ATSAMA5D26C-CU - 500MHz ARM Cortex-A5 MPU 289-LFBGA | Microchip
Teilenummer: ATSAMA5D26C-CU ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $19.02 | $19,02 |
| 10 | $17.5 | $175,00 |
| 100 | $15.2 | $1.520,00 |
| 500 | $13.45 | $6.725,00 |
| 1.000 | $11.8 | $11.800,00 |
ATSAMA5D26C-CU Übersicht
An ARM Cortex-A5 application processor is a 32-bit RISC CPU core designed by Arm Holdings that targets cost-sensitive, power-constrained embedded applications. Cortex-A5 implements the ARMv7-A architecture with optional NEON and FPU, providing a balanced performance-per-watt profile compared to Cortex-A7/A9. Within the broader taxonomy, the SAMA5D2 family sits as MPU > application processor > microcontroller/MPU > semiconductor > integrated circuit. The SAMA5D2 line emphasizes Linux-capable MPUs with hardware security and ultra-low standby power (about 5 µA in backup mode), bridging MCU simplicity with application-processor performance.
The ATSAMA5D26C-CU features a hardware AES/SHA/TRNG cryptographic engine, secure boot with tamper detection, MIPI CSI-2 camera interface, 24-bit LCD controller up to 1024x768, USB Host/Device, I2S, and up to 11 UARTs. It is offered in industrial (-40C to +85C) temperature range and operates from a 1.2 V core supply with simple power management scheme (single 3.3 V I/O supply).
Typical applications include industrial HMI panels, secure IoT gateways, edge-AI sensor hubs, building automation controllers, and Linux-based point-of-sale terminals. When designing, plan for 0.8 mm pitch BGA fanout, ground-place capacitors under the exposed die pad, and a separate 1.2 V LDO for core. This page combines distributor pricing, SAMA5D2 family drop-in alternatives, and practical design notes that go beyond the datasheet headline specs.
Drop-in-Alternativen für ATSAMA5D26C-CU – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAMA5D26C-CU (gleiche Bauform und Footprint) – abweichend in Ethernet, USB, External Memory Support, Package, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAMA5D26C-CNR
✅ Drop-In✓ Auf Lager
$10.85 / Stück
Datenblatt ansehen →ATSAMA5D26B-CU
✅ Drop-In✓ Auf Lager
$7.5 / Stück
Datenblatt ansehen →ATSAMA5D26B-CNR
✅ Drop-In✓ Auf Lager
$9.1 / Stück
Datenblatt ansehen →ATSAMA5D27C-CU
✅ Drop-In✓ Auf Lager
$11.9 / Stück
Datenblatt ansehen →ATSAMA5D26A-CUR
✅ Drop-In✓ Auf Lager
$14.2 / Stück
Datenblatt ansehen →ATSAMA5D26A-CN
✅ Drop-In✓ Auf Lager
$15.2 / Stück
Datenblatt ansehen →ATSAMA5D26C-CU Grenzwerte & elektrische Eigenschaften
| Product Type | Microprocessor (MPU) |
| Core | ARM Cortex-A5 (32-bit, single-core) |
| Maximum CPU Clock | 500 MHz |
| Internal SRAM | 128 KB |
| Internal ROM | 160 KB |
| L1 Cache | 32 KB I-cache + 32 KB D-cache |
| External Memory Support | DDR2 / DDR3L / LPDDR2 / LPDDR3, QSPI, e.MMC |
| Gehäuse | 289-LFBGA (14x14 mm, 0.8 mm ball pitch) |
| Supply Voltage (Core) | 1.2 V |
| Supply Voltage (I/O) | 3.3 V |
| Betriebstemperatur | -40C to +85C (industrial) |
| Backup Mode Current | ~5 µA (per SAMA5D2 family datasheet) |
| Security Features | Secure boot, HW AES/SHA/TRNG, tamper pins |
| Display Controller | 24-bit LCD up to 1024x768 |
| Connectivity | 2x GMAC, 2x CAN-FD, USB Host/Device, 11x UART, I2S, SPI, I2C |
| Camera Interface | MIPI CSI-2, 12-bit parallel |
| RoHS-Status | Compliant |
ATSAMA5D26C-CU 289-lfbga (14x14 mm, 0.8 mm ball pitch) Pinbelegungsleitfaden
Pinbelegung für ATSAMA5D26C-CU (289-lfbga (14x14 mm, 0.8 mm ball pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für ATSAMA5D26C-CU.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
ATSAMA5D26C-CU ist geeignet für 6 Anwendungs: Industrial HMI Panel Controller, Secure IoT Edge Gateway, Building Automation Controller, Edge-AI Vision Sensor Hub, Point-of-Sale (POS) Terminal, Medical Patient Monitor Sub-system.
