Microchip Technology

ATSAMA5D27C-CU - ARM Cortex-A5 MPU 500MHz 289-LFBGA | Microchip

부품 번호: ATSAMA5D27C-CU ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
5 uA typical Id 289-LFBGA (14x14 mm, 0.8 mm pitch) Package 500 MHz Speed DDR2, DDR3L, LPDDR2, LPDDR3 (16-bit interface) Memory
시작가 $11.9 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-20
볼륨 가격
수량 단가 합계
1 $18.5 $18.50
10 $16.8 $168.00
100 $14.95 $1,495.00
500 $13.4 $6,700.00
1,000 $11.9 $11,900.00
ℹ️ 모든 가격은 USD 기준입니다

ATSAMA5D27C-CU 개요

The Microchip ATSAMA5D27C-CU is a high-performance, low-power ARM Cortex-A5 microprocessor unit (MPU) running up to 500 MHz, housed in a 289-ball LFBGA package with 14x14 mm body and 0.8 mm ball pitch. The device integrates 128 KB of SRAM, a floating-point unit, and a rich peripheral set including a Peripheral Touch Controller, embedded audio subsystem, and multiple connectivity interfaces for industrial HMI and IoT gateway designs.

A microprocessor (MPU) is a CPU-centric system-on-chip designed to run a full operating system such as Linux or RTOS, in contrast to a microcontroller (MCU) which typically runs bare-metal or simple RTOS workloads without external memory. The SAMA5D2 family sits in the hierarchy ARM Cortex-A application processor -> microprocessor -> MPU -> system-on-chip -> semiconductor, targeting cost-sensitive embedded applications that need more compute than a Cortex-M MCU can deliver but do not require the complexity of a Cortex-A53/A72 design. The 'C' suffix denotes the 289-LFBGA package variant of the SAMA5D27 die.

Key features include an ARM Cortex-A5 core with 32 KB instruction cache and 32 KB data cache, NEON-style media processing engine, and 128 KB of on-chip SRAM configurable as L2 cache or system memory. The device supports external DDR2/DDR3L/LPDDR2/LPDDR3 memory via a 16-bit interface, plus QSPI, e.MMC, and NAND flash controllers. Backup mode current consumption is approximately 5 uA, enabling extensive battery life in always-on edge deployments.

Typical applications span industrial IoT gateways, building automation HMI panels, smart energy concentrators, point-of-sale terminals, and connected medical device controllers. The 0.8 mm ball pitch simplifies PCB layout compared to finer-pitch MPUs, and the integrated power management scheme reduces external component count.

Design consideration: ensure the DDR interface is routed with matched trace lengths (typically within 25 mil) and reference to a solid ground plane. The device supports boot from QSPI, e.MMC, NAND, SD card, or USB, and the boot configuration straps (BMS, JTAGSEL) must be pulled correctly at reset to select the desired boot source.

드롭인 대체품: ATSAMA5D27C-CU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMA5D27C-CU (동일 폼 팩터 및 풋프린트) — 차이점: Package, Ethernet, USB, CAN, Backup Mode Current.

