A3P125-2TQG144I - ProASIC3 FPGA 125K Gates | Microchip
MPN: A3P125-2TQG144I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $34.5 | $34.50 |
| 10 | $31.8 | $318.00 |
| 100 | $28.4 | $2,840.00 |
| 500 | $26.1 | $13,050.00 |
| 1,000 | $23.95 | $23,950.00 |
Drop-in alternatives for A3P125-2TQG144I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3P125-1TQG144I
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P125-2TQG144
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$17.1 / Unit
View Datasheet βA3P125-1TQG144
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P125-2TQG144YI
β Drop-Inπ Reference alternative (not in catalog)
A3P125-2TQG144T
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
A3P125-2TQ144I
β Drop-Inπ Reference alternative (not in catalog)
A3P125-2TQG144I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 125,000 gates |
| Logic Blocks (CLBs) | 3072 |
| Number of I/O | 100 |
| Embedded RAM | 36864 bits |
| Maximum Frequency | 310 MHz |
| Process Technology | 130 nm CMOS |
| Supply Voltage | 1.425 V to 1.575 V (1.5 V core) |
| Package | 144-LQFP (TQFP-144), 0.5 mm pitch |
| Mounting Style | SMD/SMT |
| Minimum Operating Temperature | -40 C |
| Maximum Operating Temperature | +85 C |
| Speed Grade | -2 |
| Programmability Type | Flash-based, non-volatile, in-system reprogrammable |
| Packaging | Tray |
| Series | ProASIC3 A3P125 |
A3P125-2TQG144I 144-lqfp (tqfp-144), 0.5 mm pitch Pin Configuration Guide
Complete pinout information for A3P125-2TQG144I (144-lqfp (tqfp-144), 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P125-2TQG144I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P125-2TQG144I is suitable for 6 applications: Industrial Control and Automation, IoT Edge Gateways and Sensor Hubs, Embedded System Glue-Logic Consolidation, Aerospace and Military Control Logic, Motor Drive and Power Control Interfaces, Portable and Battery-Powered Instruments.
Industrial Control and Automation
The A3P125-2TQG144I fits industrial control because its -40C to +85C industrial rating and flash-based non-volatile fabric survive factory-floor temperature swings and electrical noise without external boot memory. With 3072 logic tiles and 100 user I/Os, it consolidates PLC I/O sequencing, encoder interfaces, and safety interlock state machines that would otherwise need several CPLDs. Deployed between sensor headers and a host MCU or backplane, it provides deterministic, single-chip glue logic: no configuration time at power-up means outputs are valid within microseconds of rail good. The 1.5V core (1.425V to 1.575V) keeps dynamic power low in always-on cabinets, while the 0.5mm-pitch TQFP-144 is reworkable by contract manufacturers without BGA capability.
Recommended
IoT Edge Gateways and Sensor Hubs
For IoT gateways, the A3P125-2TQG144I acts as a real-time sensor aggregator between multiple digital sensors and a wireless SoC. Its 100 I/Os support SPI/I2C/UART fan-out beyond what a typical MCU offers, and the 36,864-bit distributed RAM buffers burst sensor streams before handoff. Because the flash fabric retains configuration through brownouts and field resets, remote nodes recover deterministically without reconfiguration hardware - a meaningful reliability gain over SRAM FPGAs that need a configuration flash and voltage-monitor sequencing. The low 1.5V core keeps standby contribution minimal, and Microchip explicitly targets Internet-of-Things designs for this family, making reference designs and Libero project templates readily available.
Recommended
Embedded System Glue-Logic Consolidation
Legacy boards often accumulate address decoders, bus bridges, interrupt controllers, and status registers across multiple 74-series devices. A single A3P125-2TQG144I replaces that cluster with 3072 reconfigurable tiles, cutting BOM lines, board area, and inventory risk. The TQFP-144 leads are visible for inspection and rework, unlike BGA equivalents, simplifying low-to-mid-volume production. Because the device is flash-based and reprogrammable in-system, late bus-timing fixes are firmware changes rather than board spins; Microchip's low-total-cost-of-ownership positioning for ProASIC3 maps directly to this use case. The 310 MHz fabric capability comfortably covers legacy bus interfaces running at 33-100 MHz with setup margin.
Recommended
Aerospace and Military Control Logic
ProASIC3 flash FPGAs are widely used in military and aerospace programs because the flash switching element is inherently more single-event-upset resistant than SRAM configuration cells, and the single-chip design eliminates the configuration-PROM failure point. The A3P125-2TQG144I's -40C to +85C range suits ruggedized ground and avionic equipment, and its 130nm flash fabric is a well-characterized, radiation-tolerant-adjacent technology used across many Microsemi flight programs. With 100 I/Os it implements redundant sensor voting, telemetry formatting, and safe-mode sequencers. Designers should pair it with Libero SoC timing closure at the -2 grade and apply external supervision circuits for SEU-sensitive missions per Microchip reliability application notes.
