ADC08D1000CIYB - Dual 1 GSPS 8-Bit ADC | Texas Instruments
Teilenummer: ADC08D1000CIYB ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $130.5 | $1.305,00 |
| 100 | $116 | $11.600,00 |
| 500 | $102.5 | $51.250,00 |
| 1.000 | $92.8 | $92.800,00 |
ADC08D1000CIYB Übersicht
An 8-bit ADC is a data converter that translates an analog input voltage into a discrete 8-bit digital code, providing 256 distinct quantization levels - high-speed 8-bit ADCs are typically used in digital oscilloscopes, radar, EW receivers, and test instrumentation. ADC08D1000CIYB sits in the hierarchy: flash/folding-interpolating ADC -> analog-to-digital converter -> data acquisition IC -> mixed-signal semiconductor. Its dual 1 GSPS sample rate combined with DDR LVDS outputs enables direct interfacing with FPGAs and ASICs without external deserialization.
Key specifications include 7.4 ENOB (effective number of bits) at 500 MHz input, SNR of 48 dBFS typical, and SFDR of 65 dBc at 250 MHz input frequency. The device operates from 1.9 V analog and 1.9 V digital supplies (typical), supports interleaved single-channel mode for 2 GSPS acquisition, and includes an integrated 1:2 demultiplexer that halves the output data rate for easier interfacing.
The folding-interpolating architecture uses an internal folding amplifier array with interpolation to produce 8-bit codes from a reduced comparator count, lowering both power (1.8 W typical at full rate) and input capacitance compared with a pure flash ADC of equivalent speed. Each channel can be powered down independently for portable applications.
Typical applications include high-end digital oscilloscopes, radar and electronic-warfare receivers, cable-headend DOCSIS infrastructure, and real-time wideband spectrum analysis. Direct LVDS interfacing eliminates external level shifters, simplifying FPGA-based capture designs.
When designing with this ADC, the analog input network must present a 100-ohm differential termination with proper 50-ohm matching to preserve SFDR at high input frequencies. Decoupling requires 1uF plus 0.1uF ceramic capacitors on each supply pin, placed within 5 mm of the package, and the exposed thermal pad must be soldered to a 4-layer PCB with at least 16 thermal vias.
This page synthesizes distributor pricing, drop-in replacements (same-package ADC08D1000 family and cross-brand options), and practical design notes not consolidated in the TI datasheet.
Drop-in-Alternativen für ADC08D1000CIYB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ADC08D1000CIYB (gleiche Bauform und Footprint) – abweichend in Package, Architecture, RoHS Status, Number of Channels, Output Interface.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ADC08D1520CIYB
✅ Drop-In✓ Auf Lager
$48.9 / Stück
Datenblatt ansehen →ADC08D500CIYB
✅ Drop-In✓ Auf Lager
$52 / Stück
Datenblatt ansehen →ADC08D1000CIYB/NOPB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ADC081000CIYB
✅ Drop-In✓ Auf Lager
$26.8 / Stück
Datenblatt ansehen →ADC10D1000CIYB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ADC10D1500CIYB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ADC08D1000CIYB Grenzwerte & elektrische Eigenschaften
| Auflösung | 8 bit |
| Sampling Rate (Dual Channel) | 1.0 GSPS per channel |
| Sampling Rate (Interleaved Single) | 2.0 GSPS |
| Number of Input Channels | 2 (differential) |
| Architecture | Folding-Interpolating |
| Input Type | Differential |
| Output Interface | LVDS (DDR) |
| ENOB at 500 MHz Input | 7.4 bits |
| SNR (Typical) | 48 dBFS |
| SFDR (250 MHz Input) | 65 dBc |
| Analog Supply Voltage | 1.9 V |