Microchip Technology
Package: 196-TFBGA 11x11 mm, 0.8 mm pitch
Ethernet: 10/100/1000 Mbps with IEEE 1588 PTP
USB: USB HS Host + Device, USB FS Host + Device
비교 대상: ATSAMA5D27C-CU →
Microchip Technology
Package: 196-TFBGA (CSBGA) 11x11 mm
Ethernet: Dual 10/100 Mbps EMAC with 1588 PTP
USB: USB HSIC + USB Host/Device
비교 대상: ATSAMA5D27C-CU →
Microchip Technology
Package: 196-TFBGA (11x11 mm)
Ethernet: Dual 10/100 EMAC
USB: USB 2.0 High-Speed Host + Device
비교 대상: ATSAMA5D27C-CU →
Microchip Technology
Package: 289-LFBGA (14x14 mm, 0.8 mm ball pitch)
Backup Mode Current: ~5 µA (per SAMA5D2 family datasheet)
비교 대상: ATSAMA5D27C-CU →
Microchip Technology
Package: 289-LFBGA (14x14 mm)
Ethernet: Dual 10/100 MAC with IEEE 1588
USB: 2x USB 2.0 High-Speed with integrated PHY
비교 대상: ATSAMA5D27C-CU →
Microchip Technology
Ethernet: 10/100 MAC with IEEE 1588
CAN: 2 x CAN-FD
비교 대상: ATSAMA5D27C-CU →
Microchip Technology
Package: 289-LFBGA, 14x14 mm
Ethernet: 10/100 Mbps (1x EMAC) with IEEE 1588
USB: USB 2.0 + HSIC
비교 대상: ATSAMA5D27C-CU →
Microchip Technology
Package: 289-LFBGA (14x14 mm)
Backup Mode Current: approximately 5 uA
비교 대상: ATSAMA5D27C-CU →
Microchip Technology
Package: 289-LFBGA (14x14 mm)
Backup Mode Current: 5 uA (per datasheet)
비교 대상: ATSAMA5D27C-CU →
Microchip Technology
Ethernet: 1x Gigabit MAC + 1x 10/100 MAC (IEEE 1588 supported)
USB: USB 2.0 High-Speed Host and Device
CAN: Up to 2x CAN-FD controllers
비교 대상: ATSAMA5D27C-CU →
Microchip Technology
Package: 289-LFBGA (14 x 14 mm, 0.8 mm pitch)
Ethernet: 10/100 MAC with IEEE 1588 (EMAC)
USB: USB 2.0 HS Host + HS OTG + HS Device (3 ports)
비교 대상: ATSAMA5D27C-CU →
Microchip Technology
Package: 289-TFBGA (14x14 mm), 0.8 mm ball pitch
Ethernet: 10/100 Mbps (1x EMAC, external PHY)
USB: USB 2.0 High-Speed with HSIC
비교 대상: ATSAMA5D27C-CU →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

ATSAMA5D27B-CU

✅ 드롭인
Microchip Technology
📦 289-LFBGA (14x14)
ARM Cortex-A5 · 1 Core, 32-Bit · 500 MHz · SAMA5D2 · 289-LFBGA (14x14 mm) · 0.8 mm · DDR2, DDR3L, LPDDR1, LPDDR2, LPDDR3, QSPI, e.MMC · -40 C to +85 C (industrial)

✓ 재고 있음

$11.85 / 개

데이터시트 보기 →

ATSAMA5D22C-CU

✅ 드롭인
Microchip Technology
📦 289-LFBGA (14x14)
ARM Cortex-A5 (32-bit) · 1 · 500 MHz · Yes · 32 KB · 32 KB · 128 KB · DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC

✓ 재고 있음

$7.14 / 개

데이터시트 보기 →

ATSAMA5D26C-CU

✅ 드롭인
Microchip Technology
📦 289-LFBGA (14x14)
Microprocessor (MPU) · ARM Cortex-A5 (32-bit, single-core) · 500 MHz · 128 KB · 160 KB · 32 KB I-cache + 32 KB D-cache · DDR2 / DDR3L / LPDDR2 / LPDDR3, QSPI, e.MMC · 289-LFBGA (14x14 mm, 0.8 mm ball pitch)

✓ 재고 있음

$11.8 / 개

데이터시트 보기 →

ATSAMA5D27C-D1G-CU

✅ 드롭인
Microchip Technology
📦 289-LFBGA (14x14)
ARM Cortex-A5 (ARMv7-A) · 1 · 500 MHz · 32-bit · 1 Gbit DDR2 SDRAM (16-bit data bus) · 3.3 V I/O · 1.2 V · 289-TFBGA (14x14 mm), 0.8 mm ball pitch

✓ 재고 있음

$19.1 / 개

데이터시트 보기 →

ATSAMA5D28C-CU

✅ 드롭인 ⚠️ 사양 미검증
📦 289-LFBGA (14x14)
same SAMA5D2 family 289-LFBGA, 500 MHz Cortex-A5, additional crypto accelerators vs D27

📋 참조 대체품 (카탈로그에 없음)

STM32MP157FAC1

✅ 드롭인
STMicroelectronics
📦 TFBGA-361 (16x16)
ARM Cortex-A7 + Cortex-M4 · 2 Core, 32-Bit · 800 MHz (Cortex-A7), 209 MHz (Cortex-M4) · 361-TFBGA (12x12 mm) · -20°C to +105°C · 1.71 V · 3.6 V · 2x 10/100/1000 Mbps (RGMII)

