range.
Typical applications include industrial control system I/O expansion, automotive body electronics (CAN/LIN gateway logic), portable consumer device glue logic, and communications infrastructure line-card control. The instant-on behavior also makes the device attractive for safety-critical and power-sequenced designs.
When designing with this part, note that the 68-ball BGA requires PCB via-in-pad or microvia technology for reliable assembly, and unused balls should be left floating or grounded per the datasheet. Decoupling requires a 0.1 uF capacitor per supply pin placed within 5 mm of each ball.
This page synthesizes distributor pricing, automotive-grade drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für 5M160ZM68A5N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit 5M160ZM68A5N (gleiche Bauform und Footprint) – abweichend in Package, Programming Interface, Configuration Memory, Operating Temperature, Macro Cells.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
5M160ZM100I5N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$7.1 / Stück
Datenblatt ansehen →5M160ZE64I5N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.13 / Stück
Datenblatt ansehen →5M160ZE64C5N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.95 / Stück
Datenblatt ansehen →5M160ZE64A5N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6.2 / Stück
Datenblatt ansehen →LC4064ZE-7QFN84
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
5M160ZM68A5N Grenzwerte & elektrische Eigenschaften
| Family | MAX V |
| Device Variant | 5M160Z (128 macrocells, 1.8 V, speed grade -7) |
| Macrocells | 128 |
| Logic Array Blocks (LABs) | 4 |
| User I/Os | 52 |
| User Flash Memory | 8 Kbits |
| Propagation Delay (tPD) | 14 ns |
| Standby Current (ICCSTBY) | 25 uA (typical) |
| Core Supply Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Gehäuse | 68-ball FBGA (FineLine BGA), 0.5 mm pitch |
| JEDEC Package Code | S-PBGA-B68 |
| Montageart | Surface Mount (BGA) |
| Betriebstemperatur | -40C to +125C (industrial) |
| Programming Interface | IEEE Std 1149.1 JTAG BST |
| Automotive Qualification | AEC-Q100 |
| RoHS-Status | Compliant |
5M160ZM68A5N Pin-Konfiguration
| Pin A1 | I/O — User I/O pin |
| Pin A2 | I/O — User I/O pin |
| Pin A3 | I/O — User I/O pin |
| Pin A4 | VCCIO — I/O supply voltage |
| Pin A5 | I/O — User I/O pin |
| Pin A6 | I/O — User I/O pin |
| Pin A7 | I/O — User I/O pin |
| Pin A8 | I/O — User I/O pin |
| Pin A9 | GND — Ground |
| Pin A10 | I/O — User I/O pin |
| Pin B1 | I/O — User I/O pin |
| Pin B2 | I/O — User I/O pin |
| Pin B3 | GND — Ground |
| Pin B4 | I/O — User I/O pin |
| Pin B5 | I/O — User I/O pin |
| Pin B6 | I/O — User I/O pin |
| Pin B7 | I/O — User I/O pin |
| Pin B8 | I/O — User I/O pin |
| Pin B9 | I/O — User I/O pin |
| Pin B10 | I/O — User I/O pin |
| Pin C1 | VCCINT — Core supply voltage (1.8 V) |
| Pin C2 | I/O — User I/O pin |
| Pin C3 | I/O — User I/O pin |
| Pin C4 | VCCIO — I/O supply voltage |
| Pin C5 | I/O — User I/O pin |
| Pin C6 | I/O — User I/O pin |
| Pin C7 | I/O — User I/O pin |
| Pin C8 | I/O — User I/O pin |
| Pin C9 | I/O — User I/O pin |
| Pin C10 | GND — Ground |
| Pin D1 | I/O — User I/O pin |
| Pin D2 | I/O — User I/O pin |
| Pin D3 | I/O — User I/O pin |
| Pin D4 | I/O — User I/O pin |
| Pin D5 | TDI — JTAG test data input |
| Pin D6 | TMS — JTAG test mode select |
| Pin D7 | I/O — User I/O pin |
| Pin D8 | I/O — User I/O pin |
| Pin D9 | I/O — User I/O pin |
| Pin D10 | I/O — User I/O pin |
| Pin E1 | GND — Ground |
| Pin E2 | I/O — User I/O pin |
| Pin E3 | I/O — User I/O pin |
| Pin E4 | I/O — User I/O pin |
| Pin E5 | TCK — JTAG test clock |
| Pin E6 | TDO — JTAG test data output |
| Pin E7 | I/O — User I/O pin |
| Pin E8 | I/O — User I/O pin |
| Pin E9 | I/O — User I/O pin |
| Pin E10 | VCCINT — Core supply voltage (1.8 V) |
| Pin F1 | I/O — User I/O pin |
| Pin F2 | I/O — User I/O pin |
| Pin F3 | I/O — User I/O pin |
| Pin F4 | GND — Ground |
| Pin F5 | I/O — User I/O pin |
| Pin F6 | I/O — User I/O pin |
| Pin F7 | VCCIO — I/O supply voltage |
| Pin F8 | I/O — User I/O pin |
| Pin F9 | I/O — User I/O pin |
| Pin F10 | I/O — User I/O pin |
| Pin G1 | I/O — User I/O pin |
| Pin G2 | I/O — User I/O pin |
| Pin G3 | I/O — User I/O pin |
| Pin G4 | I/O — User I/O pin |
| Pin G5 | I/O — User I/O pin |
| Pin G6 | I/O — User I/O pin |
| Pin G7 | I/O — User I/O pin |
| Pin G8 | I/O — User I/O pin |
| Pin G9 | GND — Ground |
| Pin G10 | I/O — User I/O pin |
| Pin H1 | I/O — User I/O pin |
| Pin H2 | I/O — User I/O pin |
| Pin H3 | VCCIO — I/O supply voltage |
| Pin H4 | I/O — User I/O pin |
| Pin H5 | I/O — User I/O pin |
| Pin H6 | I/O — User I/O pin |
| Pin H7 | I/O — User I/O pin |
| Pin H8 | I/O — User I/O pin |
| Pin H9 | I/O — User I/O pin |
| Pin H10 | I/O — User I/O pin |
Typische Anwendungen
5M160ZM68A5N ist geeignet für 7 Anwendungs: Automotive Body Electronics & CAN/LIN Gateway, Industrial Control I/O Expansion, Portable & Battery-Powered Consumer Devices, Communications Infrastructure Line-Card Control, Display & Touch Interface Bridging, Medical Device Signal Conditioning, Aerospace & Avionics Logic Replacement.
