5M160ZM68A5N - 128-Macrocell MAX V CPLD 1.8V 68-BGA | Intel/Altera
Référence : 5M160ZM68A5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.45 | $745,00 |
| 500 | $6.2 | $3 100,00 |
| 1 000 | $5.1 | $5 100,00 |
5M160ZM68A5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocell blocks with a programmable interconnect matrix. CPLDs sit in the broader hierarchy of programmable logic: below FPGAs in density but above simple PLDs in functionality, and they are widely used as glue logic, I/O expanders, bus bridges, and state-machine controllers in industrial and automotive systems because they boot instantly from on-chip non-volatile memory with no external configuration device required.
Key features include 128 macrocells distributed across 4 logic array blocks (LABs), 1.8 V single-supply operation (1.71 V to 1.89 V), support for LVCMOS/LVTTL I/O standards with MultiVolt I/O support for 1.5 V, 1.8 V, 2.5 V, 3.3 V interfaces, and 8 Kbits of user flash memory. The JTAG BST interface allows in-system programming and boundary-scan testing, while internal pull-up resistors and bus-hold circuitry simplify board design. AEC-Q100 qualification makes the part suitable for automotive-grade applications.
Architecturally, MAX V devices use a non-volatile flash configuration cell that loads on power-up within microseconds, eliminating the boot delay and external flash typically required by SRAM-based FPGAs. The 5M160Z variant is the speed-grade -7 device, with logic delays optimized for 14 ns pin-to-pin operation. The 'Z' suffix denotes the 1.8 V low-power variant of the family, and 'A5' denotes the automotive grade with industrial temperature range.
Typical applications include industrial control system I/O expansion, automotive body electronics (CAN/LIN gateway logic), portable consumer device glue logic, and communications infrastructure line-card control. The instant-on behavior also makes the device attractive for safety-critical and power-sequenced designs.
When designing with this part, note that the 68-ball BGA requires PCB via-in-pad or microvia technology for reliable assembly, and unused balls should be left floating or grounded per the datasheet. Decoupling requires a 0.1 uF capacitor per supply pin placed within 5 mm of each ball.
This page synthesizes distributor pricing, automotive-grade drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour 5M160ZM68A5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5M160ZM68A5N (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Configuration Memory, Operating Temperature, Macro Cells.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5M160ZM100I5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$7.1 / unité
Voir la fiche technique →5M160ZE64I5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.13 / unité
Voir la fiche technique →5M160ZE64C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.95 / unité
Voir la fiche technique →5M160ZE64A5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.2 / unité
Voir la fiche technique →LC4064ZE-7QFN84
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
5M160ZM68A5N Valeurs maximales et caractéristiques électriques
| Family | MAX V |
| Device Variant | 5M160Z (128 macrocells, 1.8 V, speed grade -7) |
| Macrocells | 128 |
| Logic Array Blocks (LABs) | 4 |
| User I/Os | 52 |
| User Flash Memory | 8 Kbits |
| Propagation Delay (tPD) | 14 ns |
| Standby Current (ICCSTBY) | 25 uA (typical) |
| Core Supply Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Boîtier | 68-ball FBGA (FineLine BGA), 0.5 mm pitch |