✓ 재고 있음

$28.9545 / 개

데이터시트 보기 →

ATSAMA5D27C-CU 최대 정격 & 전기적 특성

Core Architecture ARM Cortex-A5
Core Count 1
데이터 버스 폭 32-bit
최대 클록 주파수 500 MHz
On-chip SRAM 128 KB
Instruction Cache 32 KB
Data Cache 32 KB
External Memory Support DDR2, DDR3L, LPDDR2, LPDDR3 (16-bit interface)
Floating Point Unit Yes (VFPv4)
패키지 289-LFBGA (14x14 mm, 0.8 mm pitch)
동작 온도 범위 -40C to +85C (industrial)
Backup Mode Current 5 uA typical
RoHS 상태 Compliant
실장 유형 Surface Mount

ATSAMA5D27C-CU 289-lfbga (14x14 mm, 0.8 mm pitch) 핀 구성 가이드

ATSAMA5D27C-CU(289-lfbga (14x14 mm, 0.8 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

ATSAMA5D27C-CU의 289-lfbga (14x14 mm, 0.8 mm pitch) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: ATSAMA5D27C-CU.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

ATSAMA5D27C-CU 적합 용도: 7 애플리케이션s: Industrial IoT Gateway, Building Automation HMI Panel, Smart Energy Concentrator, Point-of-Sale Terminal, Connected Medical Device Controller, Edge AI Vision Gateway, In-Vehicle Infotainment Sub-Display.

🏭

Industrial IoT Gateway

The ATSAMA5D27C-CU's 500 MHz Cortex-A5 core and full Linux support make it a strong fit for industrial IoT gateways that aggregate field-bus traffic from Modbus, CAN, and Ethernet devices and forward it to cloud brokers such as AWS IoT Core or Azure IoT Hub. The integrated dual CAN-FD controllers and 10/100 Ethernet MAC eliminate the need for external transceivers in many designs. Compared to a Cortex-M4 MCU, the SAMA5D27C-CU provides sufficient headroom to run TLS 1.3, MQTT-SN, and OPC UA stacks concurrently without timing bottlenecks.

🧩

Building Automation HMI Panel

The integrated Peripheral Touch Controller enables direct connection of projected-capacitive touch sensors without an external touch IC, reducing BOM cost for building-automation HMI panels such as thermostats, lighting controllers, and access-control keypads. The embedded audio subsystem supports voice prompts and acoustic event detection when paired with an external PDM microphone. The 5 uA backup current allows the panel to maintain RTC and network presence during power-loss events without draining the backup supercapacitor.

⚡

Smart Energy Concentrator

The ATSAMA5D27C-CU's Cortex-A5 core at 500 MHz and industrial -40C to +85C temperature rating make it suitable for smart-meter concentrators that aggregate DLMS/COSEM or IEC 62056 readings from hundreds of endpoints over wired M-Bus or wireless LoRa backhauls. The hardware floating-point unit accelerates FFT and encryption workloads, while the 16-bit DDR3L interface supports large data buffers for in-memory analytics. Backup mode at 5 uA extends battery life during grid outages.

💳

Point-of-Sale Terminal

The SAMA5D27C-CU powers point-of-sale (POS) terminals that run Linux with payment applications, EMV chip-card readers, NFC contactless interfaces, and thermal printers. The USB 2.0 High-Speed host port supports external peripherals such as barcode scanners and customer displays, while the integrated LCD controller drives TFT panels up to WXGA resolution. Hardware cryptography via the secure-boot engine protects PCI-PTS credentials.

💊

Connected Medical Device Controller

The ATSAMA5D27C-CU's industrial temperature range and long-term Microchip silicon supply program suit regulated medical-device controllers such as infusion pumps, patient monitors, and diagnostic analyzers that require multi-year production commitments. The hardware floating-point unit accelerates DSP algorithms for ECG and pulse-oximetry processing, while the LCD controller drives medical-grade touch displays. Linux with the linux4sam BSP simplifies FDA 510(k) software-validation documentation.

🎥

Edge AI Vision Gateway

The Cortex-A5 core with NEON SIMD engine and hardware floating-point unit can run lightweight TensorFlow Lite Micro or ONNX Runtime inference for edge-AI vision gateways that classify defects on a manufacturing line or detect intruders in surveillance footage. The 16-bit external DDR3L interface supports multi-megapixel image buffers, and the dual CAN-FD ports enable industrial PLC integration. Trade-off versus dedicated NPU MPUs: lower inference throughput but significantly lower BOM cost and power.

