A3P250L-VQ100I - 250K-Gate Low-Power FPGA, 68 I/O | Microsemi
Teilenummer: A3P250L-VQ100I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $26.1 | $261,00 |
| 100 | $23.75 | $2.375,00 |
| 500 | $21.9 | $10.950,00 |
| 1.000 | $19.8 | $19.800,00 |
A3P250L-VQ100I Übersicht
An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device that implements digital logic through configurable logic blocks, routing fabric, and I/O cells. Within the programmable logic hierarchy, the ProASIC3L family sits in the low-density, low-power class of flash-based FPGAs, distinct from SRAM-based FPGAs because configuration is stored in on-chip flash cells rather than external boot memory.
Key features include nonvolatile flash programming (single-chip solution, no external configuration PROM), Flash*Freeze technology that cuts static power dramatically while retaining SRAM state and instant wake-up, and secure FPGA bitstream storage. The L suffix denotes the low-power 1.2V-core variant of the ProASIC3 architecture on a 130nm flash process, reducing static and dynamic power versus the standard A3P250.
The ProASIC3L fabric combines VersaTiles (fine-grained logic tiles), embedded 4,608-bit Block RAM modules, and I/O banks supporting multiple voltage standards. Timing closure is simplified by a deterministic flash-based routing architecture, and the fabric supports clocks into the hundreds of megahertz range per family characterization.
Typical applications include industrial control and automation, portable and battery-powered instruments, secure embedded controllers, bridge logic and glue logic consolidation, and space- or power-constrained systems where instant-on operation and configuration security matter.
A key design consideration is I/O banking: assign I/O standards per bank to avoid voltage conflicts, and budget the 1.2V core rail and auxiliary 2.5V/3.3V supplies separately. Flash*Freeze mode requires attention to I/O state retention rules in the datasheet.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3P250L-VQ100I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P250L-VQ100I (gleiche Bauform und Footprint) – abweichend in Package, System Gates, Operating Temperature, Technology, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P250L-VQG100I
✅ Drop-In✓ Auf Lager
$33.9 / Stück
Datenblatt ansehen →A3P250L-1VQG100I
✅ Drop-In✓ Auf Lager
$7.5 / Stück
Datenblatt ansehen →A3P250-VQ100I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
AGL250V2-VQ100I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
AGLN250V2-VQ100I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3P250-2VQG100
✅ Drop-In✓ Auf Lager
$17.5 / Stück
Datenblatt ansehen →A3P250L-VQ100I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3L |
| System Gates | 250,000 gates |
| Technology | 130nm flash process |
| Total RAM Bits | 36,864 bits |
| User I/O | 68 |
| Core Supply Voltage | 1.14 V to 1.575 V (1.2 V nominal) |
| Junction Temperature Range | -40C to +100C |
| Gehäuse | 100-TQFP (VQFP), 0.5 mm pitch |
| Montageart | Surface Mount |
| Configuration Memory | Nonvolatile on-chip flash (single chip) |
| Low-Power Feature | Flash*Freeze technology |
| Programming | In-system programmable flash |
| Grade | Industrial (I suffix) |
A3P250L-VQ100I 100-tqfp (vqfp), 0.5 mm pitch Pinbelegungsleitfaden
Pinbelegung für A3P250L-VQ100I (100-tqfp (vqfp), 0.5 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3P250L-VQ100I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3P250L-VQ100I ist geeignet für 6 Anwendungs: Industrial Control and Automation, Battery-Powered Portable Instruments, Secure Embedded Controllers, Bridge Logic and Glue Logic Consolidation, Aerospace-Adjacent Power-Constrained Data Paths, IoT Edge Sensor Aggregation.
Industrial Control and Automation
The A3P250L-VQ100I fits industrial controllers because it combines instant-on nonvolatile flash configuration with 68 user I/O, letting a single chip replace glue logic, I/O expansion, and sequencing circuits on a PLC or motor-control board. Its industrial -40C to +100C junction rating matches factory-floor ambient extremes, and the 1.14V to 1.575V core rail integrates cleanly with standard 1.2V/3.3V supply trees. In a typical control board, the FPGA sits between a microcontroller and field I/O, handling PWM generation, quadrature decoding, and safety interlock logic in the fabric for deterministic microsecond-level response that software loops cannot match. Because the bitstream is stored on-chip, boards power up functional in milliseconds with no external configuration device to fail or be corrupted in electrically noisy environments.
