A3PE1500-FG676I - ProASIC3E FPGA, 1.5M Gates | Microchip
Teilenummer: A3PE1500-FG676I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $89.5 | $89,50 |
| 10 | $82.3 | $823,00 |
| 100 | $74.1 | $7.410,00 |
| 500 | $66.8 | $33.400,00 |
| 1.000 | $60.2 | $60.200,00 |
A3PE1500-FG676I Übersicht
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing, allowing for custom digital logic designs. FPGAs are part of the programmable logic family, which also includes CPLDs, and are used in a wide range of applications from prototyping to production. The ProASIC3E family is unique in that it uses flash-based configuration, meaning the device retains its programming even when power is removed, eliminating the need for external configuration memory.
Key features of the A3PE1500-FG676I include 276,480 bits of embedded RAM, 444 user I/Os, and support for multiple I/O standards including LVCMOS, LVTTL, PCI, and LVDS. The device also offers security features such as AES-128 bitstream encryption and a flash lock mechanism to protect the design. The -I suffix indicates an industrial temperature range of -40°C to +100°C, making it suitable for harsh environments.
The ProASIC3E architecture uses a flash-based switch matrix that provides instant-on capability and low power consumption. The device includes PLLs for clock management, with up to 6 PLLs available, and supports various configuration modes. The 676-ball FBGA package measures 27mm x 27mm with a 1mm ball pitch, providing a compact solution for high-density designs.
Typical applications include industrial automation, automotive electronics, communications infrastructure, and military/aerospace systems. The flash-based nature of the device makes it ideal for applications requiring secure, non-volatile configuration and fast power-up times.
When designing with this FPGA, consider the power supply requirements: the core operates at 1.5V, and I/O banks can be configured for various voltages. Proper decoupling and PCB layout are essential for reliable operation at high speeds.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3PE1500-FG676I.
Drop-in-Alternativen für A3PE1500-FG676I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE1500-FG676I (gleiche Bauform und Footprint) – abweichend in Core Supply Voltage, System Gates, Configuration, Package, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE1500-FGG676I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3PE1500-FG676
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3PE1500-1FG676I
✅ Drop-In✓ Auf Lager
$65.89 / Stück
Datenblatt ansehen →A3PE1500-1FGG676I
✅ Drop-In✓ Auf Lager
$59.6 / Stück
Datenblatt ansehen →A3PE3000-FG676
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3PE1500-FG676I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3E |
| System Gates | 1,500,000 |
| Logic Cells | 38,400 |
| User I/Os | 444 |
| Embedded RAM | 276,480 bits |
| Maximum Internal Frequency | 350 MHz |
| Core Supply Voltage | 1.5 V |
| I/O Standards | LVCMOS, LVTTL, PCI, LVDS |
| Number of PLLs | 6 |
| Gehäuse | 676-FBGA (27x27 mm, 1 mm pitch) |
| Betriebstemperaturbereich | -40°C to +100°C (industrial) |
| Configuration | Flash-based, non-volatile |
| Security | AES-128 bitstream encryption, flash lock |
| RoHS | Compliant (G suffix indicates RoHS) |
| Montageart | Surface Mount |
A3PE1500-FG676I 676-fbga (27x27 mm, 1 mm pitch) Pinbelegungsleitfaden
Pinbelegung für A3PE1500-FG676I (676-fbga (27x27 mm, 1 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE1500-FG676I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE1500-FG676I ist geeignet für 6 Anwendungs: Industrial Automation, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Medical Electronics, IoT and Edge Computing.
Industrial Automation
The A3PE1500-FG676I is ideal for industrial automation due to its industrial temperature range (-40°C to +100°C) and flash-based non-volatile configuration, which ensures instant-on operation and secure design protection. With 444 user I/Os and support for LVCMOS, LVTTL, and LVDS, it can interface with a wide range of sensors, actuators, and communication interfaces. The 1.5V core supply and low power consumption make it suitable for power-constrained industrial controllers. Its 1.5 million gates provide ample logic for implementing motor control algorithms, protocol bridging, and real-time processing. The device's security features, including AES-128 encryption, protect intellectual property in competitive industrial environments. For high-reliability applications, the flash-based architecture eliminates the need for external configuration memory, reducing system complexity and improving mean time between failures.
Empfohlen
Automotive Electronics
The A3PE1500-FG676I is well-suited for automotive electronics, including advanced driver-assistance systems (ADAS), infotainment, and body control modules. Its industrial temperature range of -40°C to +100°C meets the thermal requirements of under-hood and in-cabin environments. The flash-based configuration provides instant-on capability, which is critical for safety systems that must initialize quickly. With 444 user I/Os, the device can interface with multiple sensors, cameras, and communication buses such as CAN and LIN. The 1.5V core supply and low power consumption help meet automotive power budgets. The device's security features, including AES-128 bitstream encryption, protect against unauthorized access and tampering. The ProASIC3E family is known for high reliability, making it suitable for long-life automotive applications. For designs requiring AEC-Q100 qualification, Microchip offers automotive-grade variants, but the -I version is often used in pre-production and prototyping.
