EP1S30B956C6 - Stratix 32K LE FPGA, 956-BGA, 130nm | Altera
Teilenummer: EP1S30B956C6 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $128 | $1.280,00 |
| 100 | $108 | $10.800,00 |
| 500 | $92 | $46.000,00 |
| 1.000 | $78 | $78.000,00 |
EP1S30B956C6 Übersicht
An FPGA (Field Programmable Gate Array) is a programmable logic device built from an array of configurable logic blocks (CLBs / LEs), embedded memory blocks, DSP blocks, and programmable interconnect, all controlled by SRAM-based configuration memory. Within the broader taxonomy, FPGA belongs to programmable logic, which sits alongside ASICs and CPLDs in the digital semiconductor hierarchy. The Stratix family introduced dedicated TriMatrix embedded memory, DSP blocks, and high-speed I/O to FPGAs, making them suitable for DSP, communications, and high-throughput data-path applications that previously required custom ASICs.
Key features of the EP1S30B956C6 include 32,470 LEs organized into 3,247 LABs, 3.4 Mbits of TriMatrix memory distributed across MRAM/M4K/M512 blocks, dedicated DSP blocks for fixed-point multiplication and accumulation, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates up to 12 PLLs for clock management and supports the Altera Passive Parallel (PP), Passive Serial (PS), and JTAG configuration modes via dedicated configuration pins.
At the architecture level, the Stratix die combines a row/column interconnect fabric with embedded memory columns and DSP columns, allowing designers to trade off logic, memory, and DSP resources per design. The 130 nm process node at 1.5 V core (VCCINT) provides a balance of static and dynamic power, while the C6 speed grade targets an internal operating frequency up to 450.05 MHz as published in the Stratix family datasheet. Configuration data is stored in an external configuration device (EPCS/EPC) or downloaded through JTAG, after which the device operates standalone with optional in-system reconfiguration.
Typical applications include high-speed digital signal processing (filtering, FFT engines), telecommunications backplane protocol bridging, video and image processing pipelines, industrial control and test instrumentation, and ASIC prototyping for high-density logic designs. Designers often pair the EP1S30B956C6 with EPCS64 configuration memories and Altera Quartus II design software for synthesis, place-and-route, and timing closure.
When designing with this device, carefully plan the 956-ball FCBGA escape routing, allocate sufficient PCB layers (typically 8+ layers with microvia or via-in-pad capability), and verify thermal management - the 130 nm Stratix family can dissipate several watts under typical workloads. Designers migrating to newer device families should treat the EP1S30B956C6 as NRND/EOL and evaluate Stratix II/III/IV or Cyclone IV/E families for new designs.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix family, and practical design notes not found in the manufacturer datasheet, helping engineers verify pinout, package, and life-cycle status in a single document.
Drop-in-Alternativen für EP1S30B956C6 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1S30B956C6 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Speed Grade, PLLs, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1S30B956C7
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP1S30B956C8
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP1S30B956C5
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP1S25B956C5N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP1S30B956C6 Grenzwerte & elektrische Eigenschaften
| Family | Stratix |
| Logic Elements (LEs) | 32,470 |
| Logic Array Blocks (LABs) | 3,247 |
| Embedded Memory Bits | 3,317,184 (approximately 3.4 Mbit) |
| Maximum User I/O | 683 |
| Process Technology | 130 nm CMOS |
| Core Voltage (VCCINT) | 1.5 V |
| Betriebstemperatur | 0 C to 85 C (Commercial) |
| Speed Grade | C6 |
| Gehäuse | 956-ball FCBGA (BGA-956), 40 x 40 mm, 1.27 mm pitch |
| Montageart | Surface Mount |
| Maximum Internal Frequency | 450.05 MHz (per family datasheet) |
| DSP Blocks | Yes (Stratix DSP blocks) |
| PLLs | Up to 12 |
| Configuration Modes | Passive Serial (PS), Passive Parallel (PP), JTAG |
| RoHS-Status | Not confirmed - pre-RoHS part |
| Lead-Free | Unknown |
EP1S30B956C6 956-ball fcbga (bga-956), 40 x 40 mm, 1.27 mm pitch Pinbelegungsleitfaden
Pinbelegung für EP1S30B956C6 (956-ball fcbga (bga-956), 40 x 40 mm, 1.27 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1S30B956C6.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1S30B956C6 ist geeignet für 6 Anwendungs: High-Speed DSP Pipelines (FFT / Filtering), Telecommunications Backplane Protocol Bridging, Video and Image Processing, ASIC Prototyping and Emulation, Industrial Control and Test Instrumentation, Military and Aerospace Legacy Systems.