🚗

In-Vehicle Infotainment Sub-Display

Although not AEC-Q100 qualified, the ATSAMA5D27C-CU is used in non-safety in-vehicle infotainment sub-displays such as rear-seat entertainment, HVAC control panels, and instrument-cluster companions that operate from -40C to +85C. The integrated LCD controller with hardware overlay supports up to two independent display layers, while the I2S audio interface streams to external Class-D amplifiers. CAN-FD connectivity ties the display into the vehicle network.

추천 제품 요약

ATSAMA5D27C-D1G-CU Microchip Technology 사용처: Industrial IoT Gateway, Point-of-Sale Terminal KSZ8081RNA 10/100 Ethernet PHY for industrial connectivity 사용처: Industrial IoT Gateway ATSAMA5D27B-CU Microchip Technology 사용처: Building Automation HMI Panel, Connected Medical Device Controller PIC32MX Companion MCU for low-power sensor polling 사용처: Building Automation HMI Panel ATSAMA5D26C-CU Microchip Technology 사용처: Smart Energy Concentrator ATECC608B Crypto authentication and secure boot key storage 사용처: Smart Energy Concentrator SAM V71 Companion Cortex-M7 MCU for real-time printer control 사용처: Point-of-Sale Terminal MCP2518FD External CAN-FD controller for medical-device networking 사용처: Connected Medical Device Controller ATSAMA5D28C-CU Higher-integration variant with crypto accelerators 사용처: Edge AI Vision Gateway MT9V032 External image sensor for machine-vision input 사용처: Edge AI Vision Gateway ATSAMA5D22C-CU Microchip Technology 사용처: In-Vehicle Infotainment Sub-Display TJA1044 High-speed CAN-FD transceiver 사용처: In-Vehicle Infotainment Sub-Display
What is the maximum CPU clock frequency of the ATSAMA5D27C-CU?
The ATSAMA5D27C-CU runs the ARM Cortex-A5 core at up to 500 MHz, per the Microchip SAMA5D2 series datasheet. This speed, combined with the 32 KB instruction cache, 32 KB data cache, and hardware floating-point unit, makes the part suitable for running embedded Linux distributions such as buildroot, Yocto, or OpenWrt with responsive UI performance on industrial HMI panels.
Where can I buy the ATSAMA5D27C-CU and what is the lead time?
The ATSAMA5D27C-CU is currently in stock at major authorized distributors including DigiKey and Mouser, with a typical lead time of 6-10 weeks for factory-direct orders as of 2026-09-21. Unit pricing starts around 18.50 USD at qty-1 and drops to approximately 11.90 USD at qty-1000; volume quotations can be obtained directly from Microchip's franchised distributors for OEM contracts.
What is the price of the ATSAMA5D27C-CU?
Pricing for the ATSAMA5D27C-CU as of 2026-09-21 is approximately 18.50 USD at qty-1, 16.80 USD at qty-10, 14.95 USD at qty-100, 13.40 USD at qty-500, and 11.90 USD at qty-1000. Prices vary slightly between distributors; DigiKey and Mouser list the part as actively stocked and accept online orders with same-day shipment for small quantities.
How does the ATSAMA5D27C-CU differ from the ATSAMA5D22C-CU?
The ATSAMA5D27C-CU and ATSAMA5D22C-CU share the same ARM Cortex-A5 core at 500 MHz and the same 289-LFBGA package, but the 'D27' variant integrates a richer peripheral set including the Peripheral Touch Controller and embedded audio subsystem, while the 'D22' variant targets cost-sensitive applications with reduced peripheral integration. Both are pin-compatible within the SAMA5D2 family, enabling drop-in PCB reuse when peripheral requirements change.
When should I choose the ATSAMA5D27C-CU over the ATSAMA5D27B-CU?
Choose the ATSAMA5D27C-CU for new designs because the 'C' silicon revision typically incorporates bug fixes, lower power consumption, and improved peripheral stability compared to the earlier 'B' revision. The ATSAMA5D27B-CU remains suitable for legacy designs already in production but is generally not recommended for new starts since Microchip's long-term silicon roadmap focuses on the 'C' and later revisions.
What is the best drop-in replacement for the ATSAMA5D27C-CU?
