A3PE1500-FG676I - ProASIC3E FPGA, 1.5M Gates | Microchip
MPN: A3PE1500-FG676I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.3 | $823.00 |
| 100 | $74.1 | $7,410.00 |
| 500 | $66.8 | $33,400.00 |
| 1,000 | $60.2 | $60,200.00 |
Drop-in alternatives for A3PE1500-FG676I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE1500-FGG676I
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE1500-FG676
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE1500-1FG676I
✅ Drop-In✓ In Stock
$65.89 / Unit
View Datasheet →A3PE1500-1FGG676I
✅ Drop-In✓ In Stock
$59.6 / Unit
View Datasheet →A3PE3000-FG676
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE1500-FG676I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E |
| System Gates | 1,500,000 |
| Logic Cells | 38,400 |
| User I/Os | 444 |
| Embedded RAM | 276,480 bits |
| Maximum Internal Frequency | 350 MHz |
| Core Supply Voltage | 1.5 V |
| I/O Standards | LVCMOS, LVTTL, PCI, LVDS |
| Number of PLLs | 6 |
| Package | 676-FBGA (27x27 mm, 1 mm pitch) |
| Operating Temperature Range | -40°C to +100°C (industrial) |
| Configuration | Flash-based, non-volatile |
| Security | AES-128 bitstream encryption, flash lock |
| RoHS | Compliant (G suffix indicates RoHS) |
| Mounting Type | Surface Mount |
A3PE1500-FG676I 676-fbga (27x27 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for A3PE1500-FG676I (676-fbga (27x27 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE1500-FG676I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE1500-FG676I is suitable for 6 applications: Industrial Automation, Automotive Electronics, Communications Infrastructure, Aerospace and Defense, Medical Electronics, IoT and Edge Computing.
Industrial Automation
The A3PE1500-FG676I is ideal for industrial automation due to its industrial temperature range (-40°C to +100°C) and flash-based non-volatile configuration, which ensures instant-on operation and secure design protection. With 444 user I/Os and support for LVCMOS, LVTTL, and LVDS, it can interface with a wide range of sensors, actuators, and communication interfaces. The 1.5V core supply and low power consumption make it suitable for power-constrained industrial controllers. Its 1.5 million gates provide ample logic for implementing motor control algorithms, protocol bridging, and real-time processing. The device's security features, including AES-128 encryption, protect intellectual property in competitive industrial environments. For high-reliability applications, the flash-based architecture eliminates the need for external configuration memory, reducing system complexity and improving mean time between failures.
Recommended
Automotive Electronics
The A3PE1500-FG676I is well-suited for automotive electronics, including advanced driver-assistance systems (ADAS), infotainment, and body control modules. Its industrial temperature range of -40°C to +100°C meets the thermal requirements of under-hood and in-cabin environments. The flash-based configuration provides instant-on capability, which is critical for safety systems that must initialize quickly. With 444 user I/Os, the device can interface with multiple sensors, cameras, and communication buses such as CAN and LIN. The 1.5V core supply and low power consumption help meet automotive power budgets. The device's security features, including AES-128 bitstream encryption, protect against unauthorized access and tampering. The ProASIC3E family is known for high reliability, making it suitable for long-life automotive applications. For designs requiring AEC-Q100 qualification, Microchip offers automotive-grade variants, but the -I version is often used in pre-production and prototyping.
Recommended
Communications Infrastructure
The A3PE1500-FG676I is used in communications infrastructure such as base stations, routers, and switches. Its 1.5 million gates and 444 user I/Os provide ample resources for implementing protocol processing, packet buffering, and interface bridging. The device supports high-speed I/O standards including LVDS, which is essential for high-throughput data links. The 6 PLLs enable flexible clock generation and jitter reduction, critical for synchronous communication systems. The flash-based architecture offers secure, non-volatile configuration, ensuring reliable operation in remote or unattended sites. The industrial temperature range allows deployment in outdoor enclosures. With 276,480 bits of embedded RAM, the device can handle moderate buffering and FIFO implementations. The low power consumption of the ProASIC3E family reduces cooling requirements in dense equipment racks. For higher-speed applications, the -1 speed grade variant (A3PE1500-1FG676I) provides 15% faster performance.
Recommended
Aerospace and Defense
The A3PE1500-FG676I is suitable for aerospace and defense applications due to its flash-based non-volatile configuration, which provides secure and reliable operation in harsh environments. The industrial temperature range of -40°C to +100°C meets the requirements of many military and aerospace systems. The device's security features, including AES-128 bitstream encryption and flash lock, protect sensitive designs from reverse engineering. With 1.5 million gates and 444 user I/Os, it can implement complex signal processing, telemetry, and control functions. The low power consumption is beneficial for battery-powered or power-limited platforms such as UAVs and satellites. The ProASIC3E family is known for its high reliability and radiation tolerance, making it a preferred choice for space applications. The 676-FBGA package provides a compact footprint for space-constrained avionics. For designs requiring extended temperature ranges, Microchip offers military-grade variants.
