DSPIC33EP256GM604-H/ML - 70 MIPS 16-Bit DSC, 256KB Flash | Microchip
Teilenummer: DSPIC33EP256GM604-H/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.2 | $62,00 |
| 100 | $5.55 | $555,00 |
| 500 | $4.95 | $2.475,00 |
| 1.000 | $4.42 | $4.420,00 |
DSPIC33EP256GM604-H/ML Übersicht
A digital signal controller combines the computational capability of a microcontroller with the math-acceleration of a DSP. In the embedded-systems hierarchy, the DSC sits between general-purpose MCUs and dedicated DSPs, making it the preferred architecture when an application needs both control-loop determinism and fast multiply-accumulate operations - for example in field-oriented motor control or digital power conversion.
Key features include the 70 MIPS dsPIC33E core with DSP engine, 256KB of self-programmable Flash, 16KB of RAM, a 12-channel motor-control PWM module, eight input captures, eight output compares, two quadrature encoder interfaces, four on-chip op amps, and CAN connectivity for industrial and automotive networks.
Technically, the dsPIC33EP core executes most instructions in a single cycle, with hardware multiply-accumulate and barrel shifter support for DSP-class algorithms. The integrated op amps offload external analog front-end components, reducing BOM cost in current-sensing and signal-conditioning chains, while the high-resolution PWM supports precision power-conversion topologies.
Typical applications include brushless DC and PMSM motor control with sensorless or encoder feedback, digital power supplies and solar inverters, and automotive body or powertrain auxiliary nodes using the CAN interface.
Design consideration: operate from a clean 3.3V rail and budget the PLL configuration carefully - the 70 MIPS ceiling requires a 7.3728 MHz-class crystal or internal FRC with appropriate multipliers.
This page synthesizes distributor listings, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing as of 2026-09-24.
Drop-in-Alternativen für DSPIC33EP256GM604-H/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP256GM604-H/ML (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, CAN, DMA Channels, Input Capture / Output Compare.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP256GM604-E/ML
✅ Drop-In✓ Auf Lager
$6.55 / Stück
Datenblatt ansehen →DSPIC33EP256GM604-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.9 / Stück
Datenblatt ansehen →DSPIC33EP256MC604-H/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP128GM604-H/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.41 / Stück
Datenblatt ansehen →DSPIC33EP64GM604-H/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP256GM606-I/MR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP256GM604-H/ML Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33E 16-bit DSC |
| Maximum CPU Speed | 70 MIPS |
| Flash Memory | 256KB (85.5K x 24) |
| RAM | 16KB |
| Versorgungsspannung | 3.3 V |
| Gehäuse | 44-QFN (8x8 mm) |
| Montageart | Surface Mount |
| Motor Control PWM Channels | 12 |
| Input Capture / Output Compare | 8 / 8 |
| Quadrature Encoder Interfaces | 2 |
| On-chip Op Amps | 4 |
| CAN | Yes (2.0B) |
| Qualification | Automotive, AEC-Q100 |
| Betriebstemperatur | -40C to +125C |
| Anzahl der Pins | 44 |
| Datenbusbreite | 16 bit |
| Architecture | Harvard |
DSPIC33EP256GM604-H/ML 44-qfn (8x8 mm) Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP256GM604-H/ML (44-qfn (8x8 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP256GM604-H/ML.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP256GM604-H/ML ist geeignet für 6 Anwendungs: Brushless DC / PMSM Motor Control, Digital Power Conversion, Automotive CAN Network Nodes, Sensor Signal Processing and Data Acquisition, Embedded Industrial Automation Controllers, Audio and Signal Processing Nodes.
Brushless DC / PMSM Motor Control
The DSPIC33EP256GM604-H/ML is purpose-built for precision motor control. Its 12-channel motor-control PWM module provides complementary outputs with programmable dead time for three-phase inverter bridges, while two quadrature encoder interfaces accept high-resolution position feedback. At 70 MIPS with a hardware DSP engine, the core executes field-oriented control (FOC) loops in tens of microseconds, enabling high-bandwidth current loops for BLDC and PMSM drives. The four on-chip op amps condition shunt-resistor phase-current signals without external amplifiers, reducing BOM cost and board area. In a typical design the PWM drives a gate-driver stage, the op amps feed the ADC for per-cycle current sampling, and the 256KB Flash holds sensorless estimation algorithms with headroom for field weakening.
Empfohlen
Digital Power Conversion
In digital power supplies, solar micro-inverters, and PFC stages, the DSPIC33EP256GM604-H/ML replaces analog control loops with firmware-based control. The high-resolution PWM supports phase-shifted full-bridge, buck, boost, and LLC topologies with cycle-by-cycle current limiting, while the 70 MIPS core closes voltage and current loops fast enough for switching frequencies in the hundreds of kilohertz. The 256KB Flash accommodates multiple operating modes, soft-start ramps, and fault management state machines in a single device, and the 16KB RAM buffers telemetry for remote monitoring. AEC-Q100 qualification extends its use into automotive onboard chargers and DC-DC converters where reliability screening is mandatory.