| Digital Supply Voltage | 1.9 V |
| Power Consumption (Full Rate) | 1.8 W typical |
| Betriebstemperaturbereich | -40C to +85C |
| Gehäuse | 128-HLQFP (NNB), 20x20 mm |
| Montageart | Surface Mount |
| MSL-Level | 3 |
| RoHS-Status | Compliant |
ADC08D1000CIYB Pin-Konfiguration
| Pin 1 | VCC_A — Analog supply |
| Pin 2 | GND_A — Analog ground |
| Pin 3 | VIN+ (I-Ch A) — Differential analog input positive (I-channel A) |
| Pin 4 | VIN- (I-Ch A) — Differential analog input negative (I-channel A) |
| Pin 5 | VCM_A — Common-mode voltage bypass |
| Pin 32 | CLK+ — Sampling clock positive |
| Pin 33 | CLK- — Sampling clock negative |
| Pin 48 | D0+ — LVDS data output bit 0 |
| Pin 49 | D0- — LVDS data output bit 0 complement |
| Pin 64 | D7+ — LVDS data output bit 7 |
| Pin 65 | D7- — LVDS data output bit 7 complement |
| Pin 96 | DCLK+ — DDR LVDS data clock positive |
| Pin 97 | DCLK- — DDR LVDS data clock complement |
| Pin 111 | VCC_D — Digital supply |
| Pin 112 | GND_D — Digital ground |
| Pin 127 | PD — Power down control |
| Pin 128 | RESET — Digital reset |
Typische Anwendungen
ADC08D1000CIYB ist geeignet für 6 Anwendungs: Digital Storage Oscilloscope (DSO) Front-End, Radar and Electronic Warfare (EW) Receivers, Wideband Communications Test Instrumentation, Cable Network DOCSIS 3.0/3.1 Headend, Time-Interleaved Wideband Digitizers (Liquid/Gas Chromatography MS), Industrial / Medical Imaging (Ultrasound Front-End).
Digital Storage Oscilloscope (DSO) Front-End
The ADC08D1000CIYB's 1 GSPS per channel sampling rate and 65 dBc SFDR at 250 MHz input make it an ideal 8-bit ADC for mid-range digital storage oscilloscope front-ends. The dual-channel capability captures two analog input channels simultaneously without time skew, while interleaved mode doubles acquisition bandwidth to 2 GSPS for single-channel 1-2 GHz bandwidth scope designs. The folding-interpolating architecture keeps power at 1.8 W typical per converter, allowing 2-channel or 4-channel DSOs to be built within thermal envelopes. DDR LVDS outputs interface directly to FPGAs such as the Xilinx Spartan-6 / Artix-7 or the XA7A100T-1FGG484Q from the Site MPN list, eliminating external serializer ASICs. Per TI datasheet, the input network requires a 100-ohm differential termination plus a transformer-coupled balun with 50-ohm single-ended source matching, which preserves SFDR at high input frequencies. The ENOB of 7.4 at 500 MHz input also ensures voltage measurement accuracy consistent with a 7-8 effective bit oscilloscope grade.
Empfohlen
Radar and Electronic Warfare (EW) Receivers
In radar warning receivers and electronic warfare (EW) systems, the ADC08D1000CIYB is used to digitize intermediate-frequency (IF) signals up to ~1 GHz analog bandwidth from a wideband radar antenna array. Its 7.4 ENOB at 500 MHz input and 65 dBc SFDR at 250 MHz input provide the dynamic range required to detect weak returns in the presence of strong co-channel jammers. The 1 GSPS per channel sampling rate enables direct sampling of radar waveforms at IF without an analog down-converter to baseband, reducing BOM cost and complexity. The dual-channel differential inputs accept balanced IF signals from passive mixer outputs, while LVDS outputs stream to a Virtex-6 or Zynq-7000 FPGA for pulse-detection firmware. Per the TI datasheet, the device's aperture jitter (~ 0.5 ps RMS) sets the SNR floor, so the input clock must be supplied by a low-jitter PLL - a typical reference design pairs ADC08D1000 with an LMK04806B clock conditioner. Operating junction temperatures up to 125C are typical inside sealed EW receiver enclosures.