Empfohlen
Battery-Powered Portable Instruments
Battery-operated field instruments benefit directly from the L variant's 1.2V core and Flash*Freeze technology, which drops static power drastically while retaining SRAM state and waking within microseconds on an external trigger. The A3P250L-VQ100I can hold sensor-acquisition logic in active mode only during measurement bursts, then enter Flash*Freeze between readings, extending battery life versus always-on SRAM FPGAs that burn static current continuously. Its single-chip flash architecture also removes the boot current and board area of a configuration SPI flash. With 68 I/O, the device can interface displays, keypads, and multiple sensor buses (SPI, I2C-style interfaces implemented in fabric). The 100-TQFP's 0.5mm pitch keeps assembly on standard SMT lines, and the industrial temperature rating covers outdoor handheld use.
Empfohlen
Secure Embedded Controllers
Flash-based ProASIC3L devices store configuration in nonvolatile on-chip flash cells, which are inherently harder to read back than SRAM configuration bitstreams, making the A3P250L-VQ100I attractive for secure embedded controllers in access-control, metering, and cryptographic front-end roles. The fabric implements encryption blocks, key storage logic, and board-level tamper-response sequencing, while 36,864 RAM bits hold working keys and session state. The single-chip design eliminates the external configuration flash that is a common read-out attack surface in SRAM FPGA systems. Designers should still apply Microchip's security application notes for flash FPGA design protection features, and combine the fabric security with proper power-glitch and clock-glitch countermeasures at the board level for defense-in-depth.
Empfohlen
Bridge Logic and Glue Logic Consolidation
The A3P250L-VQ100I excels at consolidating discrete glue logic - bus bridges, level-tolerant interface translation, wait-state generators, and legacy ASIC emulation - into one reprogrammable 100-TQFP device. Its 250K gates comfortably absorb dozens of 74-series functions, and the fine-grained VersaTile fabric maps small random logic efficiently. Because the design can be updated in-system over JTAG through the flash programming interface, ECOs and interface changes do not require board respins, cutting revision cost dramatically versus fixed-function ASSPs. The 68 user I/O with multiple banking voltage standards lets one chip bridge a 3.3V microprocessor bus to 2.5V or lower-voltage peripheral banks. Designers should group I/O standards per bank in Libero to respect bank voltage rules and avoid contention during power-up.
Empfohlen
Aerospace-Adjacent Power-Constrained Data Paths
While the commercial I-grade A3P250L-VQ100I is not a flight-qualified part, its ProASIC3L architecture is the same fabric family used in high-reliability programs, and the flash cell is inherently tolerant of configuration upsets that plague SRAM FPGAs under radiation. Engineers prototyping low-power sensor front ends, telemetry formatters, and reconfigurable data path blocks benefit from the deterministic flash routing and 1.2V core power profile. The 36,864-bit Block RAM supports FIFOs and line buffers for serial telemetry streams, and fabric-implemented UARTs, SPI, and custom serial protocols adapt as mission requirements evolve. For flight use, migrate to the appropriate qualified orderable within the Microchip space portfolio; the VQ100 prototype footprint can be carried into board families using the same fabric HDL.