High-Speed DSP Pipelines (FFT / Filtering)
The EP1S30B956C6's 32,470 logic elements, dedicated DSP blocks, and 3.4 Mbit of TriMatrix embedded memory make it well suited to fixed-point DSP pipelines such as radix-2/4 FFT engines, FIR/IIR filters, and channelizers. The 683 user I/Os in the 956-FCBGA package allow wide parallel data buses (up to ~70 LVDS pairs at 16-bit width) for sustained Gsps-class throughput. Designers typically instantiate the Stratix DSP blocks at 200-300 MHz to sustain real-time processing without over-clocking the LE fabric, and the embedded MRAM/M4K blocks provide coefficient and line-buffer storage. Compared with DSP processors, this FPGA delivers deterministic latency and 10-100x higher sample rates for SDR and radar front-ends.
Empfohlen
Telecommunications Backplane Protocol Bridging
The Stratix EP1S30B956C6 supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards on 683 pins, making it a flexible protocol-bridging device for telecom backplanes. It can implement SPI-4.2, SFI-5, UTOPIA, and POS-PHY interfaces alongside custom glue logic, offloading protocol conversion from ASICs and ASSPs. The 12 on-chip PLLs generate the multiple clock domains required for backplane rates from 155 Mbps (STM-1) to 2.5 Gbps, while the high pin count allows direct connection to multiple SFP/GBIC transceivers. For multi-port bridging, designers instantiate one PLLs per port and dedicate M4K memory blocks to elastic buffers and rate-matching FIFOs.
Empfohlen
Video and Image Processing
Video processing pipelines such as SD/HD-SDI encoding/decoding, motion estimation, and color-space conversion map efficiently onto the EP1S30B956C6's parallel LE fabric and embedded memory. The 3.4 Mbit TriMatrix memory holds several lines of HD video (1920 x 1080 x 16 bit) for line buffers, while 683 I/O pins enable multi-channel SDI capture or dual-link DVI/HDMI interfaces. DSP blocks accelerate discrete cosine transforms (DCT), deinterlacing, and scaling kernels. Designers typically run horizontal and vertical processing at 74.25 MHz (720p) or 148.5 MHz (1080p), well within the C6 speed-grade headroom, while keeping power manageable through clock gating unused LABs.
Empfohlen
ASIC Prototyping and Emulation
The EP1S30B956C6 is a workhorse for ASIC and SoC prototyping, where multiple FPGAs are cascaded to emulate gate counts beyond the capacity of any single device. Its 32,470 LEs, 683 I/Os, and Quartus II support for multi-FPGA partitioning make it a common choice for emulating ASICs in the 500K-1M gate range. Engineers partition the netlist across multiple Stratix devices, route chip-to-chip signals through the abundant user I/Os, and use the embedded TriMatrix memory to model ASIC SRAM blocks. The 956-FCBGA package exposes enough I/O to keep inter-FPGA pin multiplexing manageable, which is critical for achieving high operating frequencies in prototyping.
