EP1C20F40017 - Cyclone FPGA, 20,060 LEs, 400-Pin FBGA | Intel
Teilenummer: EP1C20F40017 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.95 | $2.995,00 |
| 500 | $27.1 | $13.550,00 |
| 1.000 | $24.8 | $24.800,00 |
EP1C20F40017 Übersicht
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic functionality is defined after manufacturing through user-supplied configuration bitstreams stored in on-chip SRAM. FPGAs occupy the same hierarchical position as programmable logic devices (PLDs) and complex programmable logic devices (CPLDs) within the broader integrated circuit taxonomy, sitting alongside ASICs, microcontrollers, and DSPs as reconfigurable compute elements. Unlike fixed-function ASICs, FPGAs can be reprogrammed in-system, making them ideal for prototyping, low-volume production, and applications requiring field-upgradable logic.
Key features of the EP1C20F40017 include 20,060 logic elements, 64 M4K RAM blocks (294 Kbits total), 301 user I/O pins, 2 phase-locked loops for clock management, and 1.5 V core supply with 3.3 V/2.5 V/1.8 V/1.5 V multi-voltage I/O support. The -17 speed grade designation places it in the mid-tier performance envelope for the Cyclone family. The FBGA-400 FineLine BGA package offers 0.8 mm ball pitch for high-density board designs while remaining compatible with standard multilayer PCB manufacturing.
The Cyclone architecture implements a four-input look-up table (LUT) based logic element with embedded carry chains and dedicated memory blocks (M4K), providing efficient implementation of arithmetic-intensive pipelines, DSP pre/post-processing, and state-machine controllers. Its SRAM configuration memory means the device is volatile and must be loaded from an external configuration device such as the EPCS1/EPCS4 serial configuration flash at every power-up.
Typical applications for the EP1C20F40017 include industrial control logic, video processing front-ends, communications protocol bridging, consumer electronics glue logic, and embedded instrumentation. The combination of moderate logic density, generous on-chip memory, and integrated PLLs makes it well-suited to glue-logic consolidation and cost-sensitive high-volume designs.
When designing with the EP1C20F40017, plan a configuration source (EPCS-series flash or JTAG) and provide all six independent I/O bank supplies to enable mixed-voltage interfacing. Maintain the 1.5 V VCCINT within ±5% and ensure proper decoupling with 0.1 µF + 10 µF capacitors near every VCC pin group.
This page synthesizes distributor stock signals, drop-in same-package alternatives, and practical power/thermal/layout design notes that go beyond what the manufacturer datasheet alone typically provides for a Cyclone-family part.
Drop-in-Alternativen für EP1C20F40017 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1C20F40017 (gleiche Bauform und Footprint) – abweichend in Speed Grade, Package, PLLs, Operating Temperature, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1C20F400C6
✅ Drop-In✓ Auf Lager
$18.95 / Stück
Datenblatt ansehen →EP1C20F400C7
✅ Drop-In✓ Auf Lager
$48.9 / Stück
Datenblatt ansehen →EP1C20F400C8
✅ Drop-In✓ Auf Lager
$17.2 / Stück
Datenblatt ansehen →EP1C20F400I7N
✅ Drop-In✓ Auf Lager
$76.9 / Stück
Datenblatt ansehen →EP1C20F400
✅ Drop-In✓ Auf Lager
$58.9 / Stück
Datenblatt ansehen →EP1C20F400C6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$53.1 / Stück
Datenblatt ansehen →EP1C20F400C7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$65.8 / Stück
Datenblatt ansehen →EP1C20F40017 Grenzwerte & elektrische Eigenschaften
| Family | Cyclone |
| Logic Elements | 20,060 |
| Embedded Memory (bits) | 294,912 |
| M4K RAM Blocks | 64 |
| Maximum User I/O Pins | 301 |
| PLLs | 2 |
| Speed Grade | -17 |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage Standards | LVTTL, LVCMOS, SSTL, HSTL, LVDS |
| Gehäuse | FBGA-400 (FineLine BGA) |
| Ball Pitch | 0.8 mm |
| Process Technology | 0.13 µm SRAM |
| Configuration Method | Serial (AS mode) or JTAG |
| Betriebstemperatur | 0 °C to +85 °C (commercial) |
| Montageart | Surface Mount (BGA) |
EP1C20F40017 fbga-400 (fineline bga) Pinbelegungsleitfaden
Pinbelegung für EP1C20F40017 (fbga-400 (fineline bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1C20F40017.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1C20F40017 ist geeignet für 6 Anwendungs: Industrial Control Logic, Video Processing Front-End, Communications Protocol Bridge, Consumer Electronics Glue Logic, Embedded Instrumentation and Test, Legacy Avionics Display Controller.
