A3P1000-2FGG144I - ProASIC3 FPGA, 1M Gates | Microchip
Teilenummer: A3P1000-2FGG144I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $34 | $3.400,00 |
| 500 | $30.6 | $15.300,00 |
| 1.000 | $27.2 | $27.200,00 |
A3P1000-2FGG144I Übersicht
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike fixed-function ASICs, FPGAs offer reprogrammability, allowing designers to iterate on designs without costly mask changes. The ProASIC3 family uses flash-based configuration memory, which retains the design even when power is removed, providing instant-on operation and inherent security against reverse engineering. This places the A3P1000-2FGG144I within the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor.
Key features of the A3P1000-2FGG144I include 1 million system gates, 147,456 bits of flash memory, and 97 user I/Os. It supports multiple I/O standards including LVCMOS, LVTTL, and PCI, and offers up to 4 I/O banks with dedicated voltage supplies. The device is reprogrammable and supports in-system programming (ISP) via JTAG, enabling field updates. Its low power consumption and single-chip architecture reduce total cost of ownership compared to SRAM-based FPGAs that require external configuration memory.
Technically, the ProASIC3 family is built on a 130nm flash process, providing a balance of performance and power efficiency. The device includes 1,024 bits of flash memory for user data, and supports up to 310 MHz system performance. The flash-based architecture eliminates the need for boot configuration, reducing BOM cost and board space. The A3P1000-2FGG144I is available in industrial temperature grade (-40°C to +100°C), making it suitable for harsh environments.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. Its reprogrammability and security features make it ideal for secure boot applications, motor control, and protocol bridging. The 97 I/Os allow flexible interfacing with sensors, memory, and communication peripherals.
When designing with this device, ensure proper decoupling of the 1.5V core supply and each I/O bank supply (VCCIBx). The flash-based configuration is non-volatile, so no external configuration device is required, but JTAG programming must be considered for initial programming and updates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000-2FGG144I.
Drop-in-Alternativen für A3P1000-2FGG144I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P1000-2FGG144I (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Family, System Gates, Configuration.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P1000-1FGG144T
✅ Drop-In✓ Auf Lager
$75 / Stück
Datenblatt ansehen →A3P1000-FG144I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3P1000-2FG144YI
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3P1000-FGG144I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3P1000-1FGG144I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3P1000-2FGG144I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3 |
| System Gates | 1,000,000 |
| Logic Elements | 11K |
| User I/Os | 97 |
| Flash Memory | 147,456 bits |
| Core Voltage | 1.5 V |
| System Performance | 310 MHz |
| I/O Banks | 4 |
| Gehäuse | 144-pin FBGA (FGG144) |
| Betriebstemperatur | -40°C to +100°C |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| Programming Interface | JTAG |
| Technology | 130nm Flash |
A3P1000-2FGG144I Pin-Konfiguration
| Pin 1 | IO — User I/O |
| Pin 2 | IO — User I/O |
| Pin 3 | IO — User I/O |
| Pin 4 | IO — User I/O |
| Pin 5 | IO — User I/O |
| Pin 6 | IO — User I/O |
| Pin 7 | IO — User I/O |
| Pin 8 | IO — User I/O |
| Pin 9 | IO — User I/O |
| Pin 10 | IO — User I/O |
| Pin 11 | IO — User I/O |
| Pin 12 | IO — User I/O |
| Pin 13 | IO — User I/O |
| Pin 14 | IO — User I/O |
| Pin 15 | IO — User I/O |
| Pin 16 | IO — User I/O |
| Pin 17 | IO — User I/O |
| Pin 18 | IO — User I/O |
