A3P1000-1FGG256T - 1M Gate ProASIC3 FPGA | Microchip
Teilenummer: A3P1000-1FGG256T ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $112.06 | $112,06 |
| 10 | $112.06 | $1.120,60 |
| 100 | $112.06 | $11.206,00 |
| 500 | $112.06 | $56.030,00 |
| 1.000 | $112.06 | $112.060,00 |
A3P1000-1FGG256T Übersicht
A field-programmable gate array (FPGA) is an integrated circuit that can be configured after manufacturing to implement custom logic functions. Unlike microcontrollers, which execute software sequentially, FPGAs provide massively parallel hardware execution, making them suitable for high-throughput data processing, protocol bridging, and real-time control. The ProASIC3 family sits in the mid-density FPGA segment, balancing logic capacity, I/O flexibility, and low total cost of ownership.
Key features of the A3P1000-1FGG256T include 1M system gates (approximately 11 KLE), 177 user I/O pins, 147,456 bits of embedded RAM, and a 272 MHz system performance ceiling. The 1.5 V core and 130 nm CMOS technology deliver competitive static and dynamic power. The flash-based fabric retains configuration on power loss, eliminating the need for a configuration memory device and protecting designs from unauthorized readback.
Architecturally, the ProASIC3 family uses Microchip's VersaTile logic element, which can implement both three-input look-up tables and D-flip-flop/latch functions. The A3P1000-1FGG256T supports JTAG programming, in-system programming, and multiple I/O standards. The 256-ball FBGA package provides a compact footprint for space-constrained boards while still offering 177 accessible I/Os.
Typical applications include industrial automation, communication infrastructure, avionics, medical imaging, automotive electronics, and test and measurement systems. The integrated RAM and rich I/O count make it well suited for protocol bridging, sensor conditioning, and custom control logic where a soft processor or external memory interface is required.
Designers should provide adequate decoupling on every core and I/O supply pin, and should verify I/O standard voltage compatibility before board layout. Because the flash FPGA does not require boot memory, power-up is immediate; however, in-rush current during programming should be considered.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate the A3P1000-1FGG256T faster.
Drop-in-Alternativen für A3P1000-1FGG256T – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P1000-1FGG256T (gleiche Bauform und Footprint) – abweichend in System Gates, Configuration Memory, Family, Package, Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P1000-1FGG256I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
A3P1000-2FGG256
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
A3P1000-FGG256I
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$20.1 / Stück
Datenblatt ansehen →A3P1000-FGG256M
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$27.85 / Stück
Datenblatt ansehen →A3P1000-2FGG256I
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
A3P1000-1FGG256T Grenzwerte & elektrische Eigenschaften
| Product Family | ProASIC3 |
| System Gates | 1M (1,000,000) |
| Number of Logic Elements | 11 KLE |
| User I/O | 177 |
| Total RAM Bits | 147,456 |
| Maximum System Performance | 272 MHz |
| Core Supply Voltage | 1.5 V |
| Technology | 130 nm CMOS |
| Gehäuse | 256-LBGA (FBGA) |
| Anzahl der Pins | 256 |
| Montageart | Surface Mount |
| Configuration Type | Flash-based (non-volatile) |
| In-System Programmability | Yes (via JTAG) |
A3P1000-1FGG256T 256-lbga (fbga) Pinbelegungsleitfaden
Pinbelegung für A3P1000-1FGG256T (256-lbga (fbga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3P1000-1FGG256T.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3P1000-1FGG256T ist geeignet für 6 Anwendungs: Industrial Automation and Motor Control, Communications and Networking, Aerospace and Avionics, Medical Diagnostic and Imaging, Automotive Body Electronics, Test and Measurement.
Industrial Automation and Motor Control
The A3P1000-1FGG256T is well suited for industrial automation because its 177 user I/Os and 147,456 RAM bits support multiple encoder interfaces, digital I/O expansion, and custom PWM generation. The flash-based configuration starts instantly without boot time, which is critical for safety interlocks and deterministic control loops. With 272 MHz system performance, the FPGA can handle high-speed position capture, fieldbus bridging, and real-time motor current monitoring. Its 1.5 V core reduces power in 24 V industrial racks, while the 256-LBGA package allows compact controller boards. Designers can pair this FPGA with a host MCU such as Microchip's MSP430FR5994 for HMI and communication tasks, or with a C2000 DSP for advanced closed-loop control. The non-volatile fabric also simplifies firmware updates and field upgrades.
Empfohlen
Communications and Networking
In communications equipment, the A3P1000-1FGG256T provides the I/O count and RAM needed for protocol bridging, packet parsing, and interface conversion. The 177 user I/Os can implement multiple UARTs, SPI, I2C, and parallel buses, while the 1M system gates handle medium complexity state machines. Its 272 MHz performance supports 10/100 Ethernet bridging and control-plane logic without an external processor. The 147,456 RAM bits are useful for FIFOs and packet buffers in store-and-forward applications. The flash architecture eliminates external configuration memory, reducing board area and bill-of-materials cost in dense line cards. For wireless baseband control, the FPGA can connect to an RF transceiver or an MCU such as the CC430F5145, enabling a flexible digital front-end. Designers should pay attention to I/O standard selection to match LVCMOS, LVDS, or other interface levels.