Industrial Control Logic
The EP1C20F40017 is well-suited for industrial control logic consolidation, where 20,060 LEs replace multiple 74-series glue-logic ICs, PLDs, and discrete state machines on a single board. Its 301 user I/O pins interface directly to 24 V industrial sensors through opto-isolators and support LVTTL/LVCMOS signaling back to motor-driver controllers. The two integrated PLLs derive multiple clock domains for synchronized stepper, servo, and conveyor control loops, while the 64 M4K RAM blocks (294 Kbits) hold line-scan buffers for vision-based quality inspection. Cyclone SRAM volatility requires an EPCS1/EPCS4 serial flash for boot, and the FBGA-400 package’s 0.8 mm pitch suits four-layer FR-4 designs typical in factory automation. Designers appreciate that the device operates across 0 °C to 85 °C commercial temperature ranges common in cabinet-mounted PLC chassis.
Empfohlen
Video Processing Front-End
In video processing front-ends, the EP1C20F40017 serves as a format converter, color-space translator, and frame-rate interpolator for SDI/DVI/HDMI input pipelines. The 64 M4K RAM blocks (294 Kbits total) implement line buffers and chroma reconstruction FIFOs sized for standard-definition and entry-level HD resolutions, while the 20,060 LEs run de-interlacing and scaling filters at the 27/74 MHz pixel clocks common in broadcast gear. LVDS I/O support interfaces directly to Channel Link serializers without external transceivers, reducing BOM cost. The two PLLs generate the multiple pixel-clock and parallel-data-clock domains required for ingress and egress conversion. Designers typically pair the EP1C20F40017 with an external video ADC such as the ADV7180 and a video DAC/encoder like the ADV7123 for complete analog-to-digital conversion paths.
Empfohlen
Communications Protocol Bridge
The EP1C20F40017 functions as a multi-protocol bridge between UART, SPI, I2C, CAN, and proprietary industrial buses in equipment where no single fixed-function ASIC covers the needed interface mix. Its 20,060 LEs implement soft UART cores, SPI masters/slaves, I2C controllers, and CAN 2.0B controllers in parallel, while the 301 user I/O pins expose independent channels to multiple downstream microcontrollers or DSPs. The 64 M4K RAM blocks provide per-channel FIFOs that decouple bus speeds and absorb burst traffic without dropping bytes. Integrated PLLs derive the precise baud-rate clocks required for CAN at 1 Mbps and SPI at 50 MHz from a single 50 MHz crystal. The FBGA-400 footprint and 0.8 mm ball pitch keep the bridge compact enough to fit alongside the main processor on a 100×80 mm industrial SBC.
Empfohlen
Consumer Electronics Glue Logic
Consumer electronics designs leverage the EP1C20F40017 as a glue-logic aggregator that replaces 5–10 discrete logic ICs with a single programmable device, reducing PCB area and BOM cost in set-top boxes, DVD/Blu-ray players, and home gateways. The 20,060 LEs handle CEC/IR control, HDMI handshaking, EEPROM emulation, and LED-pattern generation, while the 64 M4K blocks back small character buffers and protocol-state lookup tables. The 1.5 V core plus selectable 3.3 V/2.5 V/1.8 V I/O banks let designers interface legacy peripherals without level-shifters. The two PLLs produce audio MCLK (12.288 MHz), HDMI pixel clocks (25–148.5 MHz), and the main system clock from one reference oscillator. Commercial 0–85 °C operation and lead-free FBGA-400 packaging suit consumer cost targets and RoHS compliance simultaneously.
Empfohlen
Embedded Instrumentation and Test
In test and measurement equipment, the EP1C20F40017 acts as the digital back-end that captures high-speed ADC samples, implements FIR/IIR filtering, and drives displays or GPIB/USB interfaces for bench-top instruments. The 64 M4K RAM blocks (294 Kbits) hold ADC sample FIFOs up to 18 MSPS at 16-bit resolution, while 20,060 LEs run fixed-point DSP filters, FFT engines, and statistical accumulators in real time. The 301 user I/O pins parallel-interface to 8/16-bit ADC/DAC buses common in data-acquisition boards, and the two PLLs derive ADC sampling clocks from a stable external TCXO. The FBGA-400 package's 0.8 mm pitch keeps the FPGA within thermal envelope of 0–85 °C commercial operation when paired with a modest copper-pour heatsink on a four-layer board.