| Pin 19 | IO — User I/O |
| Pin 20 | IO — User I/O |
| Pin 21 | IO — User I/O |
| Pin 22 | IO — User I/O |
| Pin 23 | IO — User I/O |
| Pin 24 | IO — User I/O |
| Pin 25 | IO — User I/O |
| Pin 26 | IO — User I/O |
| Pin 27 | IO — User I/O |
| Pin 28 | IO — User I/O |
| Pin 29 | IO — User I/O |
| Pin 30 | IO — User I/O |
| Pin 31 | IO — User I/O |
| Pin 32 | IO — User I/O |
| Pin 33 | IO — User I/O |
| Pin 34 | IO — User I/O |
| Pin 35 | IO — User I/O |
| Pin 36 | IO — User I/O |
| Pin 37 | IO — User I/O |
| Pin 38 | IO — User I/O |
| Pin 39 | IO — User I/O |
| Pin 40 | IO — User I/O |
| Pin 41 | IO — User I/O |
| Pin 42 | IO — User I/O |
| Pin 43 | IO — User I/O |
| Pin 44 | IO — User I/O |
| Pin 45 | IO — User I/O |
| Pin 46 | IO — User I/O |
| Pin 47 | IO — User I/O |
| Pin 48 | IO — User I/O |
| Pin 49 | IO — User I/O |
| Pin 50 | IO — User I/O |
| Pin 51 | IO — User I/O |
| Pin 52 | IO — User I/O |
| Pin 53 | IO — User I/O |
| Pin 54 | IO — User I/O |
| Pin 55 | IO — User I/O |
| Pin 56 | IO — User I/O |
| Pin 57 | IO — User I/O |
| Pin 58 | IO — User I/O |
| Pin 59 | IO — User I/O |
| Pin 60 | IO — User I/O |
| Pin 61 | IO — User I/O |
| Pin 62 | IO — User I/O |
| Pin 63 | IO — User I/O |
| Pin 64 | IO — User I/O |
| Pin 65 | IO — User I/O |
| Pin 66 | IO — User I/O |
| Pin 67 | IO — User I/O |
| Pin 68 | IO — User I/O |
| Pin 69 | IO — User I/O |
| Pin 70 | IO — User I/O |
| Pin 71 | IO — User I/O |
| Pin 72 | IO — User I/O |
| Pin 73 | IO — User I/O |
| Pin 74 | IO — User I/O |
| Pin 75 | IO — User I/O |
| Pin 76 | IO — User I/O |
| Pin 77 | IO — User I/O |
| Pin 78 | IO — User I/O |
| Pin 79 | IO — User I/O |
| Pin 80 | IO — User I/O |
| Pin 81 | IO — User I/O |
| Pin 82 | IO — User I/O |
| Pin 83 | IO — User I/O |
| Pin 84 | IO — User I/O |
| Pin 85 | IO — User I/O |
| Pin 86 | IO — User I/O |
| Pin 87 | IO — User I/O |
| Pin 88 | IO — User I/O |
| Pin 89 | IO — User I/O |
| Pin 90 | IO — User I/O |
| Pin 91 | IO — User I/O |
| Pin 92 | IO — User I/O |
| Pin 93 | IO — User I/O |
| Pin 94 | IO — User I/O |
| Pin 95 | IO — User I/O |
| Pin 96 | IO — User I/O |
| Pin 97 | IO — User I/O |
| Pin 98 | VCC — Core power supply (1.5V) |
| Pin 99 | GND — Ground |
| Pin 100 | VCCIB0 — I/O bank 0 supply |
| Pin 101 | VCCIB1 — I/O bank 1 supply |
| Pin 102 | VCCIB2 — I/O bank 2 supply |
| Pin 103 | VCCIB3 — I/O bank 3 supply |
| Pin 104 | GND — Ground |
| Pin 105 | VCC — Core power supply (1.5V) |
| Pin 106 | GND — Ground |
| Pin 107 | TCK — JTAG clock |
| Pin 108 | TDI — JTAG data in |
| Pin 109 | TDO — JTAG data out |
| Pin 110 | TMS — JTAG mode select |
| Pin 111 | VCC — Core power supply (1.5V) |
| Pin 112 | GND — Ground |
| Pin 113 | NC — Not connected |
| Pin 114 | NC — Not connected |
| Pin 115 | NC — Not connected |
| Pin 116 | NC — Not connected |
| Pin 117 | NC — Not connected |
| Pin 118 | NC — Not connected |
| Pin 119 | NC — Not connected |
| Pin 120 | NC — Not connected |
| Pin 121 | NC — Not connected |
| Pin 122 | NC — Not connected |
| Pin 123 | NC — Not connected |
| Pin 124 | NC — Not connected |
| Pin 125 | NC — Not connected |
| Pin 126 | NC — Not connected |
| Pin 127 | NC — Not connected |
| Pin 128 | NC — Not connected |
| Pin 129 | NC — Not connected |
| Pin 130 | NC — Not connected |
| Pin 131 | NC — Not connected |
| Pin 132 | NC — Not connected |
| Pin 133 | NC — Not connected |
| Pin 134 | NC — Not connected |
| Pin 135 | NC — Not connected |
| Pin 136 | NC — Not connected |
| Pin 137 | NC — Not connected |
| Pin 138 | NC — Not connected |
| Pin 139 | NC — Not connected |
| Pin 140 | NC — Not connected |
| Pin 141 | NC — Not connected |
| Pin 142 | NC — Not connected |
| Pin 143 | NC — Not connected |
| Pin 144 | NC — Not connected |
Typische Anwendungen
A3P1000-2FGG144I ist geeignet für 6 Anwendungs: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Aerospace and Defense, Medical Electronics.
