DSPIC33EP256GM604-I/ML - 16-bit 70 MIPS DSC 256KB | Microchip
MPN: DSPIC33EP256GM604-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.49 | $6.49 |
| 10 | $6.1 | $61.00 |
| 100 | $5.65 | $565.00 |
| 500 | $5.25 | $2,625.00 |
| 1,000 | $4.9 | $4,900.00 |
DSPIC33EP256GM604-I/ML Overview
A digital signal controller combines the computational architecture of a microcontroller with the mathematical acceleration of a digital signal processor. Within the power-management hierarchy, DSCs such as the dsPIC33E family sit at the intersection of general-purpose MCUs and dedicated DSPs, making them the de-facto choice for closed-loop control systems such as field-oriented motor control, digital power conversion, and sensor fusion, where deterministic interrupt latency and multiply-accumulate throughput matter more than raw MHz.
Key features include the enhanced dsPIC33E core with DSP engine, 17-bit x 17-bit single-cycle hardware multiplier, dual 40-bit accumulators, and barrel shifter; 12 channels of motor-control PWM; 8 input captures and 8 output compares; 2 quadrature encoder interfaces (QEI); and 4 integrated operational amplifiers for direct current-sense amplification. Four DMA channels and 5 external interrupt inputs offload the CPU in data-intensive loops.
Architecturally, the CMOS core runs from a 3.0V to 3.6V supply, supports boundary scan (JTAG), and offers low-power modes for battery-conscious designs. The integrated CAN peripheral targets industrial networking, and the on-chip op-amps reduce external BOM count in shunt-based current feedback paths.
Typical applications include BLDC/PMSM servo drives, digital power supplies (PFC, LLC), solar inverters, and industrial automation nodes requiring CAN connectivity.
Design consideration: connect all VDD and VSS pairs, and pair PGECx/PGEDx pins correctly for ICSP programming and debugging - mismatched PGD/PGC pairs are the most common bring-up failure.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP256GM604-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256GM604-I/ML (same form factor and footprint) — differing in Package, Operating Temperature, CAN, Program Memory Size, Maximum CPU Speed.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256GM604-E/ML
✅ Drop-In✓ In Stock
$6.55 / Unit
View Datasheet →DSPIC33EP256MC504-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP128GM604-I/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256GM604-I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GM604-I/PF
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GM604-I/ML Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC |
| Maximum CPU Speed | 70 MIPS |
| Program Memory Size | 256KB (85.5K x 24) Flash |
| RAM Size | 16KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial, I grade) |
| Package | 44-QFN (8x8 mm), exposed pad (HVQCCN, ML) |
| Mounting Type | Surface Mount |
| Motor Control PWM Channels | 12 |
| Input Capture / Output Compare | 8 / 8 |
| Quadrature Encoder Interfaces | 2 |
| Integrated Op-Amps | 4 |
| DMA Channels | 4 |
| External Interrupt Inputs | 5 |
| CAN | Yes |
| Technology | CMOS |
| Debug / Programming | ICSP (2-wire PGECx/PGEDx), boundary scan, JTAG support |
| Number of Terminals | 44 |
DSPIC33EP256GM604-I/ML 44-qfn (8x8 mm), exposed pad (hvqccn, ml) Pin Configuration Guide
Pin configuration for DSPIC33EP256GM604-I/ML (44-qfn (8x8 mm), exposed pad (hvqccn, ml) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256GM604-I/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256GM604-I/ML is suitable for 6 applications: BLDC/PMSM Field-Oriented Motor Control, Digital Power Conversion (PFC / LLC), Industrial Automation CAN Nodes, Solar Inverters and Renewable Energy Converters, Sensor Fusion and Embedded Signal Processing, Automotive-Adjacent and E-Sealed Enclosure Electronics.
