A3P250-2FGG144I - ProASIC3 FPGA 250K Gates | Microchip
Teilenummer: A3P250-2FGG144I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $30.2 | $302,00 |
| 100 | $27.9 | $2.790,00 |
| 500 | $26.44 | $13.220,00 |
| 1.000 | $24.8 | $24.800,00 |
A3P250-2FGG144I Übersicht
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration ROM. Within the programmable logic hierarchy, the FPGA sits above CPLDs and below ASICs, offering reprogrammability with single-chip boot. ProASIC3 devices use a 130 nm flash process, which gives them inherent instant-on behavior and resistance to configuration upset compared to SRAM FPGAs.
Key features include a 1.5 V core supply, non-volatile flash programming that eliminates the external boot device, reprogrammability for field updates, and low total cost of ownership as highlighted by Microchip. The -2 speed grade balances performance and cost within the A3P250 family, supporting system clock rates up to 310 MHz in fabric-rich designs.
Architecturally, the A3P250 combines VersaTiles (fine-grained logic tiles), embedded SRAM blocks totaling 36 Kbits, and flexible I/O banks supporting multiple single-ended and differential standards. The flash cell-based switch fabric removes the need for configuration controllers and simplifies power sequencing.
Typical applications include industrial automation control, motor drive interface logic, communications protocol bridging, aerospace and defense glue logic, and secure single-chip designs where non-volatile configuration matters.
Design consideration: budget the 1.5 V core and 3.3 V I/O rails separately, and verify I/O bank voltage assignments against the 97 available user I/Os before pin locking in Libero SoC.
This page synthesizes distributor pricing, same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3P250-2FGG144I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P250-2FGG144I (gleiche Bauform und Footprint) – abweichend in Package, System Gates, RoHS Status, Operating Temperature, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P250-FGG144I
✅ Drop-In✓ Auf Lager
$14.06 / Stück
Datenblatt ansehen →A3P250-1FGG144T
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$19.2 / Stück
Datenblatt ansehen →A3P060-2FGG144
✅ Drop-In✓ Auf Lager
$5.62 / Stück
Datenblatt ansehen →A3P600-2FGG144I
✅ Drop-In✓ Auf Lager
$44.6 / Stück
Datenblatt ansehen →A3P1000-2FGG144I
✅ Drop-In✓ Auf Lager
$27.2 / Stück
Datenblatt ansehen →A3P600L-1FGG144
✅ Drop-In✓ Auf Lager
$29.4 / Stück
Datenblatt ansehen →A3P250-2FGG144I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3 |
| Logic Elements | 6144 LE (3K clusters) |
| System Gates | 250K |
| Maximum User I/O | 97 |
| Embedded Memory | 36864 bits |
| Maximum System Frequency | 310 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -2 |
| Betriebstemperatur | -40C to +85C (Industrial) |
| Gehäuse | 144-ball FBGA (FGG144) |
| Montagestil | SMD/SMT |
| Programming Technology | Non-volatile Flash |
| Packaging | Tray |
| RoHS-Status | ROHS3 Compliant |
| Configuration | Single-chip, instant-on |
A3P250-2FGG144I 144-ball fbga (fgg144) Pinbelegungsleitfaden
Pinbelegung für A3P250-2FGG144I (144-ball fbga (fgg144)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3P250-2FGG144I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3P250-2FGG144I ist geeignet für 6 Anwendungs: Industrial Automation Control, Communications Protocol Bridging, Aerospace and Defense Glue Logic, Secure Single-Chip Designs, Test and Measurement Instrumentation, Portable and Low-Power Embedded Systems.
Industrial Automation Control
The A3P250-2FGG144I fits industrial automation controllers because its -40C to +85C industrial rating, 97 user I/Os, and single-chip non-volatile flash configuration survive factory-floor conditions without a configuration device that could fail in vibration or temperature extremes. Its 310 MHz fabric capability handles encoder interpolation, state-machine control, and I/O expansion around a PLC backplane. In a typical topology the FPGA sits between sensors/actuators and a host MCU or CPU, offloading deterministic timing tasks; the 1.5 V core keeps static power low in always-on cabinets. The trade-off versus a microcontroller is development effort in Libero SoC, but you gain parallel I/O handling that software cannot match at equivalent latency.
Empfohlen
Communications Protocol Bridging
Protocol conversion between legacy interfaces (UART, SPI, parallel buses) and modern links is a classic ProASIC3 use case. The A3P250-2FGG144I's 6144 logic elements and 36864 bits of embedded block RAM implement FIFOs, deserializers, and glue logic; the -2 speed grade supports 310 MHz-class fabric clocks for high-throughput serial shifting. Flash configuration means the bridge is live at power-on with zero boot latency, valuable in telecom and networking equipment that must pass traffic immediately. With up to 97 I/Os in the 144-ball FBGA, wide parallel buses fit without pin multiplexing. Design the I/O bank voltages to match both protocol domains, and instantiate block RAM as rate-matching FIFOs to absorb clock-domain differences cleanly.