The best drop-in replacement is the ATSAMA5D27B-CU from the same SAMA5D2 family, sharing the identical 289-LFBGA 14x14 mm footprint and pinout. The 'B' variant offers the same Cortex-A5 core at 500 MHz and the same peripheral set but on an earlier silicon revision; this is a true pin-to-pin drop-in alternative per the Microchip SAMA5D2 datasheet family compatibility notes.
Can I download the ATSAMA5D27C-CU datasheet PDF?
Yes, the official ATSAMA5D27C-CU datasheet PDF is available directly from Microchip Technology's product page at the URL listed on this page. The document covers electrical characteristics, pin assignments, package dimensions, boot configuration, peripheral descriptions, and recommended PCB layout guidelines for the 0.8 mm ball pitch LFBGA package.
Where can I find the ATSAMA5D27C-CU pinout for the 289-LFBGA package?
The pinout for the 289-LFBGA package is documented in the official SAMA5D2 series datasheet, with the ball map organized as a 17x17 grid (with 289 active balls) on the 14x14 mm body with 0.8 mm pitch. Microchip also provides BSDL files and a dedicated SAMA5D2 pinout spreadsheet on the product support page, which engineers can import into PCB CAD tools for schematic capture and footprint verification.
Does the ATSAMA5D27C-CU support embedded Linux?
Yes, the ATSAMA5D27C-CU is fully supported by mainline Linux with the AT91/DT kernel tree, and Microchip provides a maintained linux4sam distribution based on the Yocto build system. The 500 MHz Cortex-A5 core, 128 KB on-chip SRAM, and external DDR2/DDR3L memory interface provide ample resources for graphical UIs using Qt, LVGL, or Weston/Wayland compositors in industrial and IoT applications.
What is the backup mode current consumption of the ATSAMA5D27C-CU?
The ATSAMA5D27C-CU consumes approximately 5 uA in backup mode (battery domain active, main core domain off), per the Microchip SAMA5D2 datasheet. This ultra-low retention current makes the part suitable for battery-backed edge devices such as smart meters, IoT sensors with wake-on-LAN, and industrial data loggers that must maintain RTC and a few GPIOs while drawing minimal standby power.
Is the ATSAMA5D27C-CU suitable for industrial IoT gateway designs?
Yes, the ATSAMA5D27C-CU is purpose-built for industrial IoT gateways, offering a 500 MHz Cortex-A5 core capable of running Linux with protocol stacks such as MQTT, CoAP, or OPC UA, plus integrated Ethernet MAC, dual CAN-FD controllers, and USB 2.0 High-Speed. The industrial -40C to +85C operating temperature range and 5 uA backup current enable fanless enclosure designs with battery-backed RTC for metering and remote-monitoring deployments.
What external memory types does the ATSAMA5D27C-CU support?
The ATSAMA5D27C-CU supports DDR2, DDR3L, LPDDR2, and LPDDR3 memory via a 16-bit external bus interface, plus NAND flash, QSPI NOR flash, e.MMC, and SD card through dedicated controllers. This flexibility lets designers optimize the BOM for cost (DDR3L in high-volume consumer) versus power (LPDDR2/LPDDR3 in battery-powered edge devices) without changing the MPU.
What is the difference between the ATSAMA5D27C-CU and the ATSAMA5D27C-D1G-CU?
The ATSAMA5D27C-CU is the standalone MPU in a 289-LFBGA package, while the ATSAMA5D27C-D1G-CU is a System-in-Package (SiP) that embeds the same die plus 1 Gbit (128 MB) of DDR2 SDRAM into a single package, simplifying PCB layout and BOM. The standalone MPU requires an external DDR chip on the board, whereas the SiP integrates it for faster time-to-market and reduced EMI risk.
What are the key specifications of the ATSAMA5D27C-CU that engineers should know?
The ATSAMA5D27C-CU key specifications are: ARM Cortex-A5 single-core at 500 MHz, 32 KB instruction + 32 KB data cache, 128 KB on-chip SRAM, 16-bit external DDR2/DDR3L/LPDDR2/LPDDR3 interface, 289-LFBGA 14x14 mm 0.8 mm pitch package, industrial -40C to +85C temperature range, and 5 uA backup current. Integrated peripherals include Ethernet MAC, dual CAN-FD, USB 2.0 HS, QSPI, e.MMC, NAND, and a Peripheral Touch Controller for capacitive touch HMI.

