A3PE1500-2FGG676I - ProASIC3E FPGA 1.5M Gates 444 I/O | Microchip
Teilenummer: A3PE1500-2FGG676I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
A3PE1500-2FGG676I Übersicht
A field-programmable gate array (FPGA) is a semiconductor device containing programmable logic blocks and interconnects that designers configure after manufacturing. Unlike SRAM-based FPGAs that require external configuration memory, the ProASIC3E family uses nonvolatile flash technology, storing the configuration on-chip. This places it in the hierarchy: FPGA -> programmable logic device -> digital IC -> semiconductor, and makes it a cost-effective ASIC replacement for consumer, networking, computing, and avionics markets.
Key differentiating features include single-chip operation (no external boot PROM, instant-on power-up), reprogrammable flash fabric that is inherently secure against design theft, abundant embedded memory (up to 276480 flash configuration bits per the device listing), optional soft ARM support, and low total cost of ownership per Microchip product literature. The -2 speed grade and dense 444-I/O count support wide parallel buses, memory interfaces, and glueless system integration.
Architecturally, the ProASIC3E fabric is built on 130nm CMOS flash technology with VersaTiles - fine-grained logic elements that implement both combinational and sequential functions. Advanced I/O structures support multiple voltage and interface standards, and embedded SRAM blocks plus PLLs provide system-level clock and data buffering without external components.
Typical applications include industrial automation controllers, communications and networking line cards, avionics and secure embedded systems, and ASIC prototyping or low-volume ASIC replacement where flash security and instant-on startup matter.
Design consideration: 676-ball FBGA packages require careful PCB planning - verify ball-map escape routing, 1.5V core rail integrity with solid power planes, and follow Microchip power-up sequencing guidance before committing the layout.
This page synthesizes verified distributor listings, cross-reference data, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für A3PE1500-2FGG676I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE1500-2FGG676I (gleiche Bauform und Footprint) – abweichend in Package, System Gates, Core Supply Voltage, Configuration, Operating Temperature Range.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE1500-1FG676I
✅ Drop-In✓ Auf Lager
$65.89 / Stück
Datenblatt ansehen →A3PE1500-FGG676I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3PE1500-FG676I
✅ Drop-In✓ Auf Lager
$60.2 / Stück
Datenblatt ansehen →M1A3PE1500-1FG676I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M1AFS1500-2FGG676I
✅ Drop-In✓ Auf Lager
$59.6 / Stück
Datenblatt ansehen →A3PE1500-2FG676I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3PE1500-2FGG676I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3E |
| System Gates | 1500000 |
| Logic Elements / CLBs | 38400 |
| User I/O | 444 |
| Configuration Bits | 276480 |
| Maximum Frequency | 310 MHz (per Kynix/FPGAkey listing) |
| Core Supply Voltage | 1.5 V |
| Technology | 130 nm CMOS flash |
| Speed Grade | -2 |
| Gehäuse | 676-BGA (FBGA, square, 1.0 mm ball pitch) |
| Terminal Form | Ball |
| Number of Terminals | 676 |
| Temperature Grade | Industrial (I) |
| Montageart | Surface Mount |
| Programming Technology | Flash (nonvolatile, single-chip) |
| Soft ARM Support | Optional (per ProASIC3E datasheet) |
A3PE1500-2FGG676I 676-bga (fbga, square, 1.0 mm ball pitch) Pinbelegungsleitfaden
Pinbelegung für A3PE1500-2FGG676I (676-bga (fbga, square, 1.0 mm ball pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE1500-2FGG676I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE1500-2FGG676I ist geeignet für 6 Anwendungs: Industrial Automation and Motor Control, Avionics and Secure Embedded Systems, Networking and Communications Line Cards, ASIC Prototyping and Low-Volume ASIC Replacement, Test and Measurement Instrumentation, Medical Device Control Logic.
Industrial Automation and Motor Control
The A3PE1500-2FGG676I fits industrial automation controllers where deterministic logic, wide parallel I/O, and instant-on startup are required. Its 1.5 million system gates and 444 user I/Os let a single device absorb encoder interfaces, PWM generators, and fieldbus glue logic that would otherwise need multiple ASSPs. The flash-based fabric powers up functional within microseconds, eliminating configuration-time delays in machines that must resume after a fault cycle. In a typical topology, the FPGA sits between an MCU or host CPU and the I/O field, with the 310 MHz speed grade providing headroom for concurrent state machines. Unlike SRAM FPGAs, no external configuration flash is exposed on the board, reducing BOM count and configuration corruption risk in electrically noisy factory environments.
Empfohlen
Avionics and Secure Embedded Systems
The A3PE1500-2FGG676I is well suited to avionics and secure embedded systems because flash-based configuration cells are inherently immune to the single-event upset mechanisms that affect SRAM configuration cells, and the on-chip flash storage prevents bitstream extraction at power-up. Microchip's ProASIC3E datasheet explicitly targets the avionics market, and the industrial temperature grade supports harsh-environment platforms. With 1.5M gates, 444 I/Os, and the -2 speed grade, the device implements interface bridges, bus controllers, and health-monitoring logic in a single 676-ball FBGA. Instant-on behavior matters in avionics power-up sequences where configuration time from an external PROM would delay system readiness. Design teams should validate program-specific screening and qualification flows independently of the standard datasheet.
Empfohlen
Networking and Communications Line Cards
Networking and communications equipment benefits from the A3PE1500-2FGG676I's combination of 444 user I/Os, 38400 logic cells, and abundant embedded memory structures, which suit line-card glue logic, backplane interface bridging, and control-plane interconnect. The -2 speed grade's 310 MHz capability supports timing-critical parallel interfaces, while the flash fabric eliminates the boot sequence that SRAM FPGAs require on carrier cards that must enumerate quickly. In a typical deployment the FPGA sits between a network processor or MAC and the backplane connector, mapping wide buses and handling handshaking. Because configuration is nonvolatile and secure, design IP on deployed telecom hardware is protected against cloning. The single-chip solution reduces total cost of ownership per Microchip's positioning for the networking/communications market.