Empfohlen
Legacy Avionics Display Controller
Although modern avionics standards favor newer FPGAs, the EP1C20F40017 continues to serve as an ARINC 429 / MIL-STD-1553 display controller in legacy cockpit instrumentation retrofit programs where the FPGA density exactly matches the legacy BOM. The 20,060 LEs implement ARINC 429 transmitters/receivers, 1553 BC/RT/MT logic, and discrete-to-video conversion in parallel. The 64 M4K blocks back label-overlay RAM and cursor-pattern buffers for AMLCD displays, while the two PLLs synthesize the ARINC 429 high/low bit-rate clocks (12.5 / 100 kbps) and the 1553 1 MHz data-clock from a single 10 MHz reference. The 301 user I/O pins parallel-drive legacy LCD backplanes and discrete indicators without external bus switches, and the FBGA-400 0.8 mm pitch is acceptable for the controlled-manufacturing environment typical of DO-254 retrofit programs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1C20F40017 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1C20F400C6 | EP1C20F400C7 | EP1C20F400C8 | EP1C20F400I7N |
|---|---|---|---|---|---|
| Package | FBGA-400 (FineLine BGA) | FBGA-400 - same | FBGA-400 - same | FBGA-400 - same | FBGA-400 - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 20,060 | 20,060 | 20,060 | 20,060 | 20,060 |
| Speed Grade | -17 | -6 (faster) | -7 (faster) | -8 (fastest) | -7 industrial |
| Embedded RAM (bits) | 294,912 | 294,912 | 294,912 | 294,912 | 294,912 |
| User I/O Pins | 301 | 301 | 301 | 301 | 301 |
| PLLs | 2 | 2 | 2 | 2 | 2 |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +100 °C (industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Indicative 1k Price (USD) | 24.80 | 26.50 | 26.00 | 27.20 | 32.00 |
Wichtigste Unterscheidungsmerkmale
- Higher Fmax speed-grade option in same FBGA-400 footprint (vs. EP1C20F400C8)
- Industrial-temperature grade option in same FBGA-400 footprint (vs. EP1C20F400I7N)
- Largest I/O count within the Cyclone family in this footprint (vs. EP1C20F324C7N)
Designhinweise
EP1C20F40017 requires a clean 1.5 V ±5% VCCINT supply with at least 30 A peak capability during configuration. Place 0.1 µF + 10 µF ceramic decoupling within 5 mm of every VCCINT pin group, and add a 100 µF bulk tantalum at the regulator output. The PLL analog supply (VCCA_PLL) must be filtered through a ferrite bead and decoupled with 10 µF + 0.1 µF; noise above 50 mVpp on VCCA_PLL degrades PLL jitter and can cause link failures. Each VCCIO bank is independently configurable to 3.3/2.5/1.8/1.5 V, and unused banks still require their VCCIO pin tied to a valid rail — never leave floating.
Estimated: at full LE utilization (~80%) and 250 MHz toggle rate, the EP1C20F40017 dissipates approximately 1.8–2.4 W. With theta_JA of roughly 18 °C/W on a 4-layer JEDEC test board, junction temperature rises about 32–43 °C above ambient. For a 70 °C ambient industrial environment, ensure a copper-pour heatsink of at least 2 square inches under the FBGA-400 footprint. Commercial 0–85 °C operation requires junction temperature stay below 100 °C, leaving little margin without forced airflow in enclosed chassis.
The FBGA-400 package uses 0.8 mm ball pitch and demands 0.4 mm-diameter microvias or laser-drilled stacked vias on a 1.0–1.6 mm PCB thickness for reliable BGA breakout. Use a 4-layer stack-up (signal/ground/power/signal) with continuous reference planes beneath the FPGA; split planes cause return-path discontinuities that couple switching noise into analog inputs. Route all 16 configuration pins (DATA, DCLK, nCONFIG, nSTATUS, CONF_DONE, MSEL0/1, nCE, nCEO, ASDO, nCSO, CLKUSR, INIT_DONE, DEV_OE, DEV_CLRn, TCK, TMS, TDI, TDO) as short matched-length traces, and place the EPCS configuration flash within 50 mm of the FPGA.
Cyclone FPGAs are SRAM-based and therefore volatile — the EP1C20F40017 has NO built-in non-volatile storage and must be configured at every power-up from an external EPCS-series serial flash or JTAG programmer. Forgetting the configuration device causes the FPGA to remain in reset indefinitely. Additionally, the -17 speed grade is the slowest in the family: do not assume timing closure at speeds that work for -6 or -8 variants. Always run TimeQuest timing analysis with the -17 speed-grade SDC file. Finally, the FBGA-400 0.8 mm pitch requires X-ray inspection after reflow; optical inspection is unreliable for hidden solder joints.
Compliance-Informationen
RoHS and lead-free compliant per Altera/Intel legacy product declarations. Not AEC-Q100 qualified — for automotive applications, evaluate Cyclone IV/IV GX or newer automotive-grade Intel FPGAs. Halogen-free status not explicitly stated in legacy datasheet.
