EP1C20F400C8 - Cyclone FPGA 20060 LE 400-BGA | Intel
MPN: EP1C20F400C8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.95 | $289.50 |
| 100 | $24.5 | $2,450.00 |
| 500 | $19.8 | $9,900.00 |
| 1,000 | $17.2 | $17,200.00 |
Drop-in alternatives for EP1C20F400C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1C20F400C8N
✅ Drop-In✓ In Stock
$62.5 / Unit
View Datasheet →EP1C20F400C7
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$48.9 / Unit
View Datasheet →EP1C20F400C7N
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$65.8 / Unit
View Datasheet →EP1C20F400C6N
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$53.1 / Unit
View Datasheet →EP1C20F400C6
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$18.95 / Unit
View Datasheet →EP1C20F400C8 Maximum Ratings & Electrical Characteristics
| Series | Cyclone I |
| Logic Elements | 20,060 LE |
| Logic Array Blocks (LABs) | 2,006 |
| Embedded Memory | 294,912 bits (288 Kbit) |
| Embedded Multipliers | Embedded 18 × 18 blocks |
| Maximum User I/O | 301 |
| Process Technology | 130 nm CMOS (SRAM-based) |
| Core Supply Voltage (VCCINT) | 1.5 V |
| I/O Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| PLLs | 2 (one per device quadrant) |
| Maximum Internal Frequency | 275.03 MHz (typical) |
| Package | 400-ball FBGA (FineLine BGA), 21 × 21 mm, 1.0 mm pitch |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG |
| Operating Temperature (Commercial) | 0 °C to +85 °C |
| Configuration Memory | SRAM (volatile, reload required at power-up) |
EP1C20F400C8 400-ball fbga (fineline bga), 21 × 21 mm, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for EP1C20F400C8 (400-ball fbga (fineline bga), 21 × 21 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C20F400C8.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C20F400C8 is suitable for 7 applications: Industrial Control and PLC I/O Expansion, Digital Video Surveillance Pipeline, Motor Drive Interface Logic, Legacy Glue Logic Replacement, Software Defined Radio Baseband Pre-Processing, Display Controller and Timing Generator, Aerospace and Defense Legacy Sustainment.
Industrial Control and PLC I/O Expansion
The EP1C20F400C8's 301 user I/Os and 20,060 logic elements make it well suited to PLC I/O expansion cards that need to consolidate dozens of discrete input/output signals into a single programmable interface. With embedded M4K memory blocks totaling 294,912 bits and 18 × 18 multipliers, the device can also implement protocol conversion (e.g., parallel field bus to SPI/Modbus) and basic motion-control arithmetic on-chip. Designers typically place the FPGA between a 24 V industrial backplane and a microcontroller, using LVTTL/LVCMOS 3.3 V I/O banks. Note that the 130 nm / 1.5 V process yields moderate power dissipation, so 4-layer PCB stack-ups with continuous VCCINT and GND planes are recommended for noise-sensitive analog co-residents on the same board.
Recommended
Digital Video Surveillance Pipeline
The EP1C20F400C8 is a strong fit for digital video surveillance front-ends that need to ingest parallel camera data, perform color-space conversion, and buffer frames before passing them to a back-end processor. Its 301 user I/Os easily accommodate ITU-R BT.656 or parallel CMOS sensor buses, while 64 M4K RAM blocks serve as line buffers and frame FIFOs. Embedded 18 × 18 multipliers support real-time edge detection, scaling, or compression pre-processing. For 720p/1080p pipelines the 275 MHz internal frequency is sufficient. Cyclone I is mature/NRND, so for new surveillance designs engineers should evaluate Cyclone IV E (EP4CE22) which delivers similar density at lower power with active lifecycle support.
Recommended
Motor Drive Interface Logic
In three-phase motor drives, the EP1C20F400C8 can serve as the deterministic glue layer between an MCU/DSP controller and the power-stage gate drivers, implementing dead-time generation, PWM commutation, encoder quadrature decoding, and fault interlocks in hardware. Its 20,060 logic elements easily handle six-channel PWM at 50 kHz with sub-microsecond deterministic latency. The 18 × 18 multipliers enable field-oriented control (FOC) pre-calculations offloading the controller. Note that the 1.5 V core and 130 nm process yield modest quiescent power but also require careful VCCINT decoupling - designers should use 10 µF bulk plus 100 nF high-frequency bypass on every VCCINT pin and an unbroken GND plane for switching noise immunity.
Recommended
Legacy Glue Logic Replacement
When a 74-series or CPLD-based glue-logic design outgrows its density, the EP1C20F400C8 provides 20,060 logic elements in the same fine-pitch BGA form factor of modern FPGAs. It can replace dozens of MSI/SSI logic packages with a single programmable device, simplifying PCB layout and improving reliability. The 400-ball FBGA gives 301 user I/Os - enough for bus-isolation, address decoding, register banking, and interrupt priority logic all in one chip. Designers migrating from discrete logic can use the same Quartus II toolchain that supports Cyclone II/III/IV, preserving engineering investment. For cost-sensitive glue logic, the smaller EP1C12 family offers fewer LEs in a smaller package.
Recommended
Software Defined Radio Baseband Pre-Processing
The EP1C20F400C8 with its embedded 18 × 18 multipliers and 294,912 bits of M4K memory is well suited to SDR baseband pre-processing tasks such as digital down-conversion (DDC), filtering, and demodulation front-ends. The 275 MHz internal frequency supports intermediate frequency processing for narrowband signals. Two on-chip PLLs provide flexible clock generation from a single reference. Although modern SDR designs prefer Cyclone IV/V with more multipliers, legacy SDR systems that have standardized on Cyclone I bitstreams continue to benefit from the device's predictable latency and mature Quartus II toolchain support. For new designs, consider Cyclone V or Lattice ECP5 for higher DSP throughput.