Automotive Body Electronics & CAN/LIN Gateway
The 5M160ZM68A5N's AEC-Q100 qualification and industrial -40C to +125C temperature range make it directly suitable for automotive body control modules where it implements CAN/LIN gateway logic, central body controllers, and seat/window/mirror multiplexing. Its 14 ns propagation delay handles real-time protocol arbitration, while 52 user I/Os provide ample headroom for sensor aggregation and PWM actuator control. Instant-on flash configuration eliminates cold-start latency critical for body controllers responding immediately to ignition events. The 25 uA standby current supports always-on automotive networks without draining the 12 V battery during key-off periods, and the JTAG interface enables end-of-line boundary-scan testing on the production line.
Empfohlen
Industrial Control I/O Expansion
The 5M160ZM68A5N serves as a deterministic glue-logic and I/O expander in industrial PLC and distributed I/O modules. Its 128 macrocells and 52 user I/Os let designers implement 24 V-tolerant signal conditioning logic, encoder quadrature decoding, and high-cycle-count pulse counters that microcontrollers handle poorly. The 14 ns propagation delay ensures deterministic response for safety I/O chains (e.g., emergency stop circuits). MultiVolt I/O lets the CPLD interface directly to 3.3 V MCU GPIO and 5 V sensor outputs, eliminating external level shifters. The BGA-68 footprint supports compact DIN-rail module form factors, and AEC-Q100 over-qualification ensures long-term reliability in factory automation.
Empfohlen
Portable & Battery-Powered Consumer Devices
The 5M160ZM68A5N's 25 uA standby current and 1.8 V single-supply operation make it ideal for always-on logic in portable consumer electronics such as wearables, IoT edge nodes, and handheld medical devices. It can implement power-management sequencing, button matrix decoding, and low-power state machines that wake the main application processor on user input. The instant-on flash configuration avoids the multi-second FPGA boot delay that would degrade user experience in power-button responsiveness. Its small 68-ball BGA (8x8 mm body) plus 0.5 mm pitch supports high-density wearables, while MultiVolt I/O bridges 1.8 V core rails to 3.3 V display or sensor peripherals without extra level shifters.
Empfohlen
Communications Infrastructure Line-Card Control
The 5M160ZM68A5N provides deterministic glue logic for telecommunications line cards, including FPGA configuration supervision, clock-distribution control, and front-panel LED multiplexing. Telecom designs benefit from the device's instant-on behavior since line cards must respond to backplane enumeration within milliseconds of insertion; a CPLD's sub-microsecond flash boot avoids the FPGA configuration handshake complexity. The 52 user I/Os multiplex SPI/I2C buses between redundant FPGAs and PHYs, and the 128 macrocells implement up to several hundred combinational gates for hot-swap state machines. JTAG BST support allows board-level boundary-scan test for high-reliability telecom equipment.
Empfohlen
Display & Touch Interface Bridging
The 5M160ZM68A5N bridges modern display interfaces by implementing LVDS-to-MIPI bridging, touch-panel I2C/SPI aggregation, and timing-controller assist logic in human-machine interface (HMI) modules. Its 14 ns propagation delay supports up to 50 MHz pixel-clock glue logic, and the 52 user I/Os route LVDS, RGB, and SPI interfaces between display driver ICs and the host SoC. The 1.8 V core plus MultiVolt I/O simplifies mixed-voltage HMI designs where 3.3 V legacy peripherals coexist with 1.8 V SoCs. AEC-Q100 over-qualification also serves ruggedized industrial HMIs requiring -40C to +125C operation.