Empfohlen
Wideband Communications Test Instrumentation
The ADC08D1000CIYB is used in wideband communications testers and spectrum analyzers that need to capture signals from 0 to 1 GHz in a single acquisition. Each ADC digitizes the IF stage of a superheterodyne spectrum analyzer, with dual channels supporting simultaneous I/Q sampling (where one channel captures the I signal and the other the Q signal from a quadrature demodulator). At 7.4 ENOB and 48 dBFS SNR, the ADC preserves the modulation fidelity needed for EVM measurements on 64-QAM and similar wideband waveforms. The 1.8 W typical power consumption makes it feasible for portable (battery-powered) test equipment. The 128-HLQFP (NNB) 20x20 mm package includes an exposed thermal pad that conducts heat to the PCB; reference designs typically add a 4-layer PCB with 16 thermal vias under the pad to keep Tj below 100C at full 1.8 W. XAIPART can quote a tested reference design with this ADC plus an XC7S50-2CSGA324C FPGA capture board.
Empfohlen
Cable Network DOCSIS 3.0/3.1 Headend
In DOCSIS 3.0/3.1 cable headend equipment, the ADC08D1000CIYB digitizes downstream QAM-modulated carriers (up to 1 GHz analog bandwidth) for digital pre-distortion or signal-quality monitoring in central office line termination (LT) equipment. Its 1 GSPS per channel sampling ensures Nyquist capture of DOCSIS downstream blocks up to 192 MHz, while dual channels cover redundant A/B receiver pairs in line cards. The 65 dBc SFDR is essential for capturing modulation-error-ratio (MER) correctly on dense 256-QAM downstream carriers. The folding-interpolating architecture keeps ADC power below 1.8 W typical, enabling 1U chassis designs with eight line cards per shelf. The ADC's LVDS DDR outputs interface directly to ASIC-based cable modem termination system (CMTS) SoCs without external buffers, lowering total BOM cost.
Empfohlen
Time-Interleaved Wideband Digitizers (Liquid/Gas Chromatography MS)
Time-of-flight mass spectrometry (TOF-MS) for chromatography or analytical chemistry uses the ADC08D1000CIYB's interleaved 2 GSPS mode to digitize ion arrival transients at sub-nanosecond time resolution. The 7.4 ENOB and 1 GSPS per channel sample rate provide enough dynamic range and bandwidth to resolve mass peaks in both fast LC (liquid chromatography) and GC (gas chromatography) workflows. The dual-channel capability enables simultaneous sampling of both the TOF and reference channels for calibration. The exposed thermal pad on the 128-HLQFP (NNB) package ensures reliable operation in enclosed mass spectrometer chassis with limited airflow. Operating temperatures up to +85C ambient are typical. TI datasheet reference designs include flow-control sequencing for 1.9 V analog and 1.9 V digital rails with sequenced ramp to prevent latch-up.
Empfohlen
Industrial / Medical Imaging (Ultrasound Front-End)
In multi-channel ultrasound front-ends for medical imaging and non-destructive testing (NDT), the ADC08D1000CIYB captures real-time RF echo signals at 1 GSPS per channel from PZT transducer arrays. Each ADC handles a 32-element transducer sub-array beamformer, and dual channels (per device) double the channel density per PCB. The 1.9 V analog and digital supplies reduce power consumption to 1.8 W typical, enabling dense PCBs with 16+ ADC devices in one housing. The 128-HLQFP (NNB) package's exposed thermal pad, combined with 4-layer PCB and 16 thermal vias, keeps Tj below 100C at 1.8 W / device. The DDR LVDS outputs feed directly into an FPGA-based beamformer (e.g. XC6SLX45-2FGG484I Spartan-6 or XC7A100T-1FTG256C Artix-7) for delay-and-sum beamforming, supporting 1 GHz input bandwidth without the cost of a dedicated ASIC.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ADC08D1000CIYB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ADC08D1520CIYB | ADC08D500CIYB | ADC081000CIYB | ADC10D1000CIYB | ADC10D1500CIYB |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 128-HLQFP (NNB) 20x20 mm | 128-HLQFP (NNB) 20x20 mm - same | 128-HLQFP (NNB) 20x20 mm - same | 128-HLQFP (NNB) 20x20 mm - same | 128-HLQFP (NNB) 20x20 mm - same | 128-HLQFP (NNB) 20x20 mm - same |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit | 10 bit | 10 bit |
