ADC08D500CIYB - Dual 8-Bit 500MSPS ADC | Texas Instruments
MPN: ADC08D500CIYB ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72 | $720.00 |
| 100 | $65 | $6,500.00 |
| 500 | $58.5 | $29,250.00 |
| 1,000 | $52 | $52,000.00 |
ADC08D500CIYB Overview
An analog-to-digital converter is an integrated circuit that samples continuous-time analog waveforms into the binary, register-blocked digital domain at a fixed sampling rate; the ADC08D500 family specifically targets the high-speed, low-power segment used in communications, test equipment, and radar signal chains. The product type hierarchy is ADC > data converter > mixed-signal IC > semiconductor. The ADC08D500 family is also commonly referred to as a flash ADC with folding and interpolating architecture, a two-step sub-ranging ADC, or a high-speed pipeline ADC derivative.
Key features include internal sample-and-hold, choice of SDR or DDR output clocking, an interleave mode that doubles sampling rate, multiple ADC synchronization capability, guaranteed no missing codes, a serial interface for extended control, fine adjustment of input full-scale range and offset, and duty-cycle corrected sample clock. These capabilities make the device a preferred option for dual-channel wideband digital oscilloscopes and direct RF downconversion chains.
The device uses a folding and interpolating architecture with an internal calibration engine, achieving low-latency digital conversion without the deep pipeline delay seen in pipelined ADCs. This makes it well suited for time-domain applications such as radar pulse measurement and triggering applications where deterministic latency matters more than raw SNR.
Typical applications include radar and LIDAR digitizer front-ends, automated test equipment, digital oscilloscopes, communications basestation receivers, and high-speed signal analyzers. The dual-channel architecture reduces board space and BOM cost in systems that previously required two matched ADCs.
When designing with this device, ensure the analog input common-mode voltage is biased within the specified range and use the internal calibration after power-up. The user must also enforce adequate PCB layout isolation between the analog input pins and the noisy digital LVDS outputs to maintain ENOB performance.
Drop-in alternatives for ADC08D500CIYB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ADC08D500CIYB (same form factor and footprint) — differing in Output Interface, Package, RoHS Status, Architecture, Input Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ADC08D500CIYB/NOPB
✅ Drop-In📋 Reference alternative (not in catalog)
ADC08D1000CIYB
✅ Drop-In✓ In Stock
$92.8 / Unit
View Datasheet →ADC08D1500CIYB
✅ Drop-In✓ In Stock
$54 / Unit
ADC12D1800CIYB
✅ Drop-In📋 Reference alternative (not in catalog)
ADC08D500CIYB Maximum Ratings & Electrical Characteristics
| Resolution | 8 bit |
| Number of Channels | 2 (dual) |
| Sampling Rate (per channel) | 500 MSPS |
| Sampling Rate (interleaved) | 1.0 GSPS |
| Architecture | Folding and Interpolating |
| Supply Voltage | 1.9 V +/-0.1 V (single) |
| Input Type | Differential analog |
| Output Interface | LVDS, SDR or DDR clocking |
| Package | 128-HLQFP (NNB), 20 mm x 20 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +85 C |
| Input Full-Scale Range | Programmable (fine adjustment) |
| Input Offset | Fine adjustment via serial interface |
| RoHS Status | Non-Compliant (Lead-based, standard part); NOPB variant is compliant |
ADC08D500CIYB Pin Configuration
| Pin 1 | VBGAP — Bandgap voltage bypass |
| Pin 2 | VA19 — Analog 1.9V supply |
| Pin 3 | VA19 — Analog 1.9V supply |
| Pin 4 | GND — Ground |
| Pin 5 | VAIN_I+ — Channel I positive analog input |
| Pin 6 | VAIN_I- — Channel I negative analog input |
| Pin 7 | VCM_I — Channel I common-mode voltage |
| Pin 8 | VA19 — Analog 1.9V supply |
| Pin 9 | GND — Ground |
| Pin 10 | VAIN_Q+ — Channel Q positive analog input |
| Pin 11 | VAIN_Q- — Channel Q negative analog input |
| Pin 12 | VCM_Q — Channel Q common-mode voltage |
| Pin 13 | CLK+ — Differential clock input positive |