Empfohlen
Automotive CAN Network Nodes
The DSPIC33EP256GM604-H/ML integrates a CAN controller and carries AEC-Q100 automotive qualification, making it a strong fit for body-control, actuator, and sensor nodes on automotive and industrial CAN buses. Operating from a 3.3V rail in the high-temperature -H grade up to +125C, it survives under-hood and near-engine environments. The 256KB Flash stores protocol stacks plus application firmware with room for OTA-updatable features, while the remaining peripherals - op amps, PWM, captures - locally drive actuators and read analog sensors. Pair the internal CAN controller with an external transceiver such as the MCP2551 for the physical bus layer.
Empfohlen
Sensor Signal Processing and Data Acquisition
With four on-chip operational amplifiers, eight input captures, and a DSP-accelerated 70 MIPS core, the DSPIC33EP256GM604-H/ML consolidates analog front-end conditioning and digital processing for sensor systems. The op amps can be configured as programmable-gain amplifiers for bridge, thermocouple, or current-shunt signals, feeding the on-chip ADC; the DSP engine then applies digital filtering, FFT analysis, or calibration math in firmware. This eliminates discrete amplifier stages and reduces noise pickup between stages. Applications include industrial condition-monitoring probes, weigh scales, and medical-style measurement front ends operating from a single 3.3V supply in the 44-QFN package.
Empfohlen
Embedded Industrial Automation Controllers
For industrial automation boards, the DSPIC33EP256GM604-H/ML provides deterministic 16-bit control with rich I/O: eight output compares for timed events, eight input captures for frequency and period measurement, and two QEI modules for encoder-feeding axis control. The 70 MIPS core handles PID loops, communication stacks, and sequencing simultaneously, while 256KB Flash supports protocol tables and recipe storage without external memory. CAN and UART/SPI/I2C interfaces link PLC-style modules, drives, and HMIs. The AEC-Q100 qualification and -H temperature grade also allow deployment on factory equipment exposed to elevated ambient temperatures inside sealed enclosures.
Empfohlen
Audio and Signal Processing Nodes
The DSP hardware in the DSPIC33EP256GM604-H/ML - single-cycle MAC, modulo and bit-reversed addressing - supports real-time audio filtering, tone generation, and acoustic processing at modest sample rates. The on-chip op amps can buffer microphone or line-level inputs before the ADC, and the PWM module can synthesize output stages or drive a class-D power stage in low-cost audio applications. The 256KB Flash holds filter coefficient sets and multiple profiles, and the 44-QFN 8x8 mm footprint suits compact consumer or kiosk hardware operating from a 3.3V supply.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP256GM604-H/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP256GM604-E/ML | DSPIC33EP256MC604-H/ML | DSPIC33EP128GM604-H/ML | DSPIC33EP64GM604-H/ML | DSPIC33EP256GM606-I/MR |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 64-QFN (9x9 mm) - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256KB (85.5K x 24) | 256KB | 256KB | 128KB | 64KB | 256KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| On-chip Op Amps | 4 | 4 | reduced complement vs GM | 4 | 4 | 4 |
| Motor-Control PWM Channels | 12 | 12 | 12 | 12 | 12 | 12 |
| Qualification | Automotive, AEC-Q100 | Extended temperature grade | Automotive, AEC-Q100 | Automotive, AEC-Q100 | Automotive, AEC-Q100 | Industrial grade |
Wichtigste Unterscheidungsmerkmale
- Four integrated operational amplifiers (vs. DSPIC33EP256MC604-H/ML)
- Full 256KB Flash in the smallest family footprint (vs. DSPIC33EP128GM604-H/ML)
- AEC-Q100 automotive qualification (vs. DSPIC33EP256GM604-E/ML)
- Trade-off: 44-pin I/O limit (vs. DSPIC33EP256GM606-I/MR)
Designhinweise
The DSPIC33EP256GM604-H/ML runs from a nominal 3.3V supply with an internal regulator that requires a stabilizing capacitor on the VCAP/VCORE pin per the datasheet layout guidelines. Estimated: at 70 MIPS with all peripherals active, core current is in the tens of milliamps class; budget a 100mA-class 3.3V rail plus margin for I/O loads. Decouple each VDD pin with 0.1uF ceramics placed within 2mm of the pad, plus one bulk 4.7uF-10uF capacitor near the QFN.
The 44-QFN (8x8 mm) has a central exposed pad that must be soldered to a grounded copper pour - it is a primary thermal and ground path. Use a via array (4-9 vias) under the pad to the ground plane for reliable reflow and low ground impedance. Keep the crystal/oscillator traces short and guarded, and route the PWM outputs away from the op-amp/ADC analog lines to prevent switching noise coupling into current-sense measurements.
To reach the full 70 MIPS, the PLL must be configured correctly from the approved oscillator options; using the internal FRC at full speed trades frequency accuracy for convenience - unacceptable for CAN baud-rate precision without auto-calibration. Verify MCLR pull-up and programming (PGD/PGC) header access in production fixtures. Temperature grade suffixes matter: the -H automotive grade and the -E extended grade have different qualified ranges - never substitute grades in an AEC-Q100 program without requalification review.
When using the four on-chip op amps for current-sense amplification, keep shunt kelvin connections direct to the op-amp input pins and use matched trace lengths. Reference Microchip's dsPIC33EP family datasheet op-amp bandwidth limits: for high-side sensing above the op-amp bandwidth, an external amplifier remains the safer design.
Compliance-Informationen
AEC-Q100 automotive qualification stated in DigiKey listing. RoHS/lead-free consistent with Microchip standard production; formal REACH and halogen-free declarations should be obtained from Microchip environmental documentation.