A3P125-2TQG144 - ProASIC3 Flash FPGA 1.5KLE TQFP-144 | Microchip
Teilenummer: A3P125-2TQG144 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $24.04 | $24,04 |
| 10 | $22.1 | $221,00 |
| 100 | $20.25 | $2.025,00 |
| 500 | $18.6 | $9.300,00 |
| 1.000 | $17.1 | $17.100,00 |
A3P125-2TQG144 Übersicht
A flash-based FPGA is a field-programmable gate array whose configuration data is stored in on-chip flash memory rather than an external configuration device or volatile SRAM. In the programmable-logic hierarchy, it sits between low-density CPLDs and high-end SRAM FPGAs, offering single-chip, nonvolatile, instant-on operation that simplifies power sequencing and removes the need for a boot flash, making it a power management and board-space friendly alternative to SRAM FPGA solutions.
Key features include live-at-power-up nonvolatile flash programming, reprogrammability for in-field updates, low total cost of ownership through a single-chip solution, and a -2 speed grade suited to mid-speed logic, glue logic, bus bridging, and control applications. The 144-pin TQFP (20x20 mm) surface-mount package offers hand-solderable lead pitches for prototyping and avoids the complexity of ball-grid-array inspection.
Architecturally, ProASIC3 uses a fine-grained VersaTile logic fabric in which each tile can act as a look-up table, a D flip-flop, or memory, combined with embedded flash blocks providing the 36,864 bits of distributed and FIFO-capable RAM. The 1.5V core with 3.3V-capable I/O banks integrates easily into legacy 3.3V systems.
Typical applications include industrial control and automation, communications bridging, aerospace and defense porosable logic, medical instrumentation glue logic, and embedded system controller integration where instant-on and configuration security matter.
Design consideration: verify I/O bank voltage assignment in Libero SoC before layout, since TQFP-144 pinout flexibility is limited compared to larger packages.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3P125-2TQG144 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P125-2TQG144 (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, System Gates, Configuration, Logic Elements.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P125-2TQG144I
✅ Drop-In✓ Auf Lager
$23.95 / Stück
Datenblatt ansehen →A3P060-2TQG144
✅ Drop-In✓ Auf Lager
$8.1 / Stück
Datenblatt ansehen →A3P060-2TQG144I
✅ Drop-In✓ Auf Lager
$18.6 / Stück
Datenblatt ansehen →A3P125-2TQG144 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3 |
| System Gates | 125000 gates |
| Logic Elements | 1500 LEs |
| Embedded RAM | 36864 bits |
| User I/O | 100 |
| Maximum System Frequency | 310 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -2 |
| Programmability Type | Flash-based, nonvolatile, reprogrammable |
| Gehäuse | 144-TQFP (20x20 mm) |
| Montageart | Surface Mount |
| Configuration | Single-chip, instant-on (no external boot device) |
A3P125-2TQG144 144-tqfp (20x20 mm) Pinbelegungsleitfaden
Pinbelegung für A3P125-2TQG144 (144-tqfp (20x20 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3P125-2TQG144.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3P125-2TQG144 ist geeignet für 6 Anwendungs: Industrial Control and Automation, Aerospace and Defense Logic, Communications Bridging and Interface Conversion, Medical Instrumentation Glue Logic, Embedded System Controller Integration, Test and Measurement Equipment.
Industrial Control and Automation
The A3P125-2TQG144 fits industrial control and automation systems that need flexible glue logic, sensor interfacing, and motor-control support functions with high reliability. Its 125K gates and 1,500 LEs comfortably implement PWM generators, quadrature encoders, UART/SPI/I2C bridging, and state machines, while 36,864 bits of embedded RAM buffer sensor data and communication frames. Because the configuration is stored in on-chip flash, the FPGA is live at power-up with no external boot device, meeting industrial requirements for deterministic startup after power loss. The 144-pin TQFP package simplifies board assembly for mid-volume industrial products, and the 1.5V core keeps static power low in always-on control cabinets.
Empfohlen
Aerospace and Defense Logic
ProASIC3 devices are widely deployed in aerospace and defense because flash-based configuration keeps the bitstream off-board, providing inherent design security against interception compared with SRAM FPGAs that load an external configuration flash at every power-up. The A3P125-2TQG144 provides 125K gates at 310 MHz system performance, suitable for bus interfacing, telemetry formatting, and custom protocol bridges in avionics and ground systems. Its single-chip, instant-on behavior eliminates configuration-time windows that complicate safety analysis. For programs with extended temperature requirements, the pin-identical industrial-grade A3P125-2TQG144I should be evaluated, and radiation-characterized family variants should be confirmed with Microchip.