Recommended
Medical Electronics
The A3PE1500-FG676I is used in medical electronics such as patient monitoring systems, imaging equipment, and diagnostic devices. Its flash-based configuration ensures secure and reliable operation, which is critical for medical devices that must meet strict regulatory standards. The industrial temperature range allows operation in various clinical environments. With 444 user I/Os, the device can interface with sensors, displays, and communication interfaces. The 1.5V core supply and low power consumption are beneficial for portable and battery-powered medical devices. The device's security features protect patient data and device firmware from unauthorized access. The ProASIC3E family's high reliability and long-term availability make it suitable for medical devices with long lifecycles. The 276,480 bits of embedded RAM can be used for data buffering and image processing. For designs requiring mixed-signal integration, Microchip's Fusion FPGAs offer analog capabilities.
Recommended
IoT and Edge Computing
The A3PE1500-FG676I is suitable for IoT and edge computing applications that require secure, low-power, and reliable processing. Its flash-based configuration provides instant-on operation and secure boot, which is essential for edge devices that may be deployed in unattended locations. The 1.5V core supply and low power consumption enable battery-powered operation. With 444 user I/Os, the device can interface with a wide range of sensors and communication modules, including Ethernet, Wi-Fi, and LoRa. The 1.5 million gates provide ample logic for implementing edge analytics, protocol conversion, and data preprocessing. The device's security features, including AES-128 encryption, protect data and firmware from cyber threats. The industrial temperature range allows deployment in outdoor or harsh environments. The ProASIC3E family's long-term availability and reliability make it a good choice for IoT products with extended lifecycles.
Recommended
Recommended Products Summary
Engineering reference data for A3PE1500-FG676I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE1500-FGG676I | A3PE1500-FG676 | A3PE1500-1FG676I | A3PE1500-1FGG676I | A3PE3000-FG676 |
|---|---|---|---|---|---|---|
| Package | 676-FBGA | 676-FBGA | 676-FBGA | 676-FBGA | 676-FBGA | 676-FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 3,000,000 |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 75,264 |
| User I/Os | 444 | 444 | 444 | 444 | 444 | 444 |
| Embedded RAM | 276,480 bits | 276,480 bits | 276,480 bits | 276,480 bits | 276,480 bits | 516,096 bits |
| Speed Grade | Standard | Standard | Standard | 15% faster | 15% faster | Standard |
| Temperature Range | -40°C to +100°C | -40°C to +100°C | 0°C to +70°C | -40°C to +100°C | -40°C to +100°C | 0°C to +70°C |
Key Differentiators
- Industrial temperature range (vs A3PE1500-FG676)
- RoHS compliance (vs A3PE1500-FG676I (non-G))
- Standard speed grade (vs A3PE1500-1FG676I)
Design Notes
The A3PE1500-FG676I requires a 1.5V core supply and separate I/O supply voltages depending on the I/O standards used. Ensure adequate decoupling capacitors (e.g., 0.1uF and 10uF) are placed close to each power pin. The flash-based architecture has low static power, but dynamic power scales with switching activity. Use the Microchip power calculator to estimate power consumption for your design. Estimated: For a typical design with 50% toggle rate, power dissipation may be around 1-2W, requiring proper thermal management.
The 676-FBGA package has a 27x27 mm body with 1 mm ball pitch. Use a high-quality PCB with controlled impedance for high-speed I/O signals. Ensure the PCB layout follows the manufacturer's recommendations for power and ground planes. Place decoupling capacitors as close to the FPGA power pins as possible. For LVDS signals, maintain differential pair routing with proper impedance matching. Refer to the Microchip ProASIC3E layout guidelines for detailed recommendations.
One common pitfall is forgetting to connect all power and ground pins. The A3PE1500-FG676I has multiple VCC and GND pins that must all be connected. Another pitfall is incorrect configuration of I/O standards, which can cause signal integrity issues. Ensure that voltage-referenced I/O standards have a VREF pin assigned per minibank. Also, be aware that the -F speed grade is only supported in the commercial temperature range, so do not use it for industrial designs. Always verify the part number suffix for temperature range and RoHS compliance.
Compliance Information
RoHS compliance indicated by 'G' in part number. AEC-Q100 qualification not specified for this variant.