Empfohlen
Aerospace and Avionics
The ProASIC3 flash FPGA family is widely used in avionics due to its non-volatile configuration, which prevents bitstream loss during power transients and eliminates the need for external configuration PROMs. The A3P1000-1FGG256T, in the military-temperature A3P1000-FGG256M variant, can cover -55C to +125C; the standard -1FGG256T is suitable for benign or conditioned environments. With 1M gates and 177 I/Os, it can implement bus interfaces (ARINC 429, MIL-STD-1553), sensor processing, and display control logic. The 147,456 RAM bits support packet buffering and small look-up tables. Engineers should review Microchip's reliability documentation and follow DO-254 design assurance guidelines when targeting airborne systems. The device's flash-based security features also help protect intellectual property.
Empfohlen
Medical Diagnostic and Imaging
Medical imaging and diagnostic instruments require deterministic, low-latency processing and flexible I/O. The A3P1000-1FGG256T addresses these needs with 177 user I/Os for sensor arrays, ADC interfaces, and display panels. The 272 MHz system performance allows parallel filtering and image pre-processing before a host DSP or processor takes over. The 1M system gates provide enough resources for custom timing generation, data aggregation, and protocol conversion. Flash-based instant-on behavior is beneficial in medical devices where immediate operation is required after power-up. The 147,456 RAM bits can buffer line-scan data or store calibration coefficients. Designers often combine this FPGA with an MSP430FR5994 for user interface control or a TMS320F28027 for motor control in imaging gantries. Medical certification should be evaluated with the complete system in mind.
Empfohlen
Automotive Body Electronics
The A3P1000-1FGG256T can serve in automotive body electronics where customizable logic, multiple communication interfaces, and reliable operation are required. Its 177 user I/Os can connect to LIN, CAN, and local sensor interfaces, while 1M gates provide enough capacity for seat control, lighting sequencing, and gateway logic. The 1.5 V core and 130 nm CMOS technology keep power dissipation low in the automotive environment. Designers must confirm AEC-Q100 qualification for their specific system; the non-qualified standard variant may be acceptable for development but production should use a qualified automotive ProASIC3 part. The flash-based configuration prevents corruption during vehicle power cycling. The 147,456 RAM bits support diagnostic logging and small look-up tables. Pairing this FPGA with a CAN-capable MCU such as the MSP430F5304 can streamline system partitioning.
Empfohlen
Test and Measurement
Test equipment needs flexible logic, precise timing, and many channels. The A3P1000-1FGG256T supplies 177 user I/Os that can be configured for counter/timer inputs, trigger logic, data acquisition, and instrument control. The 272 MHz internal operation supports high-speed state machines and digital signal processing functions such as averaging and threshold detection. The 147,456 RAM bits allow deep FIFOs for capturing high-rate samples before offload to a PC or host processor. Flash-based instant-on is valuable for bench instruments that must boot quickly. The 1M system gates are sufficient for implementing custom trigger modes and logic analyzers in an FPGA. Designers can interface the FPGA to precision data converters or microcontrollers such as the MSP432E401Y for Ethernet connectivity. Careful I/O banking and clock planning are essential for channel-to-channel skew.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P1000-1FGG256T – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P1000-1FGG256I | A3P1000-2FGG256 | A3P1000-FGG256M |
|---|---|---|---|---|
| Package | 256-LBGA (FBGA) | 256-LBGA (FBGA) | 256-LBGA (FBGA) | 256-LBGA (FBGA) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -1 | -1 | -2 | Standard |
| Number of User I/O | 177 | 177 | 177 | 177 |
| Total RAM Bits | 147,456 | 147,456 | 147,456 | 147,456 |
| System Gates | 1M | 1M | 1M | 1M |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Wichtigste Unterscheidungsmerkmale
- Flash-based non-volatile configuration eliminates external configuration memory (vs. SRAM-based FPGAs)
- 1M system gates and 177 I/Os in a 256-ball FBGA package (vs. A3P250-PQG100)
- Speed grade -1 balances performance and cost for mid-range designs (vs. A3P1000-2FGG256)
Designhinweise
Provide low-impedance decoupling on every 1.5 V core supply pin and all I/O supply banks. Use at least a 100 nF ceramic capacitor per supply pin and a 10 uF bulk capacitor per bank. Estimated: dynamic power for a 1M-gate FPGA at 50% logic utilization and 100 MHz is typically in the 100-300 mW range; always use Microchip's power estimator for your exact design. Flash FPGAs draw additional current during programming, so size the 1.5 V regulator with programming peak in mind.
The 256-ball LBGA package conducts heat through the solder balls and the PCB. Provide a solid thermal ground plane and add thermal vias under the package if the design allows. Estimated: at 300 mW power dissipation and a typical theta_JA of 25-35 C/W, the junction temperature will rise approximately 8-11C above ambient. For high-density logic or high ambient temperatures, add airflow or a small heatsink. Always verify thermal performance with the final PCB stack-up.
Route the BGA fanout with a 0.8 mm or smaller via if using a 1.0 mm pitch 256-LBGA. Keep trace lengths matched for high-speed I/O groups and maintain controlled impedance for differential pairs. Place JTAG programming pins accessible on the board edge for in-system programming. Because ProASIC3 is flash-based, it does not require a serial configuration device, so no additional boot-memory layout is needed. Follow Microchip's layout guidelines for supply decoupling and signal integrity.
Compliance-Informationen
Compliance status was not explicitly stated in the verified web data. The T suffix in the part number may indicate a tape-and-reel or RoHS-compliant option, but this was not confirmed from the distributor snippets. Verify with Microchip's official product page before production.
