A3PE3000-1FG484I - ProASIC3E Flash FPGA 3M Gates | Microchip
Teilenummer: A3PE3000-1FG484I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $175 | $175,00 |
| 10 | $162.5 | $1.625,00 |
| 100 | $148 | $14.800,00 |
| 500 | $136 | $68.000,00 |
| 1.000 | $125 | $125.000,00 |
A3PE3000-1FG484I Übersicht
An FPGA (field programmable gate array) is a semiconductor device that implements user-defined digital logic through configurable logic blocks, routing fabric, and I/O cells. Unlike SRAM-based FPGAs, flash-based FPGAs such as the ProASIC3E family retain their configuration in non-volatile on-chip flash, so the device is live at power-up (Level 0 support) and requires no external configuration PROM - a single-chip solution that reduces bill-of-materials cost and board area.
Key features include reprogrammable flash-based CMOS architecture built on a 130-nm, 7-layer metal (6 copper) process, 504 kbits of true dual-port SRAM for FIFOs and buffering, up to 616 user I/Os in the family, and optional soft ARM support, enabling embedded processor implementations within the fabric.
The -1 speed grade guarantees timing closure for designs up to 272 MHz, and the flash cells are inherently non-volatile and highly secure, making the device resistant to bitstream readback attacks. The 484-ball FBGA (1 mm pitch, 23 x 23 mm body) provides 341 available user I/Os with multiple I/O standards.
Typical applications include industrial automation and motor control, aerospace and defense systems requiring instant-on operation, communications and networking line cards, test and measurement instrumentation, and medical equipment where single-chip, secure configuration storage is valued.
Design consideration: use Libero SoC design suite for synthesis and place-and-route, and verify power budgeting for the 1.5V core rail, since flash-based fabric eliminates configuration current but static and dynamic current still scale with design toggle rates.
This page synthesizes distributor pricing, drop-in alternatives, comparison data, and practical design notes not found in the manufacturer datasheet, giving engineers a complete selection view in one place.
Drop-in-Alternativen für A3PE3000-1FG484I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE3000-1FG484I (gleiche Bauform und Footprint) – abweichend in Package, Family, Process Technology, System Gates, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE3000-1FGG484I
✅ Drop-In✓ Auf Lager
$1336.6 / Stück
Datenblatt ansehen →A3PE3000-2FGG484I
✅ Drop-In✓ Auf Lager
$89.4 / Stück
Datenblatt ansehen →A3PE3000-FG484I
✅ Drop-In✓ Auf Lager
$98.6 / Stück
Datenblatt ansehen →A3PE3000-1FGG484
✅ Drop-In✓ Auf Lager
$1425.71 / Stück
Datenblatt ansehen →A3PE3000L-1FG484I
✅ Drop-In✓ Auf Lager
$89.9 / Stück
Datenblatt ansehen →A3PE3000-1FG484I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3E Flash FPGA |
| System Gates | 3,000,000 |
| User I/Os | 341 |
| Embedded Memory | 516096 bits (504 kbits) true dual-port SRAM |
| Speed Grade | -1 |
| Maximum System Frequency | 272 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm, 7-layer metal (6 copper) flash-based CMOS |
| Configuration | Flash-based, non-volatile, live at power-up (Level 0) |
| Soft CPU Support | Optional soft ARM support |
| Gehäuse | 484-ball FBGA, 1 mm pitch |
| Montageart | Surface Mount |
| Packaging | Tray |
| Logic Family | CMOS |
| Temperature Grade Suffix | I (Industrial) |
A3PE3000-1FG484I 484-ball fbga, 1 mm pitch Pinbelegungsleitfaden
Pinbelegung für A3PE3000-1FG484I (484-ball fbga, 1 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE3000-1FG484I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE3000-1FG484I ist geeignet für 6 Anwendungs: Industrial Automation and Motor Control, Aerospace and Defense Subsystems, Communications and Networking Line Cards, Test and Measurement Instrumentation, Medical Equipment Control Logic, Secure Embedded Control and Bridge Logic.
Industrial Automation and Motor Control
Flash-based instant-on configuration makes the A3PE3000-1FG484I a strong fit for industrial automation controllers and multi-axis motor drive logic, where deterministic startup without a bootloader or external configuration device reduces boot time to milliseconds. The 3M-gate fabric integrates PWM generators, quadrature encoder interfaces, and safety interlock logic, while 504 kbits of true dual-port SRAM buffers motion profiles between a host CPU and drive stages. With 341 user I/Os at industrial temperature rating, the device handles dense sensor and actuator interfacing on a single chip. Placed as the main sequencer between a PLC processor and power stages, it adds no configuration boot latency but designers should budget the 1.5V core rail current against the design's toggle rate.
Empfohlen
Aerospace and Defense Subsystems
The A3PE3000-1FG484I suits aerospace and defense payloads because ProASIC3E flash cells are non-volatile and highly secure - there is no external bitstream readback or load phase to attack, and the device is live at power-up (Level 0), which matters for time-critical telemetry and flight-control interfaces. The 3M system gates implement protocol bridges, CRC/checksum engines, and reconfigurable interface logic, while industrial temperature grading and hermetic-friendly FBGA packaging support harsh-environment boards. In a typical architecture the FPGA sits between mission processors and sensor or bus interfaces, providing glue logic that can be reprogrammed in the field. The trade-off versus rad-tolerant families is radiation performance - designers must assess mission-level radiation requirements separately.