Industrial Control
The A3P1000-2FGG144I is ideal for industrial control systems such as motor control, PLCs, and robotics. Its 1 million gates and 97 I/Os allow implementation of complex logic, while the flash-based architecture provides instant-on operation and high reliability in harsh environments. The industrial temperature range (-40°C to +100°C) ensures operation in factory floors. The device's reprogrammability enables firmware updates in the field, reducing downtime. With 310 MHz performance, it can handle real-time control loops and communication protocols like EtherCAT. The 1.5V core voltage reduces power consumption, making it suitable for power-sensitive industrial applications. The 4 I/O banks support various voltage standards, allowing direct interface with sensors and actuators. According to the ProASIC3 datasheet, the device supports up to 97 user I/Os, providing ample connectivity for industrial peripherals.
Empfohlen
Automotive Electronics
The A3P1000-2FGG144I is suitable for automotive applications such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). Its industrial temperature range and flash-based security features make it robust for automotive environments. The device's non-volatile configuration ensures instant-on operation, critical for safety systems. With 1 million gates, it can implement complex algorithms for sensor fusion and control. The 97 I/Os allow interfacing with CAN, LIN, and FlexRay transceivers. The 1.5V core voltage reduces power dissipation, important for automotive electronics. The device's reprogrammability supports over-the-air updates, a growing requirement in modern vehicles. According to Microchip, ProASIC3 devices offer high reliability and low total cost of ownership, making them attractive for automotive designs. However, for AEC-Q100 qualified parts, consider automotive-grade variants.
Empfohlen
Communications Infrastructure
The A3P1000-2FGG144I is well-suited for communications infrastructure including network routers, switches, and base stations. Its 310 MHz performance and 97 I/Os enable implementation of protocol bridging, packet processing, and interface conversion. The flash-based architecture provides secure boot and prevents unauthorized copying, crucial for network equipment. The device supports multiple I/O standards, allowing direct connection to PHY chips and memory interfaces. The 1.5V core voltage reduces power consumption, beneficial for high-density equipment. The 4 I/O banks enable mixed-voltage designs, simplifying board layout. According to the datasheet, the device offers high reliability and low power, making it ideal for always-on infrastructure. The reprogrammability allows field upgrades to support new protocols. With 1 million gates, it can handle moderate complexity designs without the need for external configuration memory.
Empfohlen
Consumer Electronics
The A3P1000-2FGG144I is used in consumer electronics such as smart home devices, gaming peripherals, and multimedia systems. Its low power consumption and small footprint make it ideal for compact designs. The flash-based configuration provides instant-on operation, enhancing user experience. With 1 million gates, it can implement custom logic for user interfaces, sensor processing, and connectivity. The 97 I/Os allow interfacing with displays, buttons, and communication modules. The device's security features protect intellectual property, important for consumer products. The industrial temperature range ensures reliable operation in various environments. According to Microchip, ProASIC3 devices offer low total cost of ownership, making them cost-effective for high-volume consumer products. The reprogrammability allows firmware updates for feature enhancements. The 1.5V core voltage is compatible with battery-powered designs.
