A3P250-2VQG100 - ProASIC3 FPGA, 68 I/O, 1.5V | Microchip
Teilenummer: A3P250-2VQG100 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $24.9 | $24,90 |
| 10 | $22.6 | $226,00 |
| 100 | $20.4 | $2.040,00 |
| 500 | $18.9 | $9.450,00 |
| 1.000 | $17.5 | $17.500,00 |
A3P250-2VQG100 Übersicht
A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that the designer programs after manufacturing. Unlike SRAM-based FPGAs that require an external configuration device, the ProASIC3 family stores its configuration in on-chip flash, making it a true single-chip solution within the broader hierarchy of programmable logic devices (FPGA -> programmable logic IC -> digital IC).
Key differentiating features include flash-based, live-at-power-up operation with no external boot device, low total cost of ownership, reprogrammability for in-field updates, and small-footprint packaging. The 1.5V core keeps dynamic power low, while the -2 speed grade delivers up to 310 MHz internal performance for compact control and glue-logic designs.
The ProASIC3 architecture uses fine-grained VersaTiles with 3-input look-up tables, backed by embedded flash blocks providing the 36864 bits of on-chip memory. The single-chip, instant-on nature eliminates configuration PROMs, improving board reliability and reducing BOM cost, and the flash cell is inherently resistant to configuration upset compared with SRAM fabrics.
Typical applications include industrial control and automation, portable and battery-powered instruments, aerospace and defense secure designs, communications bridge logic, and medical diagnostic equipment - anywhere a compact, low-power, instant-on programmable device is preferred over a larger SRAM FPGA.
When designing with the A3P250-2VQG100, decouple the 1.5V core and 3.3V I/O supplies with appropriate ceramic capacitor networks, and confirm commercial-grade temperature limits (0C to +70C) against the intended environment - industrial-temperature variants use different ordering codes.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers a one-stop selection reference.
Drop-in-Alternativen für A3P250-2VQG100 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P250-2VQG100 (gleiche Bauform und Footprint) – abweichend in Package, System Gates, Technology, Logic Elements, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P250L-1VQG100I
✅ Drop-In✓ Auf Lager
$7.5 / Stück
Datenblatt ansehen →A3P060-2VQG100
✅ Drop-In✓ Auf Lager
$21.6 / Stück
Datenblatt ansehen →A3P060-2VQG100I
✅ Drop-In✓ Auf Lager
$19.75 / Stück
Datenblatt ansehen →A3P030-2VQG100I
✅ Drop-In✓ Auf Lager
$5.06 / Stück
Datenblatt ansehen →A3P125-1VQG100I
✅ Drop-In✓ Auf Lager
$9.44 / Stück
Datenblatt ansehen →A3P250-2VQG100 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3 |
| Logic Elements (LEs) | 3K LEs |
| Number of I/Os | 68 I/O |
| Embedded Memory | 36864 bits |
| Core Supply Voltage | 1.5 V |
| Maximum System Frequency | 310 MHz |
| Speed Grade | -2 |
| Programmable Technology | Flash-based |
| Configuration | Single-chip, no external boot device |
| Betriebstemperatur | 0C to +70C |
| Gehäuse | 100-TQFP (VQFP-100) |
| Montagestil | SMD/SMT |
| Packaging | Tray |
| Lead Free | Yes (per Kynix: LEAD FREE) |
| Maximum Operating Temperature | +70C |
| Minimum Operating Temperature | 0C |
A3P250-2VQG100 100-tqfp (vqfp-100) Pinbelegungsleitfaden
Pinbelegung für A3P250-2VQG100 (100-tqfp (vqfp-100)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3P250-2VQG100.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3P250-2VQG100 ist geeignet für 6 Anwendungs: Industrial Control and Automation, Portable and Battery-Powered Instruments, Aerospace and Defense Secure Logic, Communications Bridge and Protocol Conversion, Medical Diagnostic Equipment, Smart Home and IoT Gateway Logic.
Industrial Control and Automation
The A3P250-2VQG100 fits industrial control panels, PLC I/O expansion, and machine-interface glue logic where a compact 100-TQFP footprint and instant-on flash configuration simplify system bring-up. Its 68 user I/Os accommodate parallel sensor and actuator interfaces, while the 36864-bit embedded flash buffers look-up tables and small data sets locally. Because it is live at power-up with no external boot device, safety-relevant interlocks and I/O defaults are active immediately after power is applied - a meaningful advantage over SRAM FPGAs that need milliseconds of configuration time. The 310 MHz -2 speed grade comfortably handles state machines, PWM generation, and communication bridging at industrial rates, while the 1.5V core keeps dissipation low inside sealed enclosures.
Empfohlen
Portable and Battery-Powered Instruments
In handheld test tools, portable data loggers, and battery-powered instrumentation, the A3P250-2VQG100's flash-based fabric contributes near-zero configuration energy and low static power, extending battery life versus SRAM FPGAs that draw configuration current. The 1.5V core supply reduces dynamic power for the 3K-LE fabric, and the compact 100-TQFP keeps PCB area small for encased products. Designers typically clock logic at modest rates well below the 310 MHz ceiling, trading speed for power, and use the 68 I/Os to drive LCD segments, keypads, and sensor buses. Because the bitstream resides in on-chip flash, a battery removal does not lose configuration, and units are functional the instant power returns.