Empfohlen
Communications and Networking Line Cards
Line-card and backplane-interface designs benefit from the A3PE3000-1FG484I's combination of 272 MHz -1 speed grade timing, 504 kbits of true dual-port SRAM for FIFO and packet-buffer functions, and 341 flexible I/Os for multiple signaling standards on a single device. Flash configuration means a line card enumerates instantly after power good, simplifying hot-swap sequencing versus SRAM FPGAs that must load a bitstream. Typical usage places the device between MAC/PHY devices and a backplane interface, implementing rate adaptation, framing, and statistics counters in fabric. The true dual-port SRAM allows simultaneous ingress and egress buffering at independent clock domains. Designers should verify timing closure on the fastest interface paths at the -1 grade in Libero SoC before committing.
Empfohlen
Test and Measurement Instrumentation
Bench and modular instruments use the A3PE3000-1FG484I as a reconfigurable timing, trigger, and acquisition engine. The 3M-gate fabric implements time-stamping counters, trigger state machines, and data formatting, while 504 kbits of true dual-port SRAM capture waveform segments or hold calibration tables. The instant-on flash configuration ensures the instrument's acquisition hardware is ready as soon as power settles - an advantage in rack systems with strict boot-time specifications. With 341 user I/Os, one device can interface acquisition front ends, display logic, and host bus connections. Because instrument designs evolve through firmware updates, the flash-based reprogrammability allows in-field feature upgrades via Microchip's Libero toolchain without changing hardware.
Empfohlen
Medical Equipment Control Logic
Medical imaging and diagnostic platforms value the A3PE3000-1FG484I for its single-chip, secure, non-volatile configuration - flash cells eliminate the external bitstream path that can complicate design assurance documentation, and instant-on operation meets interlock and safety-logic requirements that must be active immediately at power-up. The 3M gates implement sensor timing, detector readout sequencing, and host interface bridging, with 504 kbits of dual-port SRAM handling sample buffers. Industrial-grade temperature rating provides margin for equipment with elevated internal ambient temperatures near power electronics. In a typical architecture the FPGA orchestrates detector timing while a host processor runs the application UI, communicating over standard bus interfaces implemented in fabric.
Empfohlen
Secure Embedded Control and Bridge Logic
Secure single-chip control and protocol-bridge designs are a natural fit for the A3PE3000-1FG484I because the flash fabric stores configuration internally with no bitstream download at boot, reducing attack surface compared to SRAM FPGAs that expose configuration data externally. The optional soft ARM support noted by Microchip allows an embedded processor core in fabric alongside custom security logic, enabling self-contained controllers. The 341 user I/Os span multiple standards, letting one device bridge legacy parallel buses to serial interfaces while enforcing protocol checks. The design trade-off: soft-core performance is modest at the 272 MHz fabric limit, so security-critical datapaths rather than high-throughput processing should dominate the utilization plan.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE3000-1FG484I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE3000-1FGG484I | A3PE3000-2FGG484I | A3PE3000-FG484I | A3PE3000-1FGG484 | A3PE3000L-1FG484I |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (FG484) | 484-ball FBGA (FGG484, green) - same footprint | 484-ball FBGA (FGG484, green) - same footprint | 484-ball FBGA (FG484) - same footprint | 484-ball FBGA (FGG484, green) - same footprint | 484-ball FBGA (FG484) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Speed Grade / Max Frequency | -1 / 272 MHz | -1 / 272 MHz | -2 / higher than -1 (faster) | standard / 231 MHz | -1 / 272 MHz | -1 (ProASIC3L) |
| User I/Os | 341 | 341 | 341 | 341 | 341 | 341 |
| Embedded SRAM | 504 kbits (516096 bits) | 504 kbits | 504 kbits | 504 kbits | 504 kbits | 504 kbits |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V (low-power core) |
| Temperature Grade | Industrial (I) | Industrial (I) | Industrial (I) | Industrial (I) | Commercial | Industrial (I) |
| Power Profile | Standard ProASIC3E | Standard ProASIC3E | Standard ProASIC3E (higher dynamic at speed) | Standard ProASIC3E | Standard ProASIC3E | Low-power ProASIC3L |
Wichtigste Unterscheidungsmerkmale
- Fastest standard speed grade in the 484-ball footprint (vs. A3PE3000-FG484I)
- Industrial temperature rating (vs. A3PE3000-1FGG484)
- Lower-power fabric option at identical footprint (vs. A3PE3000L-1FG484I)
Designhinweise
Budget the 1.5V core rail using Libero SoC SmartPower analysis with realistic toggle rates rather than worst-case defaults - ProASIC3E dynamic power scales directly with switching activity, and flash-based fabric eliminates configuration surge current but not steady-state core current. Estimated: a heavily-utilized 3M-gate design toggling at typical rates can draw significant core current, so verify your regulator's thermal capability at maximum utilization. Separate clean analog supplies for sensitive I/O banks where the design interfaces precision signals.
The 484-ball FBGA at 1 mm pitch requires via-in-pad or dogbone fanout with controlled impedance on high-speed I/O banks. Follow Microchip's ProASIC3E PCB layout application guidance: decouple each VCC/VCCA bank with 0.1 uF ceramics placed within 2 mm of the ball, add bulk 10 uF per rail, and reference high-speed signals to solid ground planes. Choose FGG484 (green) package variants for lead-free reflow profiles compliant with RoHS assembly lines.
Do not swap between FG484 and FGG484 suffixes without confirming your assembly process: both share an identical ball map, but the green package reflow profile differs from older leaded profiles. Also confirm speed grade before migration - A3PE3000-FG484I (231 MHz) cannot close timing on designs verified at the -1 grade (272 MHz). Re-run static timing analysis in Libero SoC after any speed-grade or temperature-grade substitution.
Compliance-Informationen
RoHS status not stated in provided data for the FG484 variant; green FGG484 package variants are Microchip's lead-free/halogen-free options. Verify compliance certificates on the Microchip product page before procurement.