엔지니어링 참조 데이터: ATSAMA5D27C-CU — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the ATSAMA5D27C-CU when designing a Linux-based industrial IoT gateway, HMI panel, or smart-meter concentrator that needs capacitive touch and audio support on a single MPU, with PCB fabrication staying within standard 0.8 mm-pitch BGA capability. Select the ATSAMA5D27B-CU only when matching legacy 'B'-silicon boards in existing production. Select the ATSAMA5D22C-CU for cost-sensitive designs that omit touch and audio peripherals. Select the ATSAMA5D27C-D1G-CU when PCB area is tight and the BOM savings of integrating the DDR2 outweigh the slightly higher unit cost. For applications requiring Cortex-A7 or higher performance, evaluate the Microchip SAMA7G54 or NXP i.MX 6ULL/7D families, accepting that these are not pin-compatible with the SAMA5D2 289-LFBGA footprint.

대체품과의 비교

파라미터 이 제품 ATSAMA5D27B-CU ATSAMA5D22C-CU ATSAMA5D26C-CU ATSAMA5D27C-D1G-CU
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 289-LFBGA (14x14 mm) 289-LFBGA (14x14 mm) 289-LFBGA (14x14 mm) 289-LFBGA (14x14 mm) 289-LFBGA (14x14 mm) - SiP with embedded DDR2
Core ARM Cortex-A5 500 MHz ARM Cortex-A5 500 MHz ARM Cortex-A5 500 MHz ARM Cortex-A5 500 MHz ARM Cortex-A5 500 MHz
On-chip SRAM 128 KB 128 KB 128 KB 128 KB 128 KB + 1 Gbit DDR2 (SiP)
Peripheral Touch Controller Yes Yes No Yes Yes
Embedded Audio Subsystem Yes Yes No Yes Yes
External Memory Interface 16-bit DDR2/DDR3L/LPDDR2/LPDDR3 16-bit DDR2/DDR3L/LPDDR2/LPDDR3 16-bit DDR2/DDR3L/LPDDR2/LPDDR3 16-bit DDR2/DDR3L/LPDDR2/LPDDR3 DDR2 embedded in SiP
Backup Mode Current 5 uA 5 uA 5 uA 5 uA 5 uA
Silicon Revision C B (earlier) C C C

주요 차별점

  • Full Linux support with mainline kernel and Yocto BSP (vs ATSAMA5D22C-CU)
  • Latest silicon revision with bug fixes and lower power (vs ATSAMA5D27B-CU)
  • 0.8 mm ball pitch simplifies PCB manufacturing (vs STM32MP157)

설계 노트

The 289-LFBGA package uses a 0.8 mm ball pitch, which is the minimum pitch most 4-layer PCB fabricators can reliably produce with ENIG finish. Use a 4-layer stackup with a continuous ground plane directly beneath the BGA, and route DDR traces on the top layer referenced to the second-layer ground. Matched trace lengths (target 25 mil tolerance for DDR3L) and 100-ohm differential impedance for USB 2.0 High-Speed pairs are mandatory; Microchip's SAMA5D2 hardware design checklist provides reference stackup and routing rules.

The SAMA5D27C-CU integrates a sophisticated power management scheme with multiple domains (VDDCORE, VDDPLL, VDDUTMIC, VDDBU, VDDANA), each requiring dedicated decoupling. Place 100 nF X7R 0402 capacitors within 2 mm of every supply ball, plus bulk 4.7 uF to 10 uF tantalum or ceramic capacitors at each rail's entry point. The VDDBU (backup) domain must remain powered during system shutdown to retain RTC and a few registers; a CR2032 or supercapacitor is typically used.

Boot configuration is controlled by the BMS (Boot Mode Select) and JTAGSEL pins sampled at reset - leaving these floating can cause unpredictable boot behavior. Pull-ups or pull-downs must be placed close to the MPU and the chosen configuration must match the boot memory device (QSPI, e.MMC, SD card, or NAND). Also note that the ATSAMA5D27C-CU is NOT AEC-Q100 qualified; for automotive designs requiring AEC-Q100, use the ATSAMA5D27C-CUR automotive variant or contact Microchip for the automotive-grade part number.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
무연
Yes
무할로겐
Yes
분쟁 광물
Compliant

RoHS and REACH compliant per Microchip product page. Industrial -40C to +85C temperature grade only; no AEC-Q100 qualification. For automotive applications, contact Microchip for the automotive-grade SAMA5D2 part number.

데이터 검증일: 2026-09-21 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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