Recommended
Motor Drive and Power Control Interfaces
In digital power and motor-drive systems, the A3P125-2TQG144I generates PWM dead-time logic, gate interleaving, and fault shutdown paths alongside a C2000-class MCU. The 310 MHz-capable fabric resolves PWM granularity far below MCU-peripheral limits, and deterministic fabric routing keeps fault-propagation latency constant - important for overcurrent protection. Its 100 I/Os drive six-phase inverter headers, ADC trigger distribution, and encoder inputs concurrently. The industrial temperature grade matches drive-environment ambient conditions, and flash configurability lets one hardware platform serve multiple motor topologies by reloading the fabric. Designers must respect 1.5V core sequencing and isolate FPGA I/O banks from inverter switching noise with proper grounding.
Recommended
Portable and Battery-Powered Instruments
Handheld instruments benefit from the A3P125-2TQG144I's instant-on flash configuration: measurement front-ends are functional the moment power is applied, with no boot delay or external configuration memory draw. The 1.5V core operation (1.425V to 1.575V) allows direct connection to a single-cell buck or LDO rail, and the modest 36,864-bit RAM handles display buffering and averaging filters in small instruments. The TQFP-144's 0.5mm pitch is producible on standard two- to four-layer boards, keeping instrument PCB cost low. With 100 I/Os, one device manages LCD or OLED interfaces, keypad scanning, and USB-UART bridging simultaneously, consolidating what would otherwise be a multi-chip digital section.
Recommended
Recommended Products Summary
Engineering reference data for A3P125-2TQG144I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P125-1TQG144I | A3P125-2TQG144YI | A3P125-2TQG144 | A3P125-1TQG144 | A3P125-2TQG144T |
|---|---|---|---|---|---|---|
| Package | TQFP-144 (TQG144), 0.5 mm pitch | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 125,000 | 125,000 | 125,000 | 125,000 | 125,000 | 125,000 |
| Speed Grade | -2 (up to 310 MHz system) | -1 (slower) | -2 (same) | -2 (same) | -1 (slower) | -2 (same) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | 0C to +70C (commercial) | 0C to +70C (commercial) | -40C to +85C |
| User I/O | 100 | 100 | 100 | 100 | 100 | 100 |
| Embedded RAM | 36864 bits | 36864 bits | 36864 bits | 36864 bits | 36864 bits | 36864 bits |
| Core Supply Voltage | 1.425 V to 1.575 V (1.5 V) | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Approx. Unit Price (qty 1) | $34.50 (as of 2026-08-31) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Faster -2 speed grade at identical cost structure (vs A3P125-1TQG144I)
- Industrial temperature rating (vs A3P125-2TQG144)
- Flash-based single-chip architecture vs SRAM FPGA alternatives (vs AMD Xilinx Spartan-class devices)
Design Notes
Supply the 1.5V core with a regulator that stays within 1.425V to 1.575V under all load transients; because the fabric is flash-based there is no configuration inrush, but core current scales with clock activity, so decouple each VCC pin pair with 0.1uF plus bulk 10uF near the TQFP-144 corners. I/O bank VCCI rails depend on the chosen I/O standards - group same-voltage standards per bank during pin assignment in Libero SoC to minimize external regulators.
The 0.5mm-pitch TQFP-144 escapes easily on a four-layer board with 0.2mm vias and short dog-bone traces; on two-layer boards keep fan-out stubs under 5mm to preserve signal integrity on 50MHz+ clocks. Place a solid ground plane directly under the device and stitch JTAG (TCK) as a short series-terminated trace with pull-downs per Microchip FlashPro programming guidance. Reserve board space for 0.1uF caps on every other lead group around the perimeter.
Do not confuse ordering-code suffixes: 'I' is industrial (-40C to +85C) while non-suffixed parts are commercial (0C to +70C) - substituting a commercial variant into an industrial BOM is a reliability failure. Similarly, the -1 speed grade is pin-compatible but not timing-equivalent; re-run timing analysis at worst-case corners before switching. Confirm G-suffix (green/RoHS) packaging requirements with the official Microchip material declaration for regulated builds.
Compliance Information
The 'G' suffix in TQG144 denotes Microchip/Microsemi green packaging (RoHS, lead-free). REACH, halogen-free, and conflict-minerals declarations should be confirmed via the official Microchip material-declaration certificate for this exact ordering code.
