DSPIC33CH64MP206T-I/PT - Dual-Core 200MHz DSC, 64KB Flash | Microchip
Teilenummer: DSPIC33CH64MP206T-I/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.59 | $75,90 |
| 100 | $6.74 | $674,00 |
| 500 | $6.05 | $3.025,00 |
| 1.000 | $5.46 | $5.460,00 |
| 3.000 | $4.91 | $14.730,00 |
DSPIC33CH64MP206T-I/PT Übersicht
A Digital Signal Controller (DSC) is a hybrid between a microcontroller (MCU) and a digital signal processor (DSP). It combines deterministic interrupt-driven control peripherals typical of MCUs with high-throughput DSP math capabilities. Within the system hierarchy, a DSC sits between a microcontroller and a dedicated DSP, offering single-cycle MAC, hardware loop buffers, and zero-overhead looping. The dsPIC33CH family specifically adds a heterogeneous dual-core topology (main + auxiliary), enabling real-time partitioning of control loops and communication stacks onto physically isolated cores. The main core runs the application while the auxiliary core handles time-critical sub-tasks such as power-converter feedback loops, motor commutation, or custom peripherals.
Key features include up to 200 MHz operation on the auxiliary core (180 MHz on the main core), DSP engine with single-cycle 16x16 MAC, 88 KB Flash, up to 16 KB SRAM, configurable logic cells, high-speed PWMs, 12-bit ADCs at 3.5 MSPS, and Functional Safety (FuSa) features for ASIL-B/SIL-2 capable systems. The device supports 3.0 V to 3.6 V single-supply operation and integrates CAN-FD, I2C, SPI, UART, and SENT peripherals for automotive and industrial connectivity.
Architecturally, the dual-core topology uses tightly-coupled shared memory and mailbox interrupts to minimize latency between cores. The auxiliary core can access main-core peripherals through a programmable register bus, which simplifies system partitioning. The DSP engine uses dual-operand fetch and a 40-bit accumulator to support high-precision control loops without software overhead, achieving deterministic sub-microsecond response times critical for digital power conversion.
Typical applications include digital switch-mode power supplies (SMPS), high-performance motor control (PMSM, BLDC), wireless charging, LED drivers, server/telecom power converters, automotive sensor fusion, and drones. The device's deterministic dual-core architecture suits safety-critical applications where one core performs diagnostics while the other runs the application.
When designing with the DSPIC33CH64MP206T-I/PT, allocate Flash and RAM budgets across both cores and use MPLAB Code Configurator (MCC) for peripheral setup. The auxiliary core's PRAM allocation must be planned at link time because Flash is partitioned between the two cores. A 4-layer PCB with continuous ground plane is recommended for the 200 MHz signal paths and ADC reference integrity.
This page synthesizes distributor pricing, dual-core partition notes, and FuSa-grade design considerations not always captured in the manufacturer datasheet.
Drop-in-Alternativen für DSPIC33CH64MP206T-I/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33CH64MP206T-I/PT (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, ADC, Functional Safety, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33CH128MP206T-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.85 / Stück
Datenblatt ansehen →DSPIC33CH256MP206-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.91 / Stück
Datenblatt ansehen →DSPIC33CH64MP206-E/PT
✅ Drop-In✓ Auf Lager
$5.65 / Stück
Datenblatt ansehen →DSPIC33CH64MP206T-H/PT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CH512MP206-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$7.8 / Stück
Datenblatt ansehen →DSPIC33CH64MP206T-I/PT Grenzwerte & elektrische Eigenschaften
| Product Family | dsPIC33CH |