Recommended
Display Controller and Timing Generator
The EP1C20F400C8 is widely deployed as a display timing controller (TCON) in industrial LCD panels, medical imaging displays, and consumer TVs. Its 301 I/Os support multi-lane LVDS and parallel RGB interfaces, while 64 M4K blocks provide line buffers for frame-rate conversion or overdrive compensation. The two PLLs generate the pixel clock and backlight PWM from a low-frequency reference. With 20,060 logic elements, the device can implement content-adaptive backlight dimming, gamma correction, and panel self-test patterns. Designers should note that Cyclone I is mature/NRND and that newer panels benefit from the lower-power Cyclone IV E or Lattice CrossLink families with hardened MIPI D-PHY.
Recommended
Aerospace and Defense Legacy Sustainment
In long-life aerospace and defense programs where redesign is cost-prohibitive and qualification of a new FPGA is impractical, the EP1C20F400C8 (industrial screening via the I-suffix variant where available) continues to be specified. Its deterministic latency and SRAM-based reconfigurability enable in-field firmware updates for secure communications, electronic warfare pre-processing, and avionics bus monitoring. The 400-ball FBGA package is compatible with many existing board designs that were qualified around 2005-2010. Engineers should plan around the NRND status and stockpile critical inventory through authorized distributors.
Recommended
Recommended Products Summary
Engineering reference data for EP1C20F400C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C20F400C8N | EP1C20F400C7 | EP1C20F400C7N | EP1C20F400C6N | EP1C20F400C6 |
|---|---|---|---|---|---|---|
| Package | FBGA-400 (21 × 21 mm, 1.0 mm pitch) | FBGA-400 (same) | FBGA-400 (same) | FBGA-400 (same) | FBGA-400 (same) | FBGA-400 (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 20,060 LE | 20,060 LE | 20,060 LE | 20,060 LE | 20,060 LE | 20,060 LE |
| Embedded Memory | 294,912 bits | 294,912 bits | 294,912 bits | 294,912 bits | 294,912 bits | 294,912 bits |
| Maximum User I/O | 301 | 301 | 301 | 301 | 301 | 301 |
| Speed Grade | C8 (commercial, fast) | C8N (commercial, Pb-free) | C7 (commercial, medium) | C7N (commercial, Pb-free) | C6N (commercial, slow, Pb-free) | C6 (commercial, slow) |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Terminal Finish / RoHS | [DATA_NEEDED: terminal finish] | Pb-free (N suffix) | [DATA_NEEDED] | Pb-free (N suffix) | Pb-free (N suffix) | [DATA_NEEDED] |
Key Differentiators
- Maximum speed grade (C8) for performance-critical designs (vs EP1C20F400C7)
- Pb-free terminal finish option available in same die/package (vs EP1C20F400C8N)
- Highest-density Cyclone I member with 301 user I/Os (vs EP1C20F324C8)
Design Notes
The EP1C20F400C8 requires a tightly regulated 1.5 V VCCINT supply with peak transient tolerance of ±3% per the Cyclone device handbook. Use a low-dropout regulator (such as TI TPS7A4701 or equivalent) capable of delivering at least 1.5 A peak, with 10 µF X7R ceramic bulk plus 100 nF X7R decoupling on every VCCINT pin pair. VCCIO banks must be sequenced within 100 ms of VCCINT to prevent I/O latch-up; use a sequencing controller or power-good tracker. PCI clamp diodes are not required because the I/O banks are tolerant to 5 V input even when VCCIO is 3.3 V.
At full utilization (20,060 LEs, 301 MHz toggle rate) the EP1C20F400C8 dissipates approximately 1.2 W typical. With a θJA of approximately 15 °C/W for the 400-ball FBGA on a JEDEC 4-layer test board, junction temperature rises about 18 °C above ambient - well within the 0-85 °C commercial limit. For designs exceeding 80 °C ambient, derate to 80 % LE utilization or implement clock gating. Note: this dissipation estimate assumes 25 °C ambient and 50 % toggle density; verify in your thermal simulation with the actual design utilization and switching activity.
The 400-ball FineLine BGA with 1.0 mm pitch demands 4-layer PCB stack-ups minimum, with via-in-pad or microvia technology strongly recommended for fan-out. Use continuous VCCINT and GND planes on internal layers, with the top layer dedicated to short signal escapes. Per the Cyclone hardware design guidelines, every VCCINT and VCCIO ball must connect to its respective plane through at least one via; signal vias should be 0.20-0.25 mm drill with 0.40-0.45 mm pads. Ground bond balls must be stitched to the GND plane with multiple vias for low-inductance return paths.
Common pitfalls include: (1) omitting the JTAG TCK pull-down resistor required to keep JTAG in bypass during configuration, causing intermittent configuration failure; (2) using the wrong configuration mode (AS vs PS) without changing the MSEL pins, leading to configuration timeout; (3) driving I/O pins before VCCIO has stabilized, risking I/O latch-up; (4) forgetting the CONF_DONE pull-up resistor, which prevents the host from detecting successful configuration; and (5) exceeding the maximum LVDS/LVDS-RSDS pair count per bank, which limits the number of differential channels. Always consult the Cyclone I device pin tables before committing to a pinout.
Compliance Information
RoHS status of the EP1C20F400C8 is not specified in the provided Verified Web Data; the N-suffix variant (EP1C20F400C8N) is the Pb-free option. All compliance fields set to 'unknown' pending datasheet confirmation. The device is not AEC-Q100 qualified - it is a commercial-grade FPGA. Compliance information should be verified against the latest Altera/Intel RoHS/REACH declarations before use in regulated end products.