Industrial HMI Panel Controller
The ATSAMA5D26C-CU is a strong fit for industrial HMI panels thanks to its integrated 24-bit LCD controller supporting resolutions up to 1024x768 and its 500 MHz ARM Cortex-A5 core that runs embedded Linux graphics stacks such as Qt/EGLFS or LVGL. The on-chip display pipeline eliminates the need for an external graphics controller, reducing BOM cost and PCB area. Hardware acceleration for image scaling and color-space conversion offloads the CPU, allowing smooth UI animation even with high refresh rates. The 289-LFBGA package with 0.8 mm pitch enables compact panel designs; the -40C to +85C industrial temperature range supports factory-floor deployment. Connectivity to touch controllers via I2C and to industrial sensors via CAN-FD or UART is provided on-chip, simplifying HMI board design.
Empfohlen
Secure IoT Edge Gateway
The ATSAMA5D26C-CU excels in secure IoT edge gateways because of its integrated hardware AES/SHA/TRNG cryptographic accelerator and secure boot ROM that prevents unauthorized firmware execution. Dual Gigabit Ethernet MACs allow simultaneous WAN/LAN connectivity with line-rate throughput, while dual CAN-FD interfaces connect to industrial sensor buses for Modbus, BACnet, or CANopen aggregation. Embedded Linux with mainline kernel support simplifies deployment of MQTT, OPC-UA, and CoAP protocol stacks. Hardware tamper pins trigger secure erase of secrets on enclosure intrusion, satisfying common IoT security frameworks. The 5 µA backup-mode current keeps battery-backed gateways online during mains loss without draining storage cells.
Empfohlen
Building Automation Controller
The ATSAMA5D26C-CU is a natural fit for building automation controllers, where the Cortex-A5 runs Linux and orchestrates HVAC, lighting, access control, and energy-management subsystems over RS-485, BACnet, KNX, or Modbus. The high peripheral count - up to 11 UARTs, multiple SPI/I2C, and I2S - allows direct attachment of multiple field buses without external bridge ICs. The hardware crypto block secures OTA firmware updates, a critical requirement for connected building devices. The 1.2 V core plus 3.3 V I/O supply simplifies power tree design; a small buck converter and LDO combination suffices. The industrial temperature grade and long-life-cycle silicon make the SAMA5D2 family a staple for commercial building products designed for 10+ year field deployments.
Empfohlen
Edge-AI Vision Sensor Hub
The ATSAMA5D26C-CU's MIPI CSI-2 camera interface and 12-bit parallel ISI support direct attachment of image sensors in edge-AI vision sensor hubs for industrial inspection, smart retail, or access-control analytics. The Cortex-A5 core runs lightweight TensorFlow Lite or ONNX inference models for object detection and classification at modest frame rates. Dual Ethernet ports enable PoE-powered deployment with simultaneous analytics upload. Hardware crypto secures the inference results and prevents model tampering. The 289-LFBGA package suits compact vision modules where PCB real estate is constrained, and Linux support eases integration with cloud analytics platforms.
Empfohlen
Point-of-Sale (POS) Terminal
The ATSAMA5D26C-CU is well suited for POS terminals, where the 500 MHz Cortex-A5 runs Linux-based payment applications and the integrated peripherals drive touchscreen displays, thermal receipt printers, magnetic-stripe readers, and barcode scanners. The cryptographic accelerator secures PIN entry and transaction data, supporting PCI-PTS hardware requirements. Multiple UART/SPI channels connect to printer and scanner peripherals without glue logic. The compact 14x14 mm BGA package and industrial temperature grade fit the retail-environment operating envelope. Backup-mode current and RTC support real-time-clock functionality for transaction timestamping during power events.