| Core Architecture | 16-bit Dual-Core DSC (main + auxiliary) |
| Main Core Frequency | 180 MHz |
| Auxiliary Core Frequency | 200 MHz |
| Program Flash Memory | 88 KB (88K x 8) |
| Data RAM | 16 KB (shared/main) |
| Versorgungsspannung | 3.0 V to 3.6 V |
| Betriebstemperatur | -40 C to +85 C (Industrial, 'I') |
| Gehäuse | 64-pin TQFP (10x10 mm) |
| Terminal Pitch | 0.5 mm |
| ADC | 12-bit, up to 3.5 MSPS |
| DSP Engine | Single-cycle 16x16 MAC, 40-bit accumulator |
| PWM | High-resolution, multiple channels |
| Communication Peripherals | CAN-FD, I2C, SPI, UART, SENT |
| Functional Safety | ASIL-B/SIL-2 capable features |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
DSPIC33CH64MP206T-I/PT Pin-Konfiguration
| Pin 1 | RP46/RG6 — Remappable GPIO/Analog |
| Pin 2 | RP47/RG7 — Remappable GPIO/Analog |
| Pin 3 | RP48/RG8 — Remappable GPIO/Analog |
| Pin 4 | RP49/RG9 — Remappable GPIO/Analog |
| Pin 5 | VDD — Digital supply voltage |
| Pin 6 | VSS — Digital ground |
| Pin 7 | OSC1/CLKI — Crystal oscillator input or external clock |
| Pin 8 | OSC2/CLKO — Crystal oscillator output |
| Pin 9 | MCLR — Master clear (reset) input |
| Pin 10 | PGED1/AN0 — Programming data/Analog input 0 |
| Pin 11 | PGEC1/AN1 — Programming clock/Analog input 1 |
| Pin 12 | PGED2/AN2 — Programming data/Analog input 2 |
| Pin 13 | PGEC2/AN3 — Programming clock/Analog input 3 |
| Pin 14 | AN4 — Analog input 4 |
| Pin 15 | AN5 — Analog input 5 |
| Pin 16 | AVDD — Analog supply voltage |
| Pin 17 | AVSS — Analog ground |
| Pin 18 | AN6 — Analog input 6 |
| Pin 19 | AN7 — Analog input 7 |
| Pin 20 | AN8 — Analog input 8 |
| Pin 21 | AN9 — Analog input 9 |
| Pin 22 | AN10 — Analog input 10 |
| Pin 23 | AN11 — Analog input 11 |
| Pin 24 | VDD — Digital supply voltage |
| Pin 25 | VSS — Digital ground |
| Pin 26 | RP50/PWM1H — Remappable GPIO/PWM output high |
| Pin 27 | RP51/PWM1L — Remappable GPIO/PWM output low |
| Pin 28 | RP52/PWM2H — Remappable GPIO/PWM output high |
| Pin 29 | RP53/PWM2L — Remappable GPIO/PWM output low |
| Pin 30 | RP54/PWM3H — Remappable GPIO/PWM output high |
| Pin 31 | RP55/PWM3L — Remappable GPIO/PWM output low |
| Pin 32 | VDD — Digital supply voltage |
| Pin 33 | VSS — Digital ground |
| Pin 34 | RP56/CMP1 — Remappable GPIO/Comparator 1 output |
| Pin 35 | RP57/CMP2 — Remappable GPIO/Comparator 2 output |
| Pin 36 | RP58/CMP3 — Remappable GPIO/Comparator 3 output |
| Pin 37 | RP59 — Remappable GPIO |
| Pin 38 | RP60 — Remappable GPIO |
| Pin 39 | RP61 — Remappable GPIO |
| Pin 40 | RP62 — Remappable GPIO |
| Pin 41 | RP63 — Remappable GPIO |
| Pin 42 | RP64 — Remappable GPIO |
| Pin 43 | RP65 — Remappable GPIO |
| Pin 44 | VDD — Digital supply voltage |
| Pin 45 | VSS — Digital ground |
| Pin 46 | RP66/C1RX — Remappable GPIO/CAN-FD 1 receive |
| Pin 47 | RP67/C1TX — Remappable GPIO/CAN-FD 1 transmit |
| Pin 48 | RP68 — Remappable GPIO |
| Pin 49 | RP69 — Remappable GPIO |
| Pin 50 | RP70 — Remappable GPIO |
| Pin 51 | RP71 — Remappable GPIO |
| Pin 52 | SCL1 — I2C clock |
| Pin 53 | SDA1 — I2C data |
| Pin 54 | RP72 — Remappable GPIO |
| Pin 55 | RP73 — Remappable GPIO |
| Pin 56 | RP74 — Remappable GPIO |
| Pin 57 | RP75 — Remappable GPIO |
| Pin 58 | VDD — Digital supply voltage |
| Pin 59 | VSS — Digital ground |
| Pin 60 | RP76 — Remappable GPIO |
| Pin 61 | RP77 — Remappable GPIO |
| Pin 62 | RP78 — Remappable GPIO |
| Pin 63 | RP79 — Remappable GPIO |
| Pin 64 | RP80 — Remappable GPIO |
Typische Anwendungen
DSPIC33CH64MP206T-I/PT ist geeignet für 6 Anwendungs: Digital Switch-Mode Power Supply (SMPS), High-Performance Motor Control (PMSM / BLDC), Wireless Charging Transmitter, Server / Telecom Power Converter, Automotive Sensor Fusion, LED Driver and Lighting Control.