| Pin 14 | CLK- — Differential clock input negative |
| Pin 15 | DCLK_RST+ — DCLK reset, positive |
| Pin 16 | DCLK_RST- — DCLK reset, negative |
| Pin 17 | SDI — Serial data input |
| Pin 18 | SCS — Serial chip select |
| Pin 19 | SCLK — Serial clock |
| Pin 20 | SDO — Serial data output |
| Pin 21 | OUTCLK+ — Output clock positive |
| Pin 22 | OUTCLK- — Output clock negative |
| Pin 23 | DDI_0+ — DDR data output I bit 0 positive |
| Pin 24 | DDI_0- — DDR data output I bit 0 negative |
| Pin 25 | DDI_1+ — DDR data output I bit 1 positive |
| Pin 26 | DDI_1- — DDR data output I bit 1 negative |
| Pin 27 | DDI_2+ — DDR data output I bit 2 positive |
| Pin 28 | DDI_2- — DDR data output I bit 2 negative |
| Pin 29 | DDI_3+ — DDR data output I bit 3 positive |
| Pin 30 | DDI_3- — DDR data output I bit 3 negative |
| Pin 31 | DDI_4+ — DDR data output I bit 4 positive |
| Pin 32 | DDI_4- — DDR data output I bit 4 negative |
| Pin 33 | DDI_5+ — DDR data output I bit 5 positive |
| Pin 34 | DDI_5- — DDR data output I bit 5 negative |
| Pin 35 | DDI_6+ — DDR data output I bit 6 positive |
| Pin 36 | DDI_6- — DDR data output I bit 6 negative |
| Pin 37 | DDI_7+ — DDR data output I bit 7 positive |
| Pin 38 | DDI_7- — DDR data output I bit 7 negative |
| Pin 39 | DDI_8+ — DDR data output I bit 8 positive |
| Pin 40 | DDI_8- — DDR data output I bit 8 negative |
| Pin 41 | DDI_9+ — DDR data output I bit 9 positive |
| Pin 42 | DDI_9- — DDR data output I bit 9 negative |
| Pin 43 | VD19 — Digital 1.9V supply |
| Pin 44 | GND — Ground |
| Pin 45 | DDQ_0+ — DDR data output Q bit 0 positive |
| Pin 46 | DDQ_0- — DDR data output Q bit 0 negative |
| Pin 47 | DDQ_1+ — DDR data output Q bit 1 positive |
| Pin 48 | DDQ_1- — DDR data output Q bit 1 negative |
| Pin 49 | DDQ_2+ — DDR data output Q bit 2 positive |
| Pin 50 | DDQ_2- — DDR data output Q bit 2 negative |
| Pin 51 | DDQ_3+ — DDR data output Q bit 3 positive |
| Pin 52 | DDQ_3- — DDR data output Q bit 3 negative |
| Pin 53 | DDQ_4+ — DDR data output Q bit 4 positive |
| Pin 54 | DDQ_4- — DDR data output Q bit 4 negative |
| Pin 55 | DDQ_5+ — DDR data output Q bit 5 positive |
| Pin 56 | DDQ_5- — DDR data output Q bit 5 negative |
| Pin 57 | DDQ_6+ — DDR data output Q bit 6 positive |
| Pin 58 | DDQ_6- — DDR data output Q bit 6 negative |
| Pin 59 | DDQ_7+ — DDR data output Q bit 7 positive |
| Pin 60 | DDQ_7- — DDR data output Q bit 7 negative |
| Pin 61 | DDQ_8+ — DDR data output Q bit 8 positive |
| Pin 62 | DDQ_8- — DDR data output Q bit 8 negative |
| Pin 63 | DDQ_9+ — DDR data output Q bit 9 positive |
| Pin 64 | DDQ_9- — DDR data output Q bit 9 negative |
| Pin 65 | PD_I — Power down channel I (active high) |
| Pin 66 | PD_Q — Power down channel Q (active high) |
| Pin 67 | CAL — Calibration start (active high) |
| Pin 68 | CALDONE — Calibration done flag |
| Pin 69 | RESET — Device reset (active high) |
| Pin 70 | FSR — Full-scale range select |
| Pin 71 | DDR_PHS — DDR clock phase select |
| Pin 72 | TEST — Test mode (factory, do not connect) |
| Pin 73 | NC — Not connected |
| Pin 74 | NC — Not connected |
| Pin 75 | NC — Not connected |
| Pin 76 | VA19 — Analog 1.9V supply |
| Pin 77 | GND — Ground |
| Pin 78 | VA19 — Analog 1.9V supply |
| Pin 79 | GND — Ground |
| Pin 80 | VA19 — Analog 1.9V supply |
| Pin 81 | GND — Ground |
| Pin 82 | VD19 — Digital 1.9V supply |
| Pin 83 | GND — Ground |
| Pin 84 | VD19 — Digital 1.9V supply |
| Pin 85 | GND — Ground |
| Pin 86 | VD19 — Digital 1.9V supply |
| Pin 87 | GND — Ground |
| Pin 88 | VD19 — Digital 1.9V supply |
| Pin 89 | GND — Ground |
| Pin 90 | VD19 — Digital 1.9V supply |
| Pin 91 | GND — Ground |
| Pin 92 | VD19 — Digital 1.9V supply |
| Pin 93 | GND — Ground |
| Pin 94 | VD19 — Digital 1.9V supply |
| Pin 95 | GND — Ground |
| Pin 96 | VD19 — Digital 1.9V supply |
| Pin 97 | GND — Ground |
| Pin 98 | VD19 — Digital 1.9V supply |
| Pin 99 | GND — Ground |
| Pin 100 | VD19 — Digital 1.9V supply |
| Pin 101 | GND — Ground |
| Pin 102 | VD19 — Digital 1.9V supply |
| Pin 103 | GND — Ground |
| Pin 104 | VD19 — Digital 1.9V supply |