Empfohlen
Aerospace and Defense Glue Logic
Flash-based ProASIC3 devices are widely used in aerospace and defense subsystems because on-chip flash configuration resists configuration upset and removes external boot memory from the bill of materials. The A3P250-2FGG144I provides 250K gates of instant-on logic for board-level glue functions - bus arbitration, memory interface adaptation, discrete I/O conditioning - in a compact 144-ball FBGA. Its 1.5 V core reduces power in conduction-cooled enclosures, and the industrial temperature variant covers extended environments for many programs (verify qualification requirements per program). Use Libero SoC with formal verification flows for high-reliability sign-off, and lock pins early because FBGA rework is costly.
Empfohlen
Secure Single-Chip Designs
Because configuration is stored in on-chip flash rather than an external bitstream PROM, the A3P250-2FGG144I reduces the attack surface for bitstream interception - a key reason designers choose ProASIC3 for secure and anti-tamper-sensitive logic. Single-chip operation also shortens the supply chain for sensitive designs. The part supports Microchip's FlashLock security features to disable readback of programmed content, and reprogrammability allows security patch updates in the field via JTAG. With 250K gates and 36864 bits of block RAM, typical secure designs include authentication engines, key-store interfaces, and tamper-response state machines. The trade-off: JTAG remains required for updates, so production units should disable JTAG access per your security policy.
Empfohlen
Test and Measurement Instrumentation
Bench instruments benefit from the A3P250-2FGG144I's combination of deterministic parallel logic and instant-on boot. Timing generators, trigger engines, and pattern generators map efficiently onto its 6144 logic elements, while the 310 MHz fabric supports sub-10 ns edge resolution with careful pipelining. The 97 user I/Os drive probe headers, relay matrices, and front-panel interfaces directly. Flash configuration means the instrument is ready the instant power is applied, matching user expectations for stand-alone equipment. Implement clock-domain crossing with synchronous FIFOs in block RAM, and route high-speed measurement clocks with length-matched traces on the FBGA breakout. Reserve spare I/O for self-test features to simplify production calibration.
Empfohlen
Portable and Low-Power Embedded Systems
The A3P250-2FGG144I's 1.5 V core and flash-based zero-static-configuration architecture suit battery-powered and thermally constrained embedded systems. Unlike SRAM FPGAs that draw configuration current at every power-up, ProASIC3 boots with no external configuration reads, minimizing energy per activation cycle - valuable in duty-cycled portable instruments. The small 144-ball FBGA keeps board area compact for handheld enclosures, while 250K gates provide enough capacity for sensor fusion preprocessing and display interface logic. For even lower power, the low-power A3P600L family members share design methodology within Libero SoC. Estimate power with Microchip's tools at your actual toggle rates, since static and dynamic contributions differ significantly by design activity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P250-2FGG144I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P250-FGG144I | A3P250-1FGG144T | A3P060-2FGG144 | A3P600-2FGG144I |
|---|---|---|---|---|---|
| Package | 144-ball FBGA (FGG144) | 144-ball FBGA (FGG144) - same | 144-ball FBGA (FGG144) - same | 144-ball FBGA (FGG144) - same | 144-ball FBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250K | 250K | 250K | ~60K | ~600K |
| Speed Grade | -2 | Standard | -1 | -2 | -2 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS | ROHS3 Compliant | Compliant | Compliant | Compliant | Compliant |
Wichtigste Unterscheidungsmerkmale
- Faster -2 speed grade within same FGG144 footprint (vs. A3P250-FGG144I)
- Highest usable logic capacity in the 144-ball FBGA at mid cost (vs. A3P060-2FGG144)
- Lower cost and power than upsized parts when 250K gates suffice (vs. A3P600-2FGG144I)
- Non-volatile flash configuration eliminates external boot device (vs. SRAM-based FPGAs (cross-brand))
Designhinweise
The A3P250-2FGG144I requires a 1.5 V core rail and I/O bank rails (typically 3.3 V or per your standard). Because flash FPGAs do not draw configuration current, static power is dominated by core leakage and I/O termination. Estimate total power in Libero SoC's power calculator using your actual design toggle rates rather than worst-case defaults - dynamic power scales linearly with switching activity. Sequence power-up with the core stable before or with the I/O rails to avoid latch-up risk; ProASIC3 does not require a strict ordering but simultaneous ramp is best practice. Add 10 uF bulk plus 0.1 uF ceramic decoupling at each supply pin cluster on the FBGA breakout.
The FGG144 fine-pitch BGA needs a controlled breakout: use via-in-pad or dog-bone fanout with 0.3 mm minimum drill vias and keep escape traces at 4 mil width/spacing where your fabricator supports it. Place the 1.5 V core plane as a dedicated internal layer to minimize core rail impedance, and distribute I/O bank decoupling capacitors within 2 mm of ball assignments. Because FBGA rework is difficult, lock your pin assignment in Libero SoC only after confirming bank voltage compatibility - moving signals across banks with mismatched VCCI after layout is a common and costly mistake.
Speed-grade substitution is the top field failure mode with this family: a design that closes timing on a -2 device may fail on a standard or -1 grade replacement even though the package pin map is identical. Always re-run Libero SoC timing analysis on any alternate order code before approving a substitution. Also remember the 'I' suffix denotes industrial -40C to +85C rating - do not swap in a commercial-temperature variant for industrial builds. Finally, JTAG programming requires FlashPro hardware; plan production programming fixtures early since the on-chip flash must be programmed at test if no field-programming step exists.
Compliance-Informationen
ROHS3 Compliant and lead free per ics-100.com stock listing. REACH, halogen-free, and conflict-minerals status not stated in provided data.