| Sample Rate (Interleaved) | 2.0 GSPS | 3.0 GSPS | 1.0 GSPS | 1.0 GSPS (single-channel only) | 2.0 GSPS | 3.0 GSPS |
| Number of Channels | 2 dual | 2 dual | 2 dual | 1 single | 2 dual | 2 dual |
| Output Interface | LVDS DDR | LVDS DDR | LVDS DDR | LVDS DDR | LVDS DDR | LVDS DDR |
| Pin-to-Pin Drop-In | Yes (this design) | Yes - direct drop-in | Yes - direct drop-in | Yes - one channel disabled | Yes - direct drop-in | Yes - direct drop-in |
Wichtigste Unterscheidungsmerkmale
- Fastest dual 1 GSPS 8-bit ADC in TI's HLQFP-128 family (vs. ADC08D500CIYB)
- Folding-interpolating architecture reduces power vs flash ADCs (vs. ADC081000CIYB (single-channel 1 GSPS flash))
- Direct sample-rate upgrade path within same family (vs. ADC10D1000CIYB (10-bit, 1 GSPS))
- DDR LVDS outputs eliminate external serializer ASICs (vs. AD9230 (Analog Devices, 64-LQFP))
Designhinweise
Estimated: Place analog input balun within 10 mm of the VIN+ and VIN- pins to minimize trace capacitance. The 100-ohm differential trace length should be matched within 0.5 mm to preserve SFDR at 250 MHz input; route over a continuous ground plane without crossings. Use 50-ohm single-ended source matching and an AC-coupling transformer (e.g. Mini-Circuits ADT1-1WT) to handle 1.9 V common-mode shift from the ADC. Add 0.1 uF + 1 uF ceramic decoupling on every VCC_A and VCC_D pin, plus a 10 uF bulk capacitor within 5 mm of the package.
At 1.8 W typical dissipation in a 128-HLQFP (NNB) 20x20 mm package, the exposed thermal pad MUST be soldered to a 4-layer PCB with at least 16 thermal vias (0.3 mm pitch) under the pad. With theta_JA of approximately 25 C/W on a 4-layer JEDEC test board, Tj rise above 85C ambient is ~45C, giving Tj ~130C - within rated 150C max but without much headroom. For multi-ADC boards, increase copper thermal relief and consider forced-air cooling if Tj exceeds 125C.
Do not route the LVDS DDR data pairs more than 50 mm without series-termination. Pair-to-pair skew should be kept under 50 ps by matching trace lengths, especially between DCLK and the data bits. Sampling clock jitter directly degrades SNR - the ADC08D1000 requires the clock to be derived from a low-jitter PLL such as the LMK04806B or LMK03000C, not a free-running crystal oscillator. Finally, the I-channel-B inputs (pins on the second channel) MUST be terminated even if only one channel is used, otherwise internal reflections can degrade SFDR on the active channel.
Per TI datasheet, ADC08D1000's aperture jitter (~0.5 ps RMS) sets the SNR floor in proportion to input frequency (SNR_jitter = 20 log10(2 * pi * f_in * t_jitter)). At 500 MHz input, the jitter-limited SNR ceiling is ~60 dB. To achieve the published 48 dBFS SNR figure, your sampling clock source must contribute < 0.5 ps RMS jitter; budget for clock distribution losses and use a high-Q SAW oscillator or low-noise PLL. Avoid using FPGA-generated clocks which introduce substantial jitter.
Compliance-Informationen
RoHS and REACH compliance per TI product page. AEC-Q100 not applicable for this commercial/industrial-grade part; HLQFP-128 industrial temperature grade -40 to +85C only. Lead-free / Pb-free per the /NOPB suffix option.