Empfohlen
Communications Bridging and Interface Conversion
The A3P125-2TQG144 serves as a protocol bridge in networking and communication equipment, converting between legacy parallel buses and serial interfaces such as SPI, I2C, and UART streams. With 100 user I/Os in the 144-pin TQFP, it has enough pins to terminate a 16- or 32-bit parallel bus on one side and multiple serial ports on the other, while 36,864 bits of RAM implement FIFOs for clock-domain crossing. The -2 speed grade supports logic up to a 310 MHz system ceiling, ample for sub-100 MHz interface clocking. Flash programming enables field firmware updates of the bridge logic without a boot PROM, reducing service complexity in deployed communication racks.
Empfohlen
Medical Instrumentation Glue Logic
Medical diagnostic and monitoring instruments benefit from the A3P125-2TQG144 as deterministic, instantly-ready glue logic between analog front ends, microcontrollers, and display or communication subsystems. The nonvolatile flash fabric means the FPGA is functional the moment power is applied, which matters for instruments with strict startup-time requirements and for battery-backed standby operation. Its 1.5V core draws low static power, helpful in portable and bedside equipment thermal budgets. The 125K-gate fabric implements timing controllers, filter accelerators, and sensor aggregation logic, while the TQFP-144 package supports straightforward inspection and rework appropriate to medical device manufacturing and quality processes.
Empfohlen
Embedded System Controller Integration
The A3P125-2TQG144 consolidates scattered discrete logic in embedded systems: address decoders, interrupt controllers, watchdog timers, LED and display drivers, and custom peripheral interfaces. Replacing 74-series glue logic with a single reprogrammable ProASIC3 device reduces board area, BOM line items, and inventory risk while enabling late-stage design changes through reprogramming. With 100 I/Os at 3.3V-compatible banks, it connects directly to legacy 3.3V microprocessor buses, and the 310 MHz fabric ceiling covers most controller-support logic with timing margin. The flash fabric retains configuration through power cycles, so the system operates correctly even if the host MCU boots later.
Empfohlen
Test and Measurement Equipment
In test and measurement instruments, the A3P125-2TQG144 implements trigger logic, timing generators, counters, and data-acquisition sequencing. The -2 speed grade and 310 MHz system performance support fast counter and timestamp functions, while 36,864 RAM bits buffer measurement samples before host transfer. Flash-based instant-on configuration ensures the instrument's acquisition hardware is ready during the MCU boot sequence, shortening time-to-first-measurement. The TQFP-144 package keeps signal lengths predictable and is compatible with standard SMT assembly used by instrument manufacturers. Designers should verify I/O bank assignments in Libero SoC early, since mixed-voltage probes and front-end circuits may impose bank-level constraints on pin placement.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P125-2TQG144 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P125-2TQG144I | A3P060-2TQG144 | A3P060-2TQG144I | A3P125-1VQG100I |
|---|---|---|---|---|---|
| Package | 144-TQFP | 144-TQFP - same | 144-TQFP - same | 144-TQFP - same | 100-VQ - different |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 125000 | 125000 | approx 60000 | approx 60000 | 125000 |
| Speed Grade | -2 (310 MHz) | -2 (310 MHz) | -2 | -2 | -1 |
| Temperature Range | Commercial | Industrial | Commercial | Industrial | Industrial |
| Configuration | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on |
Wichtigste Unterscheidungsmerkmale
- Highest density in the TQFP-144 ProASIC3 offering on this footprint (vs. A3P060-2TQG144)
- Faster speed grade for timing-critical logic (vs. A3P125-1VQG100I)
- Industrial-grade drop-in available on identical footprint (vs. A3P125-2TQG144I)
Designhinweise
The A3P125-2TQG144 requires a 1.5V core supply with I/O banks typically at 3.3V. Estimated: static power for a 125K-gate ProASIC3 at 1.5V is low (single-digit mW range) but dynamic power scales with clock frequency and toggle rate - use Microchip's power calculator in Libero SoC with your actual design to size the regulator. Decouple each supply pin with 0.1uF ceramics placed within 2 mm of the pin, plus bulk 10uF per rail.
TQFP-144 lead pitch is 0.5 mm, requiring careful solder-paste stencil design (laser-cut stainless steel, 0.1 mm thickness recommended) to avoid bridging. The fine pitch also makes this package reworkable with hot air, unlike BGA alternatives. Define the land pattern per the manufacturer package drawing and verify against your PCB house's fabrication capabilities before committing the stackup.
Do not mix commercial and industrial temperature grades unintentionally: A3P125-2TQG144 is commercial grade while A3P125-2TQG144I is industrial - substituting without checking application temperature range risks field failures. Also confirm that the -2 speed grade timing closure is re-verified if migrating designs from the slower -1 A3P125-1VQG100I variant, since speed grade affects static timing results.
Compliance-Informationen
Compliance data was not explicitly stated in the retrieved web data for this exact orderable part number. Verify RoHS/REACH certificates on the Microchip product page or request them from the distributor.