Empfohlen
ASIC Prototyping and Low-Volume ASIC Replacement
The ProASIC3E family is positioned by Microchip as a cost-effective ASIC replacement solution, and the A3PE1500-2FGG676I is the 1.5M-gate point of that family. Design teams transitioning from a 130nm ASIC can map gate-netlist-style designs onto the VersaTile fabric, using the 444 I/Os to reproduce wide ASIC pin counts that smaller packages cannot accommodate. The flash programming technology allows unlimited reprogramming during prototyping without external programmers or JTAG-configured PROMs, shortening iteration cycles. For volumes too low to justify ASIC mask costs, the same PCB can ship with the FPGA in production. A design consideration is that timing closure in flash FPGAs differs from ASIC static timing; budgets must be re-validated in Microchip Libero SoC rather than carried over from the ASIC flow.
Empfohlen
Test and Measurement Instrumentation
Bench and automated test equipment uses the A3PE1500-2FGG676I as a flexible timing, trigger, and interface engine. The 1.5 million gates and -2 speed grade implement pattern generators, capture FIFOs, and protocol-aware comparators, while 444 I/Os connect to per-channel circuitry that fixed-function ASSPs cannot serve economically. Instant-on configuration means an instrument is ready the moment power is applied - important for rack systems that cycle power between test runs. The industrial temperature grade suits uncooled rack environments, and the single-chip flash configuration removes the reliability concern of configuration PROM reads at each boot. Engineers should allocate the embedded SRAM blocks for capture buffers and use the fabric PLLs for clock conditioning, following Microchip ProASIC3E datasheet guidance on I/O banking across mixed-voltage interfaces.
Empfohlen
Medical Device Control Logic
Medical diagnostic and monitoring equipment benefits from the A3PE1500-2FGG676I's combination of secure flash configuration, instant-on startup, and dense flexible I/O. Patient-interface boards often need dozens of sensor, actuator, and isolation-barrier signals; 444 user I/Os allow one 676-ball FBGA to terminate those connections while implementing sequencing interlocks and data framing in the 1.5M-gate fabric. The nonvolatile configuration prevents accidental alteration of safety-relevant logic between power cycles, and the absence of an external bitstream limits attack surface on connected devices. Typical topology places the FPGA between analog front ends and a host processor, handling timing-critical control locally. Development teams should plan for the verification documentation medical regulators expect, using Microchip Libero SoC timing and simulation reports as evidence artifacts.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE1500-2FGG676I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE1500-1FG676I | A3PE1500-FGG676I | M1A3PE1500-1FG676I | M1AFS1500-2FGG676I | A3PE1500-2FG676I |
|---|---|---|---|---|---|---|
| Package | 676-BGA (FBGA) | 676-FBGA - same footprint | 676-FBGA - same footprint | 676-FBGA - same footprint | 676-FBGA - same footprint | 676-FBGA - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5 M | 1.5 M | 1.5 M | 1.5 M | 1.5 M (Fusion) | 1.5 M |
| Speed Grade | -2 | -1 (slower) | Standard | -1 (slower) | -2 | -2 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V core (plus analog rails) | 1.5 V |
| Temperature Grade | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) |
| Configuration Technology | Flash (nonvolatile, single-chip) | Flash | Flash | Flash | Flash (Fusion, with analog) | Flash |
Wichtigste Unterscheidungsmerkmale
- Fastest stock speed grade in the A3PE1500 676-pin lineup (vs. A3PE1500-1FG676I)
- Secure single-chip flash configuration (vs. SRAM-based competitor FPGAs)
- Same-footprint growth path within Microchip portfolio (vs. M1AFS1500-2FGG676I)
Designhinweise
The ProASIC3E core operates from a 1.5 V rail; I/O banks use separate supply pins supporting multiple voltage standards. Provide a low-impedance 1.5 V plane with bulk capacitance near the package and 0.1 uF ceramic decoupling distributed across the 676-ball field. Estimated: even at modest core currents of a few hundred milliamps, IR drop across a poor plane can approach the 5% supply-tolerance budget, so verify with a power-integrity simulation before tape-out. Follow Microchip's ProASIC3E power-up sequencing and power calculation guidance in the datasheet.
A 676-ball FBGA at 1.0 mm ball pitch requires disciplined escape routing. Plan via-in-pad or dog-bone escapes, typically 4-6 signal layers minimum for a full fan-out of the interior ball rows. Assign power/ground ball pairs first, then group I/O by bank voltage before escape routing. Set the CAD ball map from the official Microchip ProASIC3E datasheet package chapter - third-party ball maps have been known to contain errors. Keep high-speed signals matched in length when they form parallel buses.
Do not assume bitstream portability across speed grades: while A3PE1500 -1 and -2 parts share the fabric, timing constraints must be re-verified with the -1 grade if you substitute A3PE1500-1FG676I. Also, the M1AFS1500-2FGG676I (Fusion) shares the 676 footprint but adds analog power pins and different supply requirements - swapping it into a ProASIC3E PCB without checking the power tree will cause misoperation. Confirm MSL handling and reflow profile for large FBGAs per JEDEC guidance before assembly.
Compliance-Informationen
Compliance status not stated in the verified web data retrieved as of 2026-09-02. Confirm on the official Microchip product page for A3PE1500 or via Microchip's environmental compliance documentation before export-controlled or automotive program use.
