A3PE3000-2FG896I - ProASIC3E FPGA 3M Gates 620 I/O | Microchip
Teilenummer: A3PE3000-2FG896I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $262 | $2.620,00 |
| 100 | $238 | $23.800,00 |
| 500 | $214 | $107.000,00 |
| 1.000 | $195 | $195.000,00 |
A3PE3000-2FG896I Übersicht
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration PROM. Within the programmable logic hierarchy - FPGA -> programmable logic device -> digital IC - flash FPGAs occupy a distinct niche: they power up instantly (single-chip solution), retain configuration through power cycles, and offer inherently higher security and lower static power than SRAM FPGAs, which must reload configuration from external memory at every boot.
Key features of the A3PE3000 include its nonvolatile flash fabric on a 130nm process, single 1.5V core supply (1.425V to 1.575V operating range), speed grade -2 performance, and embedded SRAM blocks totaling 516,096 bits. Because configuration data lives in flash, no external boot device is required, reducing bill-of-materials cost and board area and improving resistance to bitstream interception - a frequent reason avionics and industrial designers choose ProASIC3E over SRAM-based rivals.
Architecturally, the ProASIC3E fabric is built from VersaTiles (fine-grained logic modules) interconnected through a hierarchical routing structure, with embedded flash switches storing each routing configuration bit. The -2 speed grade supports system clock rates up to roughly 350 MHz per third-party listings, and the E variant adds embedded RAM blocks plus extensive I/O standards support for interfacing with memory buses and high-speed peripherals.
Typical applications include avionics and military systems requiring secure, instant-on logic, industrial automation controllers, networking and communications line cards, medical equipment, and ASIC prototyping where the 3M-gate capacity accommodates substantial RTL designs.
A critical design consideration: this specific ordering code is RoHS non-compliant (lead-bearing solder balls), so confirm regulatory requirements before design-in; the FGG (green) package variants are the RoHS-compliant equivalents in the same footprint. Verify supply voltage sequencing of the 1.5V core and 2.5V/3.3V I/O banks per the manufacturer datasheet.
This page synthesizes distributor pricing tiers, drop-in alternatives within the ProASIC3E family, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für A3PE3000-2FG896I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3PE3000-2FG896I (gleiche Bauform und Footprint) – abweichend in Package, Family, Configuration Memory, Operating Temperature, System Gates.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3PE3000-2FGG896
✅ Drop-In✓ Auf Lager
$128 / Stück
Datenblatt ansehen →A3PE3000-FGG896I
✅ Drop-In✓ Auf Lager
$135.2 / Stück
Datenblatt ansehen →A3PE3000-FG896I
✅ Drop-In✓ Auf Lager
$195 / Stück
Datenblatt ansehen →A3PE3000L-1FGG896I
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3PE3000L-FGG896M
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →M1A3PE3000L-1FGG896
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3PE3000-2FG896I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3E Flash FPGA |
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| Total RAM Bits | 516,096 |
| Number of I/Os | 620 |
| Supply Voltage (Core) | 1.425 V to 1.575 V (1.5 V nominal) |
| Speed Grade | -2 |
| Process Technology | 130 nm flash |
| Gehäuse / Bauform | 896-BGA (FBGA-896, 31 x 31 mm, 1.0 mm pitch) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +85C ambient (+100C TJ) |
| Configuration Memory | On-chip flash (nonvolatile, single-chip) |
| Packaging | Tray |
| RoHS-Status | Non-compliant (lead-bearing) |
| Manufacturer Lead Time | 8 weeks |
| Max System Frequency | 350 MHz (per third-party listing) |
| Product Status | Active |
A3PE3000-2FG896I 896-bga (fbga-896, 31 x 31 mm, 1.0 mm pitch) Pinbelegungsleitfaden
Pinbelegung für A3PE3000-2FG896I (896-bga (fbga-896, 31 x 31 mm, 1.0 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für A3PE3000-2FG896I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
A3PE3000-2FG896I ist geeignet für 6 Anwendungs: Avionics and Aerospace Logic, Industrial Automation Controllers, Secure Communications and Networking, ASIC Prototyping and Emulation, Medical Equipment Control Logic, Industrial Embedded Systems Requiring Instant-On.
Avionics and Aerospace Logic
The A3PE3000-2FG896I fits avionics control, sensor aggregation, and bus-interface logic because its flash configuration is inherently single-chip and instant-on: no external boot PROM means no configuration readout window during power-up, and the flash fabric resists configuration upsets that plague SRAM FPGAs in radiation-prone environments. With 3M gates, 75,264 logic cells, and 620 I/Os, it absorbs substantial RTL including MIL-STD-1553, ARINC 429, and CAN interface blocks, while the industrial -40C to +100C (TJ) rating covers most cabin and bay environments. Implement the design in Libero SoC and verify timing at the -2 speed grade against worst-case industrial corners before flight qualification.
Empfohlen
Industrial Automation Controllers
In PLC I/O modules, motor-control coordination, and machine-vision preprocessing, the A3PE3000-2FG896I provides deterministic glue logic and protocol bridging across its 620 I/Os. The 516,096-bit embedded SRAM supports line buffers and FIFOs for fieldbus frame handling, while flash configuration eliminates the configuration device that can fail in high-vibration or electrically noisy factory environments. The single 1.5V core (1.425V-1.575V) simplifies power-tree design from a 24V industrial rail via a buck converter. Because the I-grade rating spans -40C to +85C ambient, the device suits unheated cabinets; budget I/O bank currents and use the -2 speed grade for sub-microsecond control loop latency.