BLDC/PMSM Field-Oriented Motor Control
The DSPIC33EP256GM604-I/ML is purpose-built for field-oriented control (FOC) of BLDC and PMSM motors. Its 70 MIPS core with a single-cycle 17x17 hardware multiplier and DSP MAC instructions executes Clarke/Park transforms and PI current loops at 10-20 kHz PWM frequencies with substantial timing margin. Twelve motor-control PWM channels provide complementary outputs with hardware dead-time insertion, while the 2 QEI modules interface directly to rotary encoders for position feedback. The 4 integrated op-amps amplify low-side shunt current measurements before the ADC, trimming external BOM count. Place the controller between the gate-driver stage and current-sense front end; the on-chip op-amp gain setting reduces analog component drift compared to discrete amplifiers in high-temperature drive enclosures.
Recommended
Digital Power Conversion (PFC / LLC)
In switch-mode power supplies such as PFC front ends and LLC resonant converters, the DSPIC33EP256GM604-I/ML replaces analog control loops with firmware-based compensation. The 70 MIPS core samples voltage and current feedback and updates the 12 motor-control PWM duty cycles at converter switching frequencies, while the 4 DMA channels stream ADC results to RAM without CPU intervention, preserving cycle budget for control math. Integrated op-amps condition shunt or current-transformer signals, and CAN enables digital telemetry between parallel converter modules in server or telecom rectifier stacks. Because loop compensation resides in Flash, gain scheduling across line/load ranges is field-updatable - a key advantage over fixed analog compensators in multi-rail systems requiring adaptive startup sequencing.
Recommended
Industrial Automation CAN Nodes
The CAN peripheral on the DSPIC33EP256GM604-I/ML makes it a strong fit for industrial automation nodes - sensor hubs, actuator controllers, and remote I/O on factory networks. The 256KB Flash stores protocol stacks (CANopen, DeviceNet-style layers) with room for application logic, and 16KB RAM buffers message objects and DMA-driven sensor streams. The 5 external interrupt inputs capture fast digital events (limit switches, encoder index pulses) with deterministic latency, and the 8 output compares generate timed outputs for valve or relay sequencing. Operating from a 3.0V to 3.6V supply in the industrial -40C to +85C range, the QFN package suits compact DIN-rail and machine-mounted modules where a 64-pin device would be oversized.
Recommended
Solar Inverters and Renewable Energy Converters
Grid-tied and off-grid solar converters need simultaneous MPPT execution, inverter modulation, and safety monitoring - a workload matched to the DSPIC33EP256GM604-I/ML. The 70 MIPS DSP engine computes MPPT perturb-and-observe or incremental-conductance algorithms while generating synchronized PWM for the power stage at 16-100 kHz. The 12 PWM channels support interleaved boost stages and three-phase bridges, and the on-chip op-amps condition panel current shunts and grid current sensors. CAN (or an external transceiver) connects the inverter to battery-management and monitoring systems. The 44-QFN 8x8 mm footprint with exposed pad provides a low-inductance ground return important for ADC accuracy in high dv/dt environments, and industrial temperature rating covers outdoor enclosure conditions.
Recommended
Sensor Fusion and Embedded Signal Processing
Beyond motion and power, the DSPIC33EP256GM604-I/ML serves general signal-processing nodes: vibration analyzers, audio front ends, and multi-sensor fusion modules. The DSP multiply-accumulate engine and dual 40-bit accumulators execute FIR/IIR filtering and FFT windowing efficiently at 70 MIPS, while 256KB Flash stores both algorithm code and calibration tables. Four DMA channels move ADC sample blocks to RAM concurrently with computation, and the 8 input captures timestamp external events for cross-sensor correlation. The 4 integrated op-amps can be used for anti-aliasing gain stages directly, removing an external amplifier stage. In IoT gateways and condition-monitoring retrofit nodes, the CAN interface bridges legacy industrial buses to modern supervisory controllers.
