ATSAMA5D27C-CU - ARM Cortex-A5 MPU 500MHz 289-LFBGA | Microchip
Teilenummer: ATSAMA5D27C-CU ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $14.95 | $1.495,00 |
| 500 | $13.4 | $6.700,00 |
| 1.000 | $11.9 | $11.900,00 |
ATSAMA5D27C-CU Übersicht
A microprocessor (MPU) is a CPU-centric system-on-chip designed to run a full operating system such as Linux or RTOS, in contrast to a microcontroller (MCU) which typically runs bare-metal or simple RTOS workloads without external memory. The SAMA5D2 family sits in the hierarchy ARM Cortex-A application processor -> microprocessor -> MPU -> system-on-chip -> semiconductor, targeting cost-sensitive embedded applications that need more compute than a Cortex-M MCU can deliver but do not require the complexity of a Cortex-A53/A72 design. The 'C' suffix denotes the 289-LFBGA package variant of the SAMA5D27 die.
Key features include an ARM Cortex-A5 core with 32 KB instruction cache and 32 KB data cache, NEON-style media processing engine, and 128 KB of on-chip SRAM configurable as L2 cache or system memory. The device supports external DDR2/DDR3L/LPDDR2/LPDDR3 memory via a 16-bit interface, plus QSPI, e.MMC, and NAND flash controllers. Backup mode current consumption is approximately 5 uA, enabling extensive battery life in always-on edge deployments.
Typical applications span industrial IoT gateways, building automation HMI panels, smart energy concentrators, point-of-sale terminals, and connected medical device controllers. The 0.8 mm ball pitch simplifies PCB layout compared to finer-pitch MPUs, and the integrated power management scheme reduces external component count.
Design consideration: ensure the DDR interface is routed with matched trace lengths (typically within 25 mil) and reference to a solid ground plane. The device supports boot from QSPI, e.MMC, NAND, SD card, or USB, and the boot configuration straps (BMS, JTAGSEL) must be pulled correctly at reset to select the desired boot source.
Drop-in-Alternativen für ATSAMA5D27C-CU – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAMA5D27C-CU (gleiche Bauform und Footprint) – abweichend in Package, Ethernet, USB, CAN, Backup Mode Current.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAMA5D27B-CU
✅ Drop-In✓ Auf Lager
$11.85 / Stück
Datenblatt ansehen →ATSAMA5D22C-CU
✅ Drop-In✓ Auf Lager
$7.14 / Stück
Datenblatt ansehen →ATSAMA5D26C-CU
✅ Drop-In✓ Auf Lager
$11.8 / Stück
Datenblatt ansehen →ATSAMA5D27C-D1G-CU
✅ Drop-In✓ Auf Lager
$19.1 / Stück
Datenblatt ansehen →ATSAMA5D28C-CU
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
STM32MP157FAC1
✅ Drop-In✓ Auf Lager
$28.9545 / Stück
Datenblatt ansehen →ATSAMA5D27C-CU Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-A5 |
| Core Count | 1 |
| Datenbusbreite | 32-bit |
| Maximale Taktfrequenz | 500 MHz |
| On-chip SRAM | 128 KB |
| Instruction Cache | 32 KB |
| Data Cache | 32 KB |
| External Memory Support | DDR2, DDR3L, LPDDR2, LPDDR3 (16-bit interface) |
| Floating Point Unit | Yes (VFPv4) |
| Gehäuse | 289-LFBGA (14x14 mm, 0.8 mm pitch) |
| Betriebstemperaturbereich | -40C to +85C (industrial) |
| Backup Mode Current | 5 uA typical |
| RoHS-Status | Compliant |
| Montageart | Surface Mount |
ATSAMA5D27C-CU 289-lfbga (14x14 mm, 0.8 mm pitch) Pinbelegungsleitfaden
Pinbelegung für ATSAMA5D27C-CU (289-lfbga (14x14 mm, 0.8 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für ATSAMA5D27C-CU.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
ATSAMA5D27C-CU ist geeignet für 7 Anwendungs: Industrial IoT Gateway, Building Automation HMI Panel, Smart Energy Concentrator, Point-of-Sale Terminal, Connected Medical Device Controller, Edge AI Vision Gateway, In-Vehicle Infotainment Sub-Display.
Industrial IoT Gateway
The ATSAMA5D27C-CU's 500 MHz Cortex-A5 core and full Linux support make it a strong fit for industrial IoT gateways that aggregate field-bus traffic from Modbus, CAN, and Ethernet devices and forward it to cloud brokers such as AWS IoT Core or Azure IoT Hub. The integrated dual CAN-FD controllers and 10/100 Ethernet MAC eliminate the need for external transceivers in many designs. Compared to a Cortex-M4 MCU, the SAMA5D27C-CU provides sufficient headroom to run TLS 1.3, MQTT-SN, and OPC UA stacks concurrently without timing bottlenecks.
Empfohlen
Building Automation HMI Panel
The integrated Peripheral Touch Controller enables direct connection of projected-capacitive touch sensors without an external touch IC, reducing BOM cost for building-automation HMI panels such as thermostats, lighting controllers, and access-control keypads. The embedded audio subsystem supports voice prompts and acoustic event detection when paired with an external PDM microphone. The 5 uA backup current allows the panel to maintain RTC and network presence during power-loss events without draining the backup supercapacitor.