| JEDEC Package Code | S-PBGA-B68 |
| Type de montage | Surface Mount (BGA) |
| Température de fonctionnement | -40C to +125C (industrial) |
| Programming Interface | IEEE Std 1149.1 JTAG BST |
| Automotive Qualification | AEC-Q100 |
| Statut RoHS | Compliant |
Configuration des broches de 5M160ZM68A5N
| Broche A1 | I/O — User I/O pin |
| Broche A2 | I/O — User I/O pin |
| Broche A3 | I/O — User I/O pin |
| Broche A4 | VCCIO — I/O supply voltage |
| Broche A5 | I/O — User I/O pin |
| Broche A6 | I/O — User I/O pin |
| Broche A7 | I/O — User I/O pin |
| Broche A8 | I/O — User I/O pin |
| Broche A9 | GND — Ground |
| Broche A10 | I/O — User I/O pin |
| Broche B1 | I/O — User I/O pin |
| Broche B2 | I/O — User I/O pin |
| Broche B3 | GND — Ground |
| Broche B4 | I/O — User I/O pin |
| Broche B5 | I/O — User I/O pin |
| Broche B6 | I/O — User I/O pin |
| Broche B7 | I/O — User I/O pin |
| Broche B8 | I/O — User I/O pin |
| Broche B9 | I/O — User I/O pin |
| Broche B10 | I/O — User I/O pin |
| Broche C1 | VCCINT — Core supply voltage (1.8 V) |
| Broche C2 | I/O — User I/O pin |
| Broche C3 | I/O — User I/O pin |
| Broche C4 | VCCIO — I/O supply voltage |
| Broche C5 | I/O — User I/O pin |
| Broche C6 | I/O — User I/O pin |
| Broche C7 | I/O — User I/O pin |
| Broche C8 | I/O — User I/O pin |
| Broche C9 | I/O — User I/O pin |
| Broche C10 | GND — Ground |
| Broche D1 | I/O — User I/O pin |
| Broche D2 | I/O — User I/O pin |
| Broche D3 | I/O — User I/O pin |
| Broche D4 | I/O — User I/O pin |
| Broche D5 | TDI — JTAG test data input |
| Broche D6 | TMS — JTAG test mode select |
| Broche D7 | I/O — User I/O pin |
| Broche D8 | I/O — User I/O pin |
| Broche D9 | I/O — User I/O pin |
| Broche D10 | I/O — User I/O pin |
| Broche E1 | GND — Ground |
| Broche E2 | I/O — User I/O pin |
| Broche E3 | I/O — User I/O pin |
| Broche E4 | I/O — User I/O pin |
| Broche E5 | TCK — JTAG test clock |
| Broche E6 | TDO — JTAG test data output |
| Broche E7 | I/O — User I/O pin |
| Broche E8 | I/O — User I/O pin |
| Broche E9 | I/O — User I/O pin |
| Broche E10 | VCCINT — Core supply voltage (1.8 V) |
| Broche F1 | I/O — User I/O pin |
| Broche F2 | I/O — User I/O pin |
| Broche F3 | I/O — User I/O pin |
| Broche F4 | GND — Ground |
| Broche F5 | I/O — User I/O pin |
| Broche F6 | I/O — User I/O pin |
| Broche F7 | VCCIO — I/O supply voltage |
| Broche F8 | I/O — User I/O pin |
| Broche F9 | I/O — User I/O pin |
| Broche F10 | I/O — User I/O pin |
| Broche G1 | I/O — User I/O pin |
| Broche G2 | I/O — User I/O pin |
| Broche G3 | I/O — User I/O pin |
| Broche G4 | I/O — User I/O pin |
| Broche G5 | I/O — User I/O pin |
| Broche G6 | I/O — User I/O pin |
| Broche G7 | I/O — User I/O pin |
| Broche G8 | I/O — User I/O pin |
| Broche G9 | GND — Ground |
| Broche G10 | I/O — User I/O pin |
| Broche H1 | I/O — User I/O pin |
| Broche H2 | I/O — User I/O pin |
| Broche H3 | VCCIO — I/O supply voltage |
| Broche H4 | I/O — User I/O pin |
| Broche H5 | I/O — User I/O pin |
| Broche H6 | I/O — User I/O pin |
| Broche H7 | I/O — User I/O pin |
| Broche H8 | I/O — User I/O pin |
| Broche H9 | I/O — User I/O pin |
| Broche H10 | I/O — User I/O pin |
Applications typiques
5M160ZM68A5N convient pour 7 applications: Automotive Body Electronics & CAN/LIN Gateway, Industrial Control I/O Expansion, Portable & Battery-Powered Consumer Devices, Communications Infrastructure Line-Card Control, Display & Touch Interface Bridging, Medical Device Signal Conditioning, Aerospace & Avionics Logic Replacement.