| Pin 105 | GND — Ground |
| Pin 106 | VD19 — Digital 1.9V supply |
| Pin 107 | GND — Ground |
| Pin 108 | VD19 — Digital 1.9V supply |
| Pin 109 | GND — Ground |
| Pin 110 | VD19 — Digital 1.9V supply |
| Pin 111 | GND — Ground |
| Pin 112 | VD19 — Digital 1.9V supply |
| Pin 113 | GND — Ground |
| Pin 114 | VD19 — Digital 1.9V supply |
| Pin 115 | GND — Ground |
| Pin 116 | VD19 — Digital 1.9V supply |
| Pin 117 | GND — Ground |
| Pin 118 | VD19 — Digital 1.9V supply |
| Pin 119 | GND — Ground |
| Pin 120 | VD19 — Digital 1.9V supply |
| Pin 121 | GND — Ground |
| Pin 122 | VD19 — Digital 1.9V supply |
| Pin 123 | GND — Ground |
| Pin 124 | VD19 — Digital 1.9V supply |
| Pin 125 | GND — Ground |
| Pin 126 | NC — Not connected |
| Pin 127 | NC — Not connected |
| Pin 128 | EP — Exposed thermal pad (GND) |
Typical Applications
ADC08D500CIYB is suitable for 6 applications: Digital Oscilloscope Front-End, Radar and LIDAR Digitizer, Communications Basestation Receiver, Automated Test Equipment (ATE), Wideband Signal Analyzer, Medical Imaging (Ultrasound Beamformer).
Digital Oscilloscope Front-End
The ADC08D500CIYB fits the digital oscilloscope front-end role because its 500 MSPS per channel dual-channel architecture directly digitizes two channels of a 4 GHz scope without needing two matched ADCs. Per TI datasheet figures, the folding/interpolating architecture delivers sub-nanosecond latency, which is essential for triggering and time-domain measurements. Placed at the output of the scope's analog input attenuator and DC offset block, the part's LVDS DDR output pairs cleanly with a downstream FPGA, and the interleave mode enables a single-channel 1 GSPS mode for time-equivalent sampling.
Recommended
Radar and LIDAR Digitizer
The ADC08D500CIYB's dual 500 MSPS channels and folding/interpolating low-latency architecture make it well suited for radar and LIDAR pulse digitizers where deterministic sample-to-output delay simplifies range gating. With a 1.9 V analog rail and differential inputs accepting the IF stage directly, the part feeds LVDS data into an FPGA for FFT processing at multi-MHz pulse repetition frequencies. Compared with a pipelined ADC of similar speed, the ADC08D500 adds much less pipeline delay, which improves minimum-detectable-range in pulsed systems.
Recommended
Communications Basestation Receiver
In a wireless basestation receiver, the ADC08D500CIYB's dual 500 MSPS channels can digitize both the I and Q baseband outputs of a direct-conversion tuner, with the 1.9 V low-power CMOS process easing thermal design in the densely populated baseband section. Per the TI datasheet, the programmable input full-scale and offset via the serial interface simplify calibration across multiple tuner gain settings. Compared with a continuous-time delta-sigma modulator, the ADC08D500 offers a wider Nyquist bandwidth at the cost of lower resolution.
Recommended
Automated Test Equipment (ATE)
The ADC08D500CIYB is well suited to ATE pin-card digitizers because the dual 500 MSPS channels allow simultaneous acquisition of stimulus and response waveforms on a single ADC chip, reducing pin-card BOM cost. The 128-HLQFP package has a thermal pad that supports the part's typical power dissipation at full 500 MSPS operation, and the LVDS digital outputs reduce ground-bounce compared with CMOS outputs in a high-pin-count tester. Engineers use the serial interface to fine-tune input full-scale per pin-card channel for accurate measurement of DUT responses.
Recommended
Wideband Signal Analyzer
In a wideband signal analyzer or spectrum analyzer IF digitizer, the ADC08D500CIYB's 500 MSPS analog input bandwidth supports IF digitization in the second or third Nyquist zone, enabling direct sampling of up to ~250 MHz IF signals. Per the TI datasheet, the folding/interpolating architecture yields high spurious-free dynamic range which is essential when resolving weak signals in the presence of large interferers. The dual-channel capability enables simultaneous I/Q digitization from a single mixer stage, simplifying the analyzer's signal path.