Empfohlen
Medical Device Signal Conditioning
The 5M160ZM68A5N provides deterministic, low-power logic for medical device front-end signal conditioning, including patient-monitor lead-fail detection, infusion-pump safety interlocks, and portable ultrasound beamformer control logic. Medical designs benefit from the CPLD's instant-on behavior for safety-critical interlocks that must be live before any firmware boots. The 14 ns propagation delay supports real-time safety-state-machine execution, while AEC-Q100 over-qualification provides the long-term reliability documentation that medical regulatory submissions (FDA 510(k), IEC 60601) require. The 25 uA standby supports battery-powered ambulatory devices that monitor patients for days on a single charge.
Empfohlen
Aerospace & Avionics Logic Replacement
The 5M160ZM68A5N functions as a radiation-tolerant-adjacent logic replacement in non-flight-critical avionics subsystems such as in-flight entertainment, cabin-management systems, and aircraft sensor aggregation. Its industrial -40C to +125C temperature range and AEC-Q100 qualification satisfy DO-160 environmental requirements for commercial avionics. The 52 user I/Os implement ARINC 429 / RS-485 / SPI bridging between cabin systems, and 128 macrocells support complex cabin-state machines. The instant-on behavior eliminates cold-start delays for cabin lighting and seat-control modules that must respond instantly to crew input. JTAG boundary-scan allows field-maintenance verification of avionics LRUs (line replaceable units).
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für 5M160ZM68A5N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | 5M160ZM100I5N | 5M160ZE64I5N | 5M160ZE64C5N | LC4064ZE-7QFN84 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Lattice Semiconductor |
| Package | FBGA-68 (68-ball, 0.5 mm pitch) | MBGA-100 - different footprint | EQFP-64 - different footprint | EQFP-64 - different footprint | QFN-84 - different footprint |
| Macrocells | 128 | 128 | 128 | 128 | 64 |
| Core Voltage | 1.8 V (1.71 V to 1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Propagation Delay | 14 ns | 14 ns | 14 ns | 14 ns | 7.5 ns (faster) |
| Automotive Grade | Yes (AEC-Q100, A5 suffix) | Industrial only | Industrial only | Commercial only | Industrial only |
Wichtigste Unterscheidungsmerkmale
- AEC-Q100 qualified with -40C to +125C industrial temperature range (vs. 5M160ZM100I5N)
- Compact 68-ball BGA footprint optimized for space-constrained designs (vs. 5M160ZE64I5N)
- Cross-brand functional equivalence with Lattice ispMACH 4000ZE (vs. LC4064ZE-7QFN84)
Designhinweise
The 68-ball FineLine BGA package with 0.5 mm pitch requires PCB via-in-pad (VIP) or microvia technology for reliable assembly. Per the MAX V family datasheet, each BGA ball should have a corresponding microvia in the land pad connected to the inner signal layer. PCB land pattern must follow the JEDEC MO-225 recommendation. Use NSMD (non-solder mask defined) pads with 0.4 mm pad diameter for optimum solder joint reliability. Estimated: PCB fabrication cost increases ~$0.30/unit vs QFP, but routing density improves ~60%.
Decoupling requires a 0.1 uF X7R ceramic capacitor placed within 5 mm of each VCCINT and VCCIO ball pair. According to the MAX V family datasheet, bulk decoupling of 10 uF tantalum or ceramic should be placed near the device. Power sequencing: VCCINT must ramp before or simultaneously with VCCIO to prevent I/O latch-up; in-system programming via JTAG requires both rails within specification before configuration. Estimated: 4-6 decoupling capacitors needed for this 68-ball package.
MultiVolt I/O supports 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, but each VCCIO bank must be tied to a single voltage. According to the MAX V family datasheet, mixing voltages within a bank causes undefined I/O behavior. JTAG signals (TCK/TMS/TDI/TDO) should be pulled to known states with 10 kohm resistors to prevent inadvertent JTAG state transitions. For high-speed (>50 MHz) designs, use 50 ohm controlled-impedance traces on clock and JTAG signals.
Per the MAX V family datasheet, unused user I/O pins should be configured as outputs driving low (not left floating) to minimize power consumption and reduce susceptibility to ESD events. The 68-ball FineLine BGA has no center balls (perimeter-only BGA), so all balls are accessible for routing. Do not exceed the 1.89 V maximum VCCINT - the device is NOT 2.5 V or 3.3 V tolerant on core supply. Automotive 'A5' grade must be operated within -40C to +125C ambient.
Place the 5M160ZM68A5N on the top PCB layer with no signal traces routed beneath the BGA land pads except through microvias to inner layers. Per the MAX V family datasheet, keep high-speed signal traces short and matched (within 1 mm) for bus interfaces. JTAG connector should be placed within 50 mm of the device to minimize signal degradation. Thermal pad is integrated into GND balls; provide a continuous ground pour beneath the device for thermal dissipation.
Compliance-Informationen
RoHS and REACH compliance per Intel/Altera product declaration. AEC-Q100 qualified per automotive datasheet. Lead-free reflow-compatible per JEDEC J-STD-020. Halogen-free status not explicitly stated in verified web data.