Empfohlen
IoT Edge Sensor Aggregation
In IoT edge nodes, the A3P250L-VQ100I aggregates multiple sensor interfaces into one programmable fabric block that preprocesses data before handing it to a low-power MCU or radio. Its low static power and Flash*Freeze mode suit duty-cycled nodes that wake on event triggers, sample sensors through fabric-implemented SPI/I2C-style masters, apply thresholding or filtering in the 250K-gate fabric, and return to sleep. The nonvolatile configuration means field-deployed nodes resume operation immediately after brownouts or battery swaps without reprogramming, an important availability feature for unattended deployments. The industrial temperature range and standard 0.5mm-pitch TQFP assembly simplify deployment in outdoor enclosures. Designers must budget the 1.14V to 1.575V core rail from the node's buck converter with adequate decoupling.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P250L-VQ100I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P250L-VQG100I | A3P250L-1VQG100I | A3P250-VQ100I | AGL250V2-VQ100I | AGLN250V2-VQ100I | A3P250-2VQG100 |
|---|---|---|---|---|---|---|---|
| Package | 100-TQFP (VQFP), 0.5 mm | 100-TQFP (VQFP), 0.5 mm - same | 100-TQFP (VQFP), 0.5 mm - same | 100-TQFP (VQFP), 0.5 mm - same | 100-TQFP (VQFP), 0.5 mm - same | 100-TQFP (VQFP), 0.5 mm - same | 100-TQFP (VQFP), 0.5 mm - same |
| Brand | Microsemi (Microchip Technology) | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 class | 250,000 class | 250,000 |
| Total RAM Bits | 36,864 | 36,864 | 36,864 | 36,864 | 36,864 | 36,864 | 36,864 |
| User I/O | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| Core Voltage | 1.14 V to 1.575 V (1.2 V nominal, L variant) | 1.14 V to 1.575 V | 1.14 V to 1.575 V | Standard ProASIC3 core (higher, non-L) | IGLOO low-power core rail | IGLOO nano low-power core rail | Standard ProASIC3 core (higher, non-L) |
| Speed Grade | Base (unmarked) | Base (unmarked) | -1 (slower) | Base (unmarked) | V2 (IGLOO grade) | V2 (IGLOO nano grade) | -2 (faster) |
| Low-Power Feature | Flash*Freeze (ProASIC3L) | Flash*Freeze (same) | Flash*Freeze (same) | Not available (standard family) | Flash*Freeze (IGLOO, lower static) | Flash*Freeze (IGLOO nano, lowest static) | Not available (standard family) |
Wichtigste Unterscheidungsmerkmale
- 1.2V low-power core in L variant (vs. A3P250-VQ100I)
- Flash*Freeze state-retentive sleep (vs. AGLN250V2-VQ100I)
- Single-chip nonvolatile configuration (vs. SRAM-based low-density FPGAs)
- Speed-grade headroom available in same footprint (vs. A3P250-2VQG100)
Designhinweise
Supply the A3P250L-VQ100I core from a regulated 1.2V rail (allowed range 1.14V to 1.575V) with at least 10uF bulk plus 0.1uF/0.01uF ceramic decoupling at each VCC pin pair, per Microsemi power-guidance for ProASIC3L. I/O banks require their own clean VCCI rails matching the chosen I/O standards. Estimated: static core current in Flash*Freeze is orders of magnitude below active mode, so a small LDO suffices for sleep but size the DC-DC for active toggle-dependent dynamic current per Libero SmartPower estimates.
The 100-TQFP with 0.5mm lead pitch requires careful fanout: use 0.2mm via-in-free-pad or dog-bone escapes on outer rows, and keep the center paddle-free footprint per the Microsemi package drawing. Place JTAG header, programming resistors, and the 1.2V/2.5V test points on the first revision to enable in-system flash programming. Route I/O banks so that all pins sharing a bank use the same VCCI standard - mixing standards in one bank is the most common PCB respin cause on VQFP FPGAs.
Do not treat the L part like the standard A3P250: core rails differ and swapping the A3P250-VQ100I onto an L-designed board over-voltages the core. Verify Flash*Freeze entry/exit handshake timing in simulation - I/O states are retained but wake-up latency and pin behavior during transition must follow the ProASIC3L datasheet. Finally, confirm speed-grade ordering codes (base vs -1/-2) before release; timing reports from Libero are only valid for the ordered grade.
Compliance-Informationen
RoHS/lead-free status not stated in the verified web data for this exact ordering code. Confirm on the Microchip product page certificate of conformance; VQG-suffix parts are typically green/lead-free packages.