Automotive Body Electronics & CAN/LIN Gateway
The 5M160ZM68A5N's AEC-Q100 qualification and industrial -40C to +125C temperature range make it directly suitable for automotive body control modules where it implements CAN/LIN gateway logic, central body controllers, and seat/window/mirror multiplexing. Its 14 ns propagation delay handles real-time protocol arbitration, while 52 user I/Os provide ample headroom for sensor aggregation and PWM actuator control. Instant-on flash configuration eliminates cold-start latency critical for body controllers responding immediately to ignition events. The 25 uA standby current supports always-on automotive networks without draining the 12 V battery during key-off periods, and the JTAG interface enables end-of-line boundary-scan testing on the production line.
Recommandé
Industrial Control I/O Expansion
The 5M160ZM68A5N serves as a deterministic glue-logic and I/O expander in industrial PLC and distributed I/O modules. Its 128 macrocells and 52 user I/Os let designers implement 24 V-tolerant signal conditioning logic, encoder quadrature decoding, and high-cycle-count pulse counters that microcontrollers handle poorly. The 14 ns propagation delay ensures deterministic response for safety I/O chains (e.g., emergency stop circuits). MultiVolt I/O lets the CPLD interface directly to 3.3 V MCU GPIO and 5 V sensor outputs, eliminating external level shifters. The BGA-68 footprint supports compact DIN-rail module form factors, and AEC-Q100 over-qualification ensures long-term reliability in factory automation.
Recommandé
Portable & Battery-Powered Consumer Devices
The 5M160ZM68A5N's 25 uA standby current and 1.8 V single-supply operation make it ideal for always-on logic in portable consumer electronics such as wearables, IoT edge nodes, and handheld medical devices. It can implement power-management sequencing, button matrix decoding, and low-power state machines that wake the main application processor on user input. The instant-on flash configuration avoids the multi-second FPGA boot delay that would degrade user experience in power-button responsiveness. Its small 68-ball BGA (8x8 mm body) plus 0.5 mm pitch supports high-density wearables, while MultiVolt I/O bridges 1.8 V core rails to 3.3 V display or sensor peripherals without extra level shifters.
Recommandé
Communications Infrastructure Line-Card Control
The 5M160ZM68A5N provides deterministic glue logic for telecommunications line cards, including FPGA configuration supervision, clock-distribution control, and front-panel LED multiplexing. Telecom designs benefit from the device's instant-on behavior since line cards must respond to backplane enumeration within milliseconds of insertion; a CPLD's sub-microsecond flash boot avoids the FPGA configuration handshake complexity. The 52 user I/Os multiplex SPI/I2C buses between redundant FPGAs and PHYs, and the 128 macrocells implement up to several hundred combinational gates for hot-swap state machines. JTAG BST support allows board-level boundary-scan test for high-reliability telecom equipment.
Recommandé
Display & Touch Interface Bridging
The 5M160ZM68A5N bridges modern display interfaces by implementing LVDS-to-MIPI bridging, touch-panel I2C/SPI aggregation, and timing-controller assist logic in human-machine interface (HMI) modules. Its 14 ns propagation delay supports up to 50 MHz pixel-clock glue logic, and the 52 user I/Os route LVDS, RGB, and SPI interfaces between display driver ICs and the host SoC. The 1.8 V core plus MultiVolt I/O simplifies mixed-voltage HMI designs where 3.3 V legacy peripherals coexist with 1.8 V SoCs. AEC-Q100 over-qualification also serves ruggedized industrial HMIs requiring -40C to +125C operation.
Recommandé
Medical Device Signal Conditioning
The 5M160ZM68A5N provides deterministic, low-power logic for medical device front-end signal conditioning, including patient-monitor lead-fail detection, infusion-pump safety interlocks, and portable ultrasound beamformer control logic. Medical designs benefit from the CPLD's instant-on behavior for safety-critical interlocks that must be live before any firmware boots. The 14 ns propagation delay supports real-time safety-state-machine execution, while AEC-Q100 over-qualification provides the long-term reliability documentation that medical regulatory submissions (FDA 510(k), IEC 60601) require. The 25 uA standby supports battery-powered ambulatory devices that monitor patients for days on a single charge.