Empfohlen
Secure Communications and Networking
Networking line cards and secure communication equipment benefit from the A3PE3000-2FG896I's flash-based configuration: the bitstream is stored on-chip and cannot be read back as plain SRAM configuration can, protecting proprietary algorithms and cryptographic state machines. The 3M-gate capacity implements multiple MAC/PHY bridging channels, packet framers, and encryption wrappers, while 620 I/Os support wide parallel memory and backplane interfaces at the speeds typical of 130nm-era designs (up to roughly 350 MHz internal). Place the FPGA between a host CPU and high-speed serial or parallel links; use embedded SRAM blocks (516,096 bits) for descriptor rings and packet buffering to minimize external memory count.
Empfohlen
ASIC Prototyping and Emulation
The A3PE3000-2FG896I serves as a cost-effective ASIC replacement and prototyping platform: its 3 million gates accommodate moderate RTL blocks before tape-out, and the 896-FBGA's 620 I/Os expose wide internal buses to test instrumentation. Flash reprogrammability allows iterative design changes without changing hardware, and the single-chip instant-on behavior lets prototypes demonstrate final product power-up behavior including brown-out resilience. Design teams should partition RTL with the same pipelining discipline intended for the ASIC because the -2 speed grade's ~350 MHz ceiling is far below modern ASIC clocks - expect prototype runs at scaled-down frequencies with verified functional equivalence.
Empfohlen
Medical Equipment Control Logic
Diagnostic imaging subsystems, patient-monitoring front ends, and laboratory instruments use the A3PE3000-2FG896I for sensor timing, data-path framing, and host interfacing. The flash fabric's instant-on startup meets the fast-ready requirement of medical devices that must be operational shortly after power application, and the absence of an external configuration flash reduces a component that could fail compliance testing. With 516,096 RAM bits for acquisition buffering and 620 I/Os for multi-channel sensor arrays, one device frequently replaces several glue-logic ICs, shrinking board area in constrained enclosures. Select the RoHS-compliant FGG variant for medical builds, since the FG part is lead-bearing and RoHS non-compliant per Microchip USA.
Empfohlen
Industrial Embedded Systems Requiring Instant-On
Systems that must produce valid outputs within milliseconds of power application - safety interlocks, test-set controllers, camera-trigger logic - leverage the A3PE3000-2FG896I's defining advantage: configuration lives in on-chip flash, so the fabric is functional immediately at power-up with no boot sequence. An SRAM FPGA in the same role would need an external configuration device adding 100 ms or more of boot delay plus a failure point. The 1.5V core draws its supply from a single rail; I/O banks operate at standard 3.3V/2.5V levels for direct sensor and actuator interfacing. Designers should still verify I/O state during the brief power-ramp window per the manufacturer datasheet's power-up specifications.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3PE3000-2FG896I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3PE3000-2FGG896 | A3PE3000-FGG896I | A3PE3000L-1FGG896I | M1A3PE3000L-1FGG896 |
|---|---|---|---|---|---|
| Package | 896-FBGA (31x31 mm, 1.0 mm pitch) | 896-FBGA - same footprint | 896-FBGA - same footprint | 896-FBGA - same footprint | 896-FBGA - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Speed Grade | -2 (~350 MHz) | -2 (~350 MHz) | -1 (slower) | -1 (slower, low power) | 231 MHz (per FindIC) |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Total RAM Bits | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 |
| User I/Os | 620 | 620 | 620 | 620 | 620 |
| RoHS Status | Non-compliant (lead-bearing) | Compliant (green) | Compliant (green) | Compliant (green) | Compliant (green) |
| Static Power | Standard (higher) | Standard (higher) | Standard (higher) | Low-power (L series) | Low-power (L series) |
Wichtigste Unterscheidungsmerkmale
- Fastest speed grade in the same footprint (vs. A3PE3000-FGG896I)
- RoHS-compliant drop-in available (vs. A3PE3000-2FGG896)
- Full performance vs low-power trade (vs. A3PE3000L-1FGG896I)
Designhinweise
Supply the 1.5V core from a dedicated buck regulator capable of holding 1.425V-1.575V under all load transients; core current scales with clock activity and can spike during configuration-read operations. Power I/O banks (typically 2.5V or 3.3V) per the bank assignment rules in the ProASIC3E datasheet, and observe the sequencing requirements between core and I/O rails during power-up to avoid latch-up. Add bulk (47-100 uF) plus per-ball-region 0.1 uF/0.01 uF decoupling on the 31 x 31 mm BGA; estimate total power with Microchip's SmartPower tool before finalizing the regulator - these figures are design guidance, not datasheet values.
The 896-ball FBGA with 1.0 mm pitch requires a minimum 8-layer stackup: dedicate at least two internal layers to escape routing and one solid ground plane under the die region. Fan out with via-in-pad or dog-bone escapes on a 0.9-1.0 mm grid; keep high-speed I/O pairs length-matched where timing matters. Because the FG (lead-bearing) balls require leaded assembly processes, confirm your SMT line's alloy compatibility before production - or switch to the pin-identical A3PE3000-2FGG896 for standard lead-free SnAgCu reflow.
Three frequent mistakes with this part: (1) designing with the FG package into a RoHS-restricted product - Microchip USA explicitly lists A3PE3000-2FG896I as RoHS non-compliant, so select the FGG variant instead; (2) assuming SRAM-FPGA design practices apply - the flash fabric has different configuration behavior (instant-on, no bitstream reload) and different security properties; (3) ignoring the -2 vs -1 speed-grade distinction when swapping family members - timing closure at ~350 MHz (-2) may fail at -1 grades, so re-run static timing in Libero SoC after any substitution.
Compliance-Informationen
Microchip USA lists A3PE3000-2FG896I as RoHS non-compliant with lead-bearing balls; the FGG package variants are the green RoHS-compliant equivalents. Product status: Active, 8-week manufacturer lead time.