Empfohlen
Smart Energy Concentrator
The ATSAMA5D27C-CU's Cortex-A5 core at 500 MHz and industrial -40C to +85C temperature rating make it suitable for smart-meter concentrators that aggregate DLMS/COSEM or IEC 62056 readings from hundreds of endpoints over wired M-Bus or wireless LoRa backhauls. The hardware floating-point unit accelerates FFT and encryption workloads, while the 16-bit DDR3L interface supports large data buffers for in-memory analytics. Backup mode at 5 uA extends battery life during grid outages.
Empfohlen
Point-of-Sale Terminal
The SAMA5D27C-CU powers point-of-sale (POS) terminals that run Linux with payment applications, EMV chip-card readers, NFC contactless interfaces, and thermal printers. The USB 2.0 High-Speed host port supports external peripherals such as barcode scanners and customer displays, while the integrated LCD controller drives TFT panels up to WXGA resolution. Hardware cryptography via the secure-boot engine protects PCI-PTS credentials.
Empfohlen
Connected Medical Device Controller
The ATSAMA5D27C-CU's industrial temperature range and long-term Microchip silicon supply program suit regulated medical-device controllers such as infusion pumps, patient monitors, and diagnostic analyzers that require multi-year production commitments. The hardware floating-point unit accelerates DSP algorithms for ECG and pulse-oximetry processing, while the LCD controller drives medical-grade touch displays. Linux with the linux4sam BSP simplifies FDA 510(k) software-validation documentation.
Empfohlen
Edge AI Vision Gateway
The Cortex-A5 core with NEON SIMD engine and hardware floating-point unit can run lightweight TensorFlow Lite Micro or ONNX Runtime inference for edge-AI vision gateways that classify defects on a manufacturing line or detect intruders in surveillance footage. The 16-bit external DDR3L interface supports multi-megapixel image buffers, and the dual CAN-FD ports enable industrial PLC integration. Trade-off versus dedicated NPU MPUs: lower inference throughput but significantly lower BOM cost and power.
Empfohlen
In-Vehicle Infotainment Sub-Display
Although not AEC-Q100 qualified, the ATSAMA5D27C-CU is used in non-safety in-vehicle infotainment sub-displays such as rear-seat entertainment, HVAC control panels, and instrument-cluster companions that operate from -40C to +85C. The integrated LCD controller with hardware overlay supports up to two independent display layers, while the I2S audio interface streams to external Class-D amplifiers. CAN-FD connectivity ties the display into the vehicle network.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAMA5D27C-CU – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAMA5D27B-CU | ATSAMA5D22C-CU | ATSAMA5D26C-CU | ATSAMA5D27C-D1G-CU |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) | 289-LFBGA (14x14 mm) - SiP with embedded DDR2 |
| Core | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz | ARM Cortex-A5 500 MHz |
| On-chip SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB + 1 Gbit DDR2 (SiP) |
| Peripheral Touch Controller | Yes | Yes | No | Yes | Yes |
| Embedded Audio Subsystem | Yes | Yes | No | Yes | Yes |
| External Memory Interface | 16-bit DDR2/DDR3L/LPDDR2/LPDDR3 | 16-bit DDR2/DDR3L/LPDDR2/LPDDR3 | 16-bit DDR2/DDR3L/LPDDR2/LPDDR3 | 16-bit DDR2/DDR3L/LPDDR2/LPDDR3 | DDR2 embedded in SiP |
| Backup Mode Current | 5 uA | 5 uA | 5 uA | 5 uA | 5 uA |
| Silicon Revision | C | B (earlier) | C | C | C |
Wichtigste Unterscheidungsmerkmale
- Full Linux support with mainline kernel and Yocto BSP (vs. ATSAMA5D22C-CU)
- Latest silicon revision with bug fixes and lower power (vs. ATSAMA5D27B-CU)
- 0.8 mm ball pitch simplifies PCB manufacturing (vs. STM32MP157)
Designhinweise
The 289-LFBGA package uses a 0.8 mm ball pitch, which is the minimum pitch most 4-layer PCB fabricators can reliably produce with ENIG finish. Use a 4-layer stackup with a continuous ground plane directly beneath the BGA, and route DDR traces on the top layer referenced to the second-layer ground. Matched trace lengths (target 25 mil tolerance for DDR3L) and 100-ohm differential impedance for USB 2.0 High-Speed pairs are mandatory; Microchip's SAMA5D2 hardware design checklist provides reference stackup and routing rules.
The SAMA5D27C-CU integrates a sophisticated power management scheme with multiple domains (VDDCORE, VDDPLL, VDDUTMIC, VDDBU, VDDANA), each requiring dedicated decoupling. Place 100 nF X7R 0402 capacitors within 2 mm of every supply ball, plus bulk 4.7 uF to 10 uF tantalum or ceramic capacitors at each rail's entry point. The VDDBU (backup) domain must remain powered during system shutdown to retain RTC and a few registers; a CR2032 or supercapacitor is typically used.
Boot configuration is controlled by the BMS (Boot Mode Select) and JTAGSEL pins sampled at reset - leaving these floating can cause unpredictable boot behavior. Pull-ups or pull-downs must be placed close to the MPU and the chosen configuration must match the boot memory device (QSPI, e.MMC, SD card, or NAND). Also note that the ATSAMA5D27C-CU is NOT AEC-Q100 qualified; for automotive designs requiring AEC-Q100, use the ATSAMA5D27C-CUR automotive variant or contact Microchip for the automotive-grade part number.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page. Industrial -40C to +85C temperature grade only; no AEC-Q100 qualification. For automotive applications, contact Microchip for the automotive-grade SAMA5D2 part number.