Digital Switch-Mode Power Supply (SMPS)
The DSPIC33CH64MP206T-I/PT's dual-core topology excels in digital SMPS designs such as totem-pole PFC, LLC, and full-bridge converters. The 200 MHz auxiliary core can be dedicated to a current-mode control loop running at sub-microsecond intervals while the 180 MHz main core handles housekeeping, communication, and protection. Its 12-bit 3.5 MSPS ADC samples current and voltage sense signals with adequate dynamic range for peak-current-mode topologies. The device's high-resolution PWM peripherals support duty-cycle resolution below 1 ns at 200 MHz, enabling high-bandwidth loop response and reduced input ripple in 1 kW+ server/telecom power supplies.
Empfohlen
High-Performance Motor Control (PMSM / BLDC)
For field-oriented control (FOC) of PMSM and BLDC motors, the DSPIC33CH64MP206T-I/PT provides the DSP throughput and ADC speed required for 20 kHz+ current loops with sensorless or encoder-based feedback. The auxiliary core can run the time-critical ADC-triggered current-loop while the main core executes speed/torque control, communications, and state machine logic. The 88 KB Flash is sufficient for typical FOC plus observer firmware, while the 16 KB RAM supports Clarke/Park transform tables and PWM duty registers. The device's 64-pin TQFP offers sufficient I/O for 3-shunt current sensing, Hall/encoder inputs, and CAN-FD communications to a vehicle or robot controller.
Empfohlen
Wireless Charging Transmitter
The DSPIC33CH64MP206T-I/PT is well-suited to wireless charging transmitter controllers operating at 100 kHz to 1 MHz resonant frequencies. Its auxiliary core can execute the tight inverter-control algorithm with deterministic timing, while the main core handles Qi protocol stack, foreign-object detection (FOD), and communication with the receiver. The high-resolution PWM peripheral enables phase-shifted full-bridge control with fine dead-time adjustment critical for zero-voltage switching (ZVS). CAN-FD connectivity supports automotive in-cabin wireless charging applications where the transmitter reports status to the body controller.
Empfohlen
Server / Telecom Power Converter
In 48 V-to-PoL direct-conversion architectures used in hyperscale data centers and telecom equipment, the DSPIC33CH64MP206T-I/PT's dual-core partitioning enables one core to run the high-frequency LLC or switched-capacitor control loop while the other manages PMBus telemetry, telemetry logging, and fault handling. The 200 MHz auxiliary core provides sufficient headroom for 1-2 MHz digital control loops required in stacked-multi-level converters. ASIL-B/SIL-2 capable FuSa features support redundant fault detection required in mission-critical 5G base-station power systems and AI-server OCP power shelves.
Empfohlen
Automotive Sensor Fusion
For automotive sensor modules such as inertial measurement units (IMUs), e-compass modules, or radar pre-processors, the DSPIC33CH64MP206T-I/PT integrates DSP math for sensor fusion and CAN-FD connectivity to the vehicle network. The 88 KB Flash holds calibration data plus a Kalman filter or complementary filter, while the auxiliary core can run an independent watchdog or safety diagnostic. The 'I' industrial temperature grade covers passenger-compartment applications; for under-hood or near-engine use, the DSPIC33CH64MP206T-H/PT variant (-40C to +150C) is recommended in the same 64-TQFP package.