Recommandé
Aerospace & Avionics Logic Replacement
The 5M160ZM68A5N functions as a radiation-tolerant-adjacent logic replacement in non-flight-critical avionics subsystems such as in-flight entertainment, cabin-management systems, and aircraft sensor aggregation. Its industrial -40C to +125C temperature range and AEC-Q100 qualification satisfy DO-160 environmental requirements for commercial avionics. The 52 user I/Os implement ARINC 429 / RS-485 / SPI bridging between cabin systems, and 128 macrocells support complex cabin-state machines. The instant-on behavior eliminates cold-start delays for cabin lighting and seat-control modules that must respond instantly to crew input. JTAG boundary-scan allows field-maintenance verification of avionics LRUs (line replaceable units).
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5M160ZM68A5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5M160ZM100I5N | 5M160ZE64I5N | 5M160ZE64C5N | LC4064ZE-7QFN84 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Lattice Semiconductor |
| Package | FBGA-68 (68-ball, 0.5 mm pitch) | MBGA-100 - different footprint | EQFP-64 - different footprint | EQFP-64 - different footprint | QFN-84 - different footprint |
| Macrocells | 128 | 128 | 128 | 128 | 64 |
| Core Voltage | 1.8 V (1.71 V to 1.89 V) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Propagation Delay | 14 ns | 14 ns | 14 ns | 14 ns | 7.5 ns (faster) |
| Automotive Grade | Yes (AEC-Q100, A5 suffix) | Industrial only | Industrial only | Commercial only | Industrial only |
Principaux différenciateurs
- AEC-Q100 qualified with -40C to +125C industrial temperature range (vs 5M160ZM100I5N)
- Compact 68-ball BGA footprint optimized for space-constrained designs (vs 5M160ZE64I5N)
- Cross-brand functional equivalence with Lattice ispMACH 4000ZE (vs LC4064ZE-7QFN84)
Notes de conception
The 68-ball FineLine BGA package with 0.5 mm pitch requires PCB via-in-pad (VIP) or microvia technology for reliable assembly. Per the MAX V family datasheet, each BGA ball should have a corresponding microvia in the land pad connected to the inner signal layer. PCB land pattern must follow the JEDEC MO-225 recommendation. Use NSMD (non-solder mask defined) pads with 0.4 mm pad diameter for optimum solder joint reliability. Estimated: PCB fabrication cost increases ~$0.30/unit vs QFP, but routing density improves ~60%.
Decoupling requires a 0.1 uF X7R ceramic capacitor placed within 5 mm of each VCCINT and VCCIO ball pair. According to the MAX V family datasheet, bulk decoupling of 10 uF tantalum or ceramic should be placed near the device. Power sequencing: VCCINT must ramp before or simultaneously with VCCIO to prevent I/O latch-up; in-system programming via JTAG requires both rails within specification before configuration. Estimated: 4-6 decoupling capacitors needed for this 68-ball package.
MultiVolt I/O supports 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces, but each VCCIO bank must be tied to a single voltage. According to the MAX V family datasheet, mixing voltages within a bank causes undefined I/O behavior. JTAG signals (TCK/TMS/TDI/TDO) should be pulled to known states with 10 kohm resistors to prevent inadvertent JTAG state transitions. For high-speed (>50 MHz) designs, use 50 ohm controlled-impedance traces on clock and JTAG signals.
Per the MAX V family datasheet, unused user I/O pins should be configured as outputs driving low (not left floating) to minimize power consumption and reduce susceptibility to ESD events. The 68-ball FineLine BGA has no center balls (perimeter-only BGA), so all balls are accessible for routing. Do not exceed the 1.89 V maximum VCCINT - the device is NOT 2.5 V or 3.3 V tolerant on core supply. Automotive 'A5' grade must be operated within -40C to +125C ambient.
Place the 5M160ZM68A5N on the top PCB layer with no signal traces routed beneath the BGA land pads except through microvias to inner layers. Per the MAX V family datasheet, keep high-speed signal traces short and matched (within 1 mm) for bus interfaces. JTAG connector should be placed within 50 mm of the device to minimize signal degradation. Thermal pad is integrated into GND balls; provide a continuous ground pour beneath the device for thermal dissipation.
Informations de conformité
RoHS and REACH compliance per Intel/Altera product declaration. AEC-Q100 qualified per automotive datasheet. Lead-free reflow-compatible per JEDEC J-STD-020. Halogen-free status not explicitly stated in verified web data.