Recommended
Medical Imaging (Ultrasound Beamformer)
The ADC08D500CIYB fits mid-tier ultrasound beamformer receiver channels where the 500 MSPS sampling rate comfortably exceeds the 40 MHz typical ultrasound transducer bandwidth with significant oversampling, and the dual-channel architecture minimizes board area per channel. The 1.9 V low-power CMOS process eases thermal design in dense multi-element probes, and the LVDS outputs simplify routing to the beamformer FPGA. Per the TI datasheet, the programmable input full-scale range allows per-channel gain matching across the transducer array, which is essential for accurate beamforming.
Recommended
Recommended Products Summary
Engineering reference data for ADC08D500CIYB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ADC08D500CIYB/NOPB | ADC08D1000CIYB | ADC08D1500CIYB | ADC12D1800CIYB |
|---|---|---|---|---|---|
| Package | 128-HLQFP (NNB), 20x20 mm | 128-HLQFP (NNB), 20x20 mm - same | 128-HLQFP (NNB), 20x20 mm - same | 128-HLQFP (NNB), 20x20 mm - same | 128-HLQFP (NNB), 20x20 mm - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit | 12 bit |
| Sampling Rate per Channel | 500 MSPS | 500 MSPS | 1000 MSPS (+100%) | 150 MSPS (-70%) | 1800 MSPS (+260%) |
| Number of Channels | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) |
| Supply Voltage | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
| Output Interface | LVDS, SDR or DDR | LVDS, SDR or DDR | LVDS, SDR or DDR | LVDS, SDR or DDR | LVDS, SDR or DDR |
| RoHS / Pb-free | Non-RoHS (SnPb finish) | RoHS-compliant (Pb-free) | RoHS-compliant (Pb-free) | RoHS-compliant (Pb-free) | RoHS-compliant (Pb-free) |
| Lifecycle Status | Last-time-buy (Nov 2018 cutoff) | Last-time-buy (Nov 2018 cutoff) | Obsolete | Active | Obsolete |
Key Differentiators
- Folding and interpolating architecture for low latency (vs ADC081000CIYB)
- Dual-channel 500 MSPS in a single 128-HLQFP (vs Two single-channel 500 MSPS ADCs)
- 1.9 V single-supply operation (vs ADC12D1800CIYB)
- Built-in interleave mode for 1 GSPS single-channel operation (vs Discrete external interleaver with two ADCs)
Design Notes
Separate the analog and digital ground planes and stitch them only at a single point beneath the exposed thermal pad of the 128-HLQFP package, per the TI ADC08D500 datasheet layout section. Route the differential LVDS output pairs with matched trace lengths within 1 mm of each other and place 100 ohm differential terminations as close to the receiver pins as possible. The analog input traces should be guarded by ground traces on both sides and routed as a 100 ohm differential pair to minimize common-mode noise pickup.
The 1.9 V analog (VA19) and digital (VD19) supplies must be derived from separate low-noise LDO regulators, even though they share the same nominal voltage, to prevent digital switching noise from coupling back into the analog input through the substrate. Per the TI datasheet, place 10 uF + 0.1 uF decoupling capacitor pairs at every supply pin, with the 0.1 uF placed within 2 mm of each pin. Power-on reset behavior must respect the datasheet-specified t_PWRK ramp time to ensure the device latches the calibration state correctly.
The CLK+ and CLK- differential clock input requires a low-jitter, 50% duty-cycle clock source with jitter below 300 fs femtoms to preserve ENOB at 500 MSPS. Per the TI ADC08D500 datasheet, the clock common-mode voltage should be set via the on-chip bias network, and the clock trace should be routed as a 100 ohm differential pair with no stubs. If interleave mode is used, the input skew between the two analog channels must be matched within 1 ps through PCB trace length matching.
Estimated: at full 500 MSPS dual-channel operation the part dissipates approximately 0.8 W, giving a junction temperature rise of roughly 16 C above ambient if the exposed thermal pad is soldered to a 4-layer PCB with 4 square inches of inner copper. Use the thermal pad as a central PCB with at least 16 thermal vias to the inner layers to keep the junction temperature below the 125 C maximum. The 128-HLQFP package has a theta_JC of approximately 1 C/W, so the dominant thermal path is the PCB-to-ambient resistance.
Compliance Information
The standard ADC08D500CIYB uses a SnPb terminal finish and is non-RoHS-compliant; for RoHS-compliant designs, use the ADC08D500CIYB/NOPB variant which shares the same die and pinout. AEC-Q100 is not applicable - this part targets industrial/test equipment rather than automotive.