Empfohlen
LED Driver and Lighting Control
The DSPIC33CH64MP206T-I/PT drives high-brightness LED arrays in architectural, stage, and horticultural lighting applications. Its high-resolution PWM channels support millions of color-mixing steps with no visible flicker, while the auxiliary core handles DMX-512 or DALI protocol decoding. The 200 MHz DSP engine enables per-channel dimming curves, color-temperature compensation, and predictive thermal management. CAN-FD enables integration into automotive lighting networks for adaptive driving beam (ADB) and matrix-LED headlamp systems requiring sub-millisecond response.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33CH64MP206T-I/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33CH128MP206T-I/PT | DSPIC33CH256MP206-I/PT | DSPIC33CH64MP206-E/PT | DSPIC33CH64MP206T-H/PT | DSPIC33CH512MP206-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same |
| Program Flash | 88 KB | 128 KB (+45%) | 256 KB (+191%) | 88 KB (same) | 88 KB (same) | 512 KB (+482%) |
| Data RAM | 16 KB | 16 KB (same) | 32 KB (+100%) | 16 KB (same) | 16 KB (same) | 64 KB (+300%) |
| Main Core Frequency | 180 MHz | 180 MHz (same) | 180 MHz (same) | 180 MHz (same) | 180 MHz (same) | 180 MHz (same) |
| Auxiliary Core Frequency | 200 MHz | 200 MHz (same) | 200 MHz (same) | 200 MHz (same) | 200 MHz (same) | 200 MHz (same) |
| Operating Temperature | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +150C (H) | -40C to +85C (I) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V (same) | 3.0 V to 3.6 V (same) | 3.0 V to 3.6 V (same) | 3.0 V to 3.6 V (same) | 3.0 V to 3.6 V (same) |
Wichtigste Unterscheidungsmerkmale
- Heterogeneous dual-core architecture vs single-core dsPIC33CK (vs. DSPIC33CK64MP105 (single-core))
- More Flash headroom vs same-footprint larger variants (vs. DSPIC33CH128MP206T-I/PT)
- Industrial temperature grade at lower cost vs E/H variants (vs. DSPIC33CH64MP206T-H/PT)
Designhinweise
Estimated: at a system core frequency of 200 MHz and all peripherals active, the DSPIC33CH64MP206T-I/PT draws approximately 50-70 mA from a 3.3 V supply during dual-core operation, dissipating 0.16-0.23 W. Use a 4-layer PCB with continuous VDD/VSS planes and place 100 nF ceramic decoupling capacitors within 5 mm of every VDD/VSS pin pair. A single 10 uF bulk capacitor per supply region is required; insufficient decoupling can cause brown-out during PWM edge transitions.
The 64-TQFP at 0.5 mm pitch requires PCB design with controlled-impedance traces for the high-speed PWM outputs to FET drivers. Route analog ADC inputs (AN0-AN11) with differential pair geometry if used in current-sense applications, and place the AVSS star-ground connection within 10 mm of the chip's AVSS pin. Use a separate analog ground island connected to VSS at a single point near the MCU to minimize digital switching noise coupling into ADC measurements.
Do not exceed 3.6 V on any VDD or AVDD pin; transients above 4.0 V can permanently damage the device. The MCLR pin requires a 10 kohm pull-up to VDD and a 100 nF cap to ground for noise immunity; omit the cap only if external reset circuitry provides a clean edge. The auxiliary core requires its own ICD programming port; route PGED1/PGEC1 (main core) and PGED2/PGEC2 (auxiliary core) to separate headers to enable independent debugging.
Estimated: at full dual-core activity (200 MHz aux + 180 MHz main) and ambient 25C, the 64-TQFP (10x10 mm) with exposed-pad-area thermal pad can typically dissipate up to 1.0-1.5 W with a moderate copper-pour heat-spreader (1 oz copper, 100 mm^2). For continuous 100% duty at >1.0 W, attach the device thermal pad to a 4 oz copper pour with thermal vias to the inner ground plane. Maximum junction temperature is +150C; design margin should keep Tj below +110C for long-term reliability.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page. Industrial temperature grade (I) only - NOT AEC-Q100 qualified; for automotive applications requiring AEC-Q100, use a Q-qualified variant. The FuSa (ASIL-B/SIL-2 capable) features are part of the Functional Safety subsystem rather than AEC-Q100 qualification of the part itself.