Empfohlen
Communications Infrastructure
The A3PE1500-FG676I is used in communications infrastructure such as base stations, routers, and switches. Its 1.5 million gates and 444 user I/Os provide ample resources for implementing protocol processing, packet buffering, and interface bridging. The device supports high-speed I/O standards including LVDS, which is essential for high-throughput data links. The 6 PLLs enable flexible clock generation and jitter reduction, critical for synchronous communication systems. The flash-based architecture offers secure, non-volatile configuration, ensuring reliable operation in remote or unattended sites. The industrial temperature range allows deployment in outdoor enclosures. With 276,480 bits of embedded RAM, the device can handle moderate buffering and FIFO implementations. The low power consumption of the ProASIC3E family reduces cooling requirements in dense equipment racks. For higher-speed applications, the -1 speed grade variant (A3PE1500-1FG676I) provides 15% faster performance.
Empfohlen
Aerospace and Defense
The A3PE1500-FG676I is suitable for aerospace and defense applications due to its flash-based non-volatile configuration, which provides secure and reliable operation in harsh environments. The industrial temperature range of -40°C to +100°C meets the requirements of many military and aerospace systems. The device's security features, including AES-128 bitstream encryption and flash lock, protect sensitive designs from reverse engineering. With 1.5 million gates and 444 user I/Os, it can implement complex signal processing, telemetry, and control functions. The low power consumption is beneficial for battery-powered or power-limited platforms such as UAVs and satellites. The ProASIC3E family is known for its high reliability and radiation tolerance, making it a preferred choice for space applications. The 676-FBGA package provides a compact footprint for space-constrained avionics. For designs requiring extended temperature ranges, Microchip offers military-grade variants.
Empfohlen
Medical Electronics
The A3PE1500-FG676I is used in medical electronics such as patient monitoring systems, imaging equipment, and diagnostic devices. Its flash-based configuration ensures secure and reliable operation, which is critical for medical devices that must meet strict regulatory standards. The industrial temperature range allows operation in various clinical environments. With 444 user I/Os, the device can interface with sensors, displays, and communication interfaces. The 1.5V core supply and low power consumption are beneficial for portable and battery-powered medical devices. The device's security features protect patient data and device firmware from unauthorized access. The ProASIC3E family's high reliability and long-term availability make it suitable for medical devices with long lifecycles. The 276,480 bits of embedded RAM can be used for data buffering and image processing. For designs requiring mixed-signal integration, Microchip's Fusion FPGAs offer analog capabilities.
Empfohlen
IoT and Edge Computing
The A3PE1500-FG676I is suitable for IoT and edge computing applications that require secure, low-power, and reliable processing. Its flash-based configuration provides instant-on operation and secure boot, which is essential for edge devices that may be deployed in unattended locations. The 1.5V core supply and low power consumption enable battery-powered operation. With 444 user I/Os, the device can interface with a wide range of sensors and communication modules, including Ethernet, Wi-Fi, and LoRa. The 1.5 million gates provide ample logic for implementing edge analytics, protocol conversion, and data preprocessing. The device's security features, including AES-128 encryption, protect data and firmware from cyber threats. The industrial temperature range allows deployment in outdoor or harsh environments. The ProASIC3E family's long-term availability and reliability make it a good choice for IoT products with extended lifecycles.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE1500-FG676I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE1500-FGG676I | A3PE1500-FG676 | A3PE1500-1FG676I | A3PE1500-1FGG676I | A3PE3000-FG676 |
|---|---|---|---|---|---|---|
| Package | 676-FBGA | 676-FBGA | 676-FBGA | 676-FBGA | 676-FBGA | 676-FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 3,000,000 |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 75,264 |
| User I/Os | 444 | 444 | 444 | 444 | 444 | 444 |
| Embedded RAM | 276,480 bits | 276,480 bits | 276,480 bits | 276,480 bits | 276,480 bits | 516,096 bits |
| Speed Grade | Standard | Standard | Standard | 15% faster | 15% faster | Standard |
| Temperature Range | -40°C to +100°C | -40°C to +100°C | 0°C to +70°C | -40°C to +100°C | -40°C to +100°C | 0°C to +70°C |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature range (vs. A3PE1500-FG676)
- RoHS compliance (vs. A3PE1500-FG676I (non-G))
- Standard speed grade (vs. A3PE1500-1FG676I)
Designhinweise
The A3PE1500-FG676I requires a 1.5V core supply and separate I/O supply voltages depending on the I/O standards used. Ensure adequate decoupling capacitors (e.g., 0.1uF and 10uF) are placed close to each power pin. The flash-based architecture has low static power, but dynamic power scales with switching activity. Use the Microchip power calculator to estimate power consumption for your design. Estimated: For a typical design with 50% toggle rate, power dissipation may be around 1-2W, requiring proper thermal management.
The 676-FBGA package has a 27x27 mm body with 1 mm ball pitch. Use a high-quality PCB with controlled impedance for high-speed I/O signals. Ensure the PCB layout follows the manufacturer's recommendations for power and ground planes. Place decoupling capacitors as close to the FPGA power pins as possible. For LVDS signals, maintain differential pair routing with proper impedance matching. Refer to the Microchip ProASIC3E layout guidelines for detailed recommendations.
One common pitfall is forgetting to connect all power and ground pins. The A3PE1500-FG676I has multiple VCC and GND pins that must all be connected. Another pitfall is incorrect configuration of I/O standards, which can cause signal integrity issues. Ensure that voltage-referenced I/O standards have a VREF pin assigned per minibank. Also, be aware that the -F speed grade is only supported in the commercial temperature range, so do not use it for industrial designs. Always verify the part number suffix for temperature range and RoHS compliance.
Compliance-Informationen
RoHS compliance indicated by 'G' in part number. AEC-Q100 qualification not specified for this variant.