Recommended
Automotive-Adjacent and E-Sealed Enclosure Electronics
For electronics packaged in engine-bay-adjacent zones, under-hood accessories, or sealed industrial enclosures that exceed +85C ambient, pair the DSPIC33EP256GM604-I/ML design with its same-die extended-temperature sibling, the DSPIC33EP256GM604-E/ML (rated -40C to +125C). Because both use the identical 44-QFN footprint and firmware image, one PCB layout qualifies for both thermal environments - a significant cost advantage when one product family spans cabin and under-hood variants. The 70 MIPS core handles pump, fan, and throttle actuator control; 12 PWM channels drive brushed and brushless loads; and boundary-scan support eases production test. This footprint-unified approach shortens qualification cycles for mixed-temperature product lines.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256GM604-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GM604-E/ML | DSPIC33EP256MC504-I/ML | DSPIC33EP128GM604-I/ML | DSPIC33EP256GM604-I/MR | DSPIC33EP256GM604-I/PF |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm, ML) | 44-QFN (8x8 mm, ML) - same | 44-QFN (8x8 mm, ML) - same | 44-QFN (8x8 mm, ML) - same | 44-QFN family (verify suffix pinout) | 44-TQFP (PBFP44) - different land pattern |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | 16-bit dsPIC33E, 70 MIPS | 16-bit dsPIC33E, 70 MIPS | 16-bit dsPIC33E, 70 MIPS | 16-bit dsPIC33E, 70 MIPS | 16-bit dsPIC33E, 70 MIPS | 16-bit dsPIC33E, 70 MIPS |
| Flash Memory | 256KB (85.5K x 24) | 256KB | 256KB | 128KB (-50%) | 256KB | 256KB |
| RAM | 16KB | 16KB | 16KB | 16KB | 16KB | 16KB |
| Temperature Range | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| MC PWM / IC / OC / QEI | 12 / 8 / 8 / 2 | 12 / 8 / 8 / 2 | MC-focused set; verify mapping | 12 / 8 / 8 / 2 | 12 / 8 / 8 / 2 | 12 / 8 / 8 / 2 |
Key Differentiators
- Extended-temperature same-die sibling enables dual-grade product lines (vs DSPIC33EP256GM604-E/ML)
- Four integrated op-amps reduce BOM versus external amplification (vs DSPIC33EP256MC504-I/ML)
- 256KB Flash headroom for protocol stacks plus control firmware (vs DSPIC33EP128GM604-I/ML)
Design Notes
Solder the 44-QFN exposed pad to a ground-plane thermal via array (4x4 grid of 0.3 mm vias on a 6x6 mm pad region). The exposed pad is the primary ground return for the device; leaving it unconnected raises ground bounce during simultaneous PWM switching and degrades ADC accuracy. Estimated: with a solid 2 oz copper pour and via array, theta_JA for an 8x8 QFN typically falls well below theJEALP-standard no-pad figure; consult the Microchip QFN thermal design appnotes for exact values rather than assuming.
ICSP pairing errors are the most frequent bring-up failure. The dsPIC33EP256GM604 has multiple PGECx/PGEDx clock/data pairs; you may use any pair, but ICSPCLK and ICSPDAT must come from the SAME pair (e.g., PGEC2 with PGED2). Additionally, connect ALL VDD and VSS pins during programming and operation per the Microchip programming documentation - floating a supply pin can prevent code entry or corrupt verification. Route the programmer header directly to the chosen pair with short traces and keep them away from PWM switch nodes.
Place 100 nF C0G/X7R decoupling capacitors at every VDD/VSS pin pair within 2 mm of the pins, plus one 4.7-10 uF bulk capacitor near the device. VDD must stay within 3.0V-3.6V; estimate ripple budget from core current at 70 MIPS rather than assuming idle current. If a switching regulator provides the 3.3V rail, add an LC filter or use an LDO for the controller rail to keep switching ripple out of ADC reference measurements in motor-control current loops.
Keep the 4 on-chip op-amp input traces (current-sense shunt connections) as short, Kelvin-routed pairs directly from the shunt resistor terminals. Route them differentially away from the 12 PWM output traces; PWM coupling into shunt lines appears as switching-frequency noise in the current-loop feedback and causes torque ripple in FOC drives. Ground guard traces between PWM and analog routing are a low-cost mitigation.
Compliance Information
RoHS-compliant, lead-free per standard Microchip production and distributor (DigiKey/Mouser) environmental declarations. REACH, halogen-free, and conflict-minerals statuses should be confirmed via Microchip's official quality/environmental documentation for this exact MPN.