Empfohlen
Aerospace and Defense Secure Logic
The ProASIC3 family is widely used in aerospace and defense programs because the flash cell is inherently resistant to configuration upset and the bitstream can be protected via FlashLock security, addressing concerns that plague SRAM-based fabrics. The A3P250-2VQG100's single-chip operation removes the external configuration PROM that would otherwise be an attack or single-failure point. Its 68 I/Os implement customs interfaces and bus bridges, while the 36864-bit flash memory stores coefficients or mission tables. Note that the commercial 0C to +70C rating of this exact ordering code limits it to benign environments; industrial variants with the I suffix cover -40C for wider deployment scenarios.
Empfohlen
Communications Bridge and Protocol Conversion
The A3P250-2VQG100 serves as a protocol bridge between legacy parallel interfaces and serial links in networking and communication equipment. Its 310 MHz -2 speed grade supports serial shift registers, framing logic, and UART/SPI/I2C conversion cores at line rates typical of industrial networking, while the 3K-LE fabric holds multiple small protocol engines simultaneously. The 36864-bit embedded flash implements FIFO buffering between clock domains, and the 68 I/Os support mixed-voltage board interfacing under ProASIC3 I/O bank rules. Instant-on behavior means the bridge is operational during system boot, eliminating the window in which an SRAM FPGA would miss early bus traffic.
Empfohlen
Medical Diagnostic Equipment
Benchtop medical analyzers and diagnostic instruments use the A3P250-2VQG100 for sensor front-end sequencing, motor control of sample handling, and host-interface glue logic. The flash fabric's deterministic, instant-on startup satisfies requirements for repeatable instrument power-up behavior, and the single-chip design simplifies regulatory documentation by removing external configuration components. The 1.5V core minimizes heat inside compact enclosures, and the 68 I/Os interface directly to ADCs, stepper drivers, and indicator subsystems. Designers should confirm that this commercial-grade (0C to +70C) part matches the laboratory environmental specification, selecting the industrial 'I' variant where transport or storage conditions exceed the commercial range.
Empfohlen
Smart Home and IoT Gateway Logic
In smart-home controllers and IoT gateways, the A3P250-2VQG100 offloads deterministic tasks - sensor polling, relay control, and wake-up logic - from the main processor, improving responsiveness and power profile. Flash configuration keeps the FPGA live at standby, allowing always-on monitoring functions without a processor reboot cycle, and reprogrammability supports field firmware updates of the fabric logic. The 100-TQFP package suits consumer cost structures, and the 1.5V core plus modest clock rates keep quiescent draw low for mains-buffered or battery-backed nodes. With 68 I/Os and 36864 bits of embedded memory, the device aggregates multi-sensor inputs and bridges them to the host over SPI or UART.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P250-2VQG100 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P250L-1VQG100I | A3P060-2VQG100 | A3P030-2VQG100I | A3P125-1VQG100I |
|---|---|---|---|---|---|
| Package | 100-TQFP (VQG100) | 100-TQFP (VQG100) - same | 100-TQFP (VQG100) - same | 100-TQFP (VQG100) - same | 100-TQFP (VQG100) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Family | ProASIC3 | ProASIC3L (low power) | ProASIC3 | ProASIC3 | ProASIC3 |
| Logic Elements | 3K LEs | 3K LEs | Fewer than 3K LEs | Smallest fabric in package | Fewer than 3K LEs |
| Core Voltage | 1.5 V | 1.2 V / 1.5 V (ProASIC3L) | 1.5 V | 1.5 V | 1.5 V |
| Speed Grade | -2 (up to 310 MHz) | -1 | -2 | -2 | -1 |
| Operating Temperature | 0C to +70C | Industrial (-40C) | 0C to +70C | Industrial (-40C) | Industrial (-40C) |
Wichtigste Unterscheidungsmerkmale
- Full 3K-LE capacity with maximum embedded memory in this package (vs. A3P060-2VQG100)
- Faster -2 speed grade (310 MHz) (vs. A3P250L-1VQG100I)
- Lowest cost for commercial environments (vs. A3P250L-1VQG100I)
- Trade-off: limited temperature range (vs. A3P030-2VQG100I)
Designhinweise
Estimated: ProASIC3 dynamic power scales with clock frequency and toggle rate. For a 3K-LE design clocked at 50 MHz, expect core current well under 100 mA from the 1.5V rail, but verify with Microchip's power calculator for your actual netlist. Decouple the 1.5V core with a bulk 10 uF ceramic plus several 0.1 uF ceramics placed within 5 mm of the core supply balls, and decouple each I/O bank supply similarly. Sequence supplies per the datasheet power-up specification; ProASIC3 parts tolerate most sequencing orders but the datasheet defines recommended ramps.
The 100-TQFP has 0.5 mm lead pitch - use a standard TQFP-100 land pattern per the Microchip package drawing and inspect with AOI for solder bridging on the fine-pitch leads. Keep JTAG programming traces (TDI, TDO, TMS, TCK) short and add pull resistors per the ProASIC3 programming specification to keep the JTAG port dormant during normal operation. Route I/O banks with attention to VCCI per-bank supplies so mixed-voltage interfaces do not share an unregulated rail.
A frequent pitfall is substituting this commercial-grade (0C to +70C) part into designs that must survive -40C cold start; use the industrial 'I' suffix variants such as A3P250L-1VQG100I instead. Another pitfall is assuming SRAM-FPGA configuration flows - ProASIC3 is flash-based, so no external PROM is used and configuration-related BOM items should be deleted from the design. Finally, treat pinout differences between A3P250 and smaller-die VQG100 devices (A3P060/A3P030) as real: same package does not guarantee identical I/O pin mapping, so verify with the Libero device library before reusing layouts.
Compliance-Informationen
Lead free per Kynix listing ('LEAD FREE'). Green (G-suffix) package option implies RoHS compliance; obtain formal RoHS/REACH declarations from Microchip or distributor at order time.