Empfohlen
Aerospace and Defense
The A3P1000-2FGG144I is suitable for aerospace and defense applications such as avionics, satellite systems, and secure communications. Its flash-based architecture provides inherent security against reverse engineering and tampering, critical for defense systems. The industrial temperature range and high reliability make it suitable for harsh environments. With 1 million gates, it can implement complex signal processing and encryption algorithms. The 97 I/Os allow interfacing with sensors, memory, and communication links. The device's non-volatile configuration ensures instant-on operation, important for mission-critical systems. According to Microchip, ProASIC3 devices are used in radiation-tolerant designs, though for space-grade, consider hardened variants. The 1.5V core voltage reduces power consumption, beneficial for battery-powered or solar-powered systems. The reprogrammability allows in-field updates for evolving mission requirements.
Empfohlen
Medical Electronics
The A3P1000-2FGG144I is used in medical electronics such as patient monitoring systems, diagnostic equipment, and portable medical devices. Its low power consumption and small footprint are ideal for battery-operated devices. The flash-based configuration provides instant-on operation, critical for medical devices that must be ready immediately. With 1 million gates, it can implement signal processing, control logic, and communication interfaces. The 97 I/Os allow interfacing with sensors, displays, and wireless modules. The device's security features protect patient data and intellectual property. The industrial temperature range ensures reliable operation in clinical environments. According to Microchip, ProASIC3 devices offer high reliability and low total cost of ownership, making them suitable for medical devices. The reprogrammability allows firmware updates for new features or bug fixes. The 1.5V core voltage is compatible with low-power designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P1000-2FGG144I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P1000-1FGG144T | A3P1000-FG144I | A3P1000-2FG144YI | A3P1000-FGG144I | A3P1000-1FGG144I |
|---|---|---|---|---|---|---|
| Package | 144-pin FBGA (FGG144) | 144-pin FBGA (FGG144) - same | 144-pin FBGA (FG144) - same | 144-pin FBGA (FG144) - same | 144-pin FBGA (FGG144) - same | 144-pin FBGA (FGG144) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -2 (310 MHz) | -1 (lower) | Standard (no -2) | -2 (310 MHz) | Standard (no -2) | -1 (lower) |
| Temperature Grade | I (Industrial -40°C to +100°C) | T (Commercial 0°C to +70°C) | I (Industrial) | YI (Extended Industrial?) | I (Industrial) | I (Industrial) |
| Lead-Free (RoHS) | Yes (FGG) | Yes (FGG) | No (FG) | No (FG) | Yes (FGG) | Yes (FGG) |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
Wichtigste Unterscheidungsmerkmale
- Higher speed grade (-2) for 310 MHz performance (vs. A3P1000-1FGG144T)
- Industrial temperature grade (-40°C to +100°C) (vs. A3P1000-1FGG144T)
- Lead-free (RoHS compliant) packaging (vs. A3P1000-FG144I)
Designhinweise
The A3P1000-2FGG144I requires a 1.5V core supply and separate I/O bank supplies (VCCIB0-3) that can be 1.5V, 1.8V, 2.5V, or 3.3V depending on the I/O standard. Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and VCCIB pin. Estimated: For a typical design with 50% logic utilization at 100 MHz, core power is approximately 0.3W. Ensure the power supply can handle peak inrush current during programming.
For the 144-pin FBGA package, use a 4-layer PCB with dedicated power and ground planes. Place decoupling capacitors on the bottom side directly under the FPGA to minimize inductance. Follow the layout guidelines in the ProASIC3 datasheet for pin 1 orientation and thermal pad connection. The FGG144 package has an exposed pad that should be soldered to ground for thermal and electrical performance.
Ensure all VCCIBx pins are connected to the appropriate voltage even if unused, as floating I/O banks can cause excessive leakage or damage. Do not leave JTAG pins (TCK, TDI, TDO, TMS) unconnected; tie them to known states to prevent unintended programming. Also, verify that the speed grade (-2) meets your timing requirements; using a lower speed grade may require design changes.
Compliance-Informationen
RoHS compliant per FGG package designation. Not AEC-Q100 qualified. Lead-free finish indicated by 'G' in package code.