Empfohlen
Medical Patient Monitor Sub-system
The ATSAMA5D26C-CU serves medical patient monitor sub-systems that require a long-life, low-power MPU for data aggregation, display, and connectivity. The 24-bit LCD controller drives bedside displays; the hardware crypto block secures patient health information (PHI) transmissions. Multiple UARTs connect to SpO2, ECG, NIBP, and temperature sensor modules. The Cortex-A5 core runs medical-grade embedded Linux with RT-Preempt patches for deterministic timing. The -40C to +85C range covers clinical and home-health environments. Hardware tamper pins plus secure boot align with IEC 62443 security requirements for connected medical systems.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAMA5D26C-CU – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAMA5D26C-CNR | ATSAMA5D26B-CU | ATSAMA5D26B-CNR | ATSAMA5D27C-CU | ATSAMA5D26A-CUR | ATSAMA5D26A-CN |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 289-LFBGA (14x14) | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same |
| Core | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz |
| Silicon Revision | C | C (same die, tape-and-reel) | B | B (tape-and-reel) | C (with GPU) | A | A |
| Graphics/GPU Acceleration | Basic LCD controller | Basic LCD controller | Basic LCD controller | Basic LCD controller | 2D GPU + LCD controller | Basic LCD controller | Basic LCD controller |
| Packaging Form | Tray | Tape & Reel | Tray | Tape & Reel | Tray | Tape & Reel | Tray |
| Internal SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Hardware Crypto | AES/SHA/TRNG | AES/SHA/TRNG | AES/SHA/TRNG | AES/SHA/TRNG | AES/SHA/TRNG | AES/SHA/TRNG | AES/SHA/TRNG |
Wichtigste Unterscheidungsmerkmale
- Lowest-cost secure Cortex-A5 MPU with hardware crypto in BGA (vs. ATSAMA5D28C-CU)
- Same family upgrade path adds 2D GPU without PCB rework (vs. ATSAMA5D27C-CU)
- Older silicon revisions still drop-in for supply-constrained situations (vs. ATSAMA5D26A-CN)
Designhinweise
The 289-LFBGA package uses a 0.8 mm ball pitch and requires a 4-6 layer PCB with microvia (laser-drilled) stack-up. Route signals on the top layer through the BGA escape pattern using dog-bone fanout with via-in-pad recommended for inner rows. Place 0.1 µF decoupling capacitors on every VDD/VBAT pin within 1-2 mm of the ball; group bulk 4.7-10 µF tantalum or ceramic capacitors near the package perimeter. Solid ground and power planes under the BGA reduce impedance and aid thermal dissipation - mandatory for 500 MHz operation.
The ATSAMA5D26C-CU requires a clean 1.2 V core supply capable of 800 mA peak current transients, plus 3.3 V for I/O and analog blocks. Use a low-noise LDO (e.g., Microchip MCP1725 or equivalent) followed by a buck converter to maximize efficiency. Place a 22 µF bulk capacitor near the VDDCORE pins and a ferrite bead between VDDCORE and VDDIO if noise coupling is observed. Power sequencing: VDDIO must come up before or simultaneously with VDDCORE; the device includes power-on-reset logic to manage this, but external sequencing ICs add robustness.
Estimated: at 500 MHz with DDR3L memory in continuous operation, the ATSAMA5D26C-CU dissipates approximately 0.5-0.8 W into the 14x14 mm BGA package. With typical theta_JA of 25-30 C/W on a 4-layer JEDEC test board, junction temperature rises 12-24 C above ambient. Industrial designs at +85 C ambient leave 15-25 C thermal margin to the 100 C Tj max. For sealed enclosures without airflow, consider a thermal pad or copper coin under the package die-expose pad (if accessible) to spread heat into an inner ground plane.
Do not assume all SAMA5D2 boot modes work identically across revisions: B and A revisions have minor errata around USB high-speed PHY and QSPI boot that are fixed in C. Always check the silicon revision errata document (DS80000567) before locking the boot configuration. The secure-boot fuse bits are one-time-programmable - a misconfiguration bricks the device. Use Microchip's sam-ba bootloader or JTAG/SWD for prototype bring-up before sealing fuses.
DDR3L/LPDDR3 memory routing requires length-matched byte lanes (within 25 mil/0.6 mm tolerance) and 100 ohm differential impedance for clock pairs. The SAMA5D2 Hardware Design Considerations application note (DS00003182) provides reference routing topologies and stack-up recommendations. Keep high-speed serial lanes (MIPI CSI-2, RGMII) away from switching power inductors; use ground guards on both sides of the differential pair. Place the 25 MHz main crystal within 5 mm of the XIN/XOUT pins with a guard ring to reduce jitter.
Compliance-Informationen
RoHS/REACH compliant per Microchip product declaration. Not AEC-Q100 qualified (consumer/industrial MPU, not automotive grade). Lead-free and halogen-free per SAMA5D2 family datasheet and Microchip materials declaration.