Empfohlen
Industrial Control and Test Instrumentation
In industrial automation and test equipment, the EP1S30B956C6 serves as a configurable timing engine, custom bus master, or signal-conditioning pre-processor. Its 0-85 C commercial temperature range and 683 LVCMOS/LVDS-capable I/Os support a mix of legacy 5 V-tolerant interfaces (via external resistor networks) and modern differential signaling for backplane communication. The 12 PLLs synthesize arbitrary clock frequencies for multi-channel arbitrary waveform generators (AWGs) or logic analyzers, while embedded DSP blocks accelerate real-time FFT-based spectrum analysis. Robust configuration options including JTAG allow in-field firmware updates via the tester's USB port.
Empfohlen
Military and Aerospace Legacy Systems
Long-life-cycle military and aerospace platforms that were designed around the original Stratix family continue to source the EP1S30B956C6 for sustainment and refurbishment. Its established reliability, qualification history, and continued availability through authorized brokers (Rochester Electronics holds licensed Altera/Intel stock) make it a fit for legacy avionics, radar, and electronic-warfare subsystems where PCB redesign is undesirable. The 956-FCBGA package supports the high pin density required for parallel ADC/DAC interfaces in radar beamforming and SIGINT systems, and the C6 speed grade comfortably meets typical 100-200 MHz digital down-conversion rates. Designers should verify lot-date-code (LDC) and moisture sensitivity level (MSL) with the supplier before installation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1S30B956C6 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1S30B956C7 | EP1S30B956C8 | EP1S30B956C5 | EP1S25B956C5N |
|---|---|---|---|---|---|
| Package | BGA-956 (40 x 40 mm, 1.27 mm pitch) | BGA-956 (40 x 40 mm, 1.27 mm pitch) - same | BGA-956 (40 x 40 mm, 1.27 mm pitch) - same | BGA-956 (40 x 40 mm, 1.27 mm pitch) - same | BGA-956 (40 x 40 mm, 1.27 mm pitch) - same |
| Brand | Altera (now Intel FPGA) | Altera | Altera | Altera | Altera |
| Family | Stratix (130 nm) | Stratix (130 nm) | Stratix (130 nm) | Stratix (130 nm) | Stratix (130 nm) |
| Logic Elements | 32,470 | 32,470 | 32,470 | 32,470 | 25,660 |
| Embedded Memory | 3,317,184 bit | 3,317,184 bit | 3,317,184 bit | 3,317,184 bit | 1,922,048 bit |
| Maximum User I/O | 683 | 683 | 683 | 683 | 683 (package-limited) |
| Speed Grade | C6 | C7 (faster) | C8 (fastest) | C5 (slower) | C5 |
| Operating Temperature | 0 C to 85 C (Commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND | Obsolete / NRND |
Wichtigste Unterscheidungsmerkmale
- Same 956-FCBGA footprint as speed-grade variants (vs. EP1S30B956C7 / EP1S30B956C8)
- Higher logic capacity than EP1S25 in the same BGA-956 footprint (vs. EP1S25B956C5N)
- Massive 683 I/O count in a single package (vs. EP1S30F780C6N)
Designhinweise
Estimated: The Stratix EP1S30 at typical utilization (60% LEs, 25% memory, 50% DSP) and 200 MHz operation dissipates approximately 4-7 W on a properly designed 8-layer PCB with continuous ground and power planes. The 956-FCBGA package exposes the die through the BGA balls to internal copper planes, so a thermal pad array on the underside of the package connected to an internal copper pour is recommended. Avoid placing the FPGA on the bottom side of the board or in a sealed enclosure without forced airflow above 2 m/s for sustained high-utilization workloads.
The 956-ball FCBGA with 1.27 mm pitch demands an 8-layer (or more) PCB stack-up with microvia or via-in-pad technology for clean signal escape routing. Use 0.5 oz copper on outer layers and 1 oz on inner power/ground planes. All BGA balls should be connected to inner planes via a dog-bone fan-out or microvia array. Maintain a continuous VCCINT plane directly beneath the BGA to minimize inductance on the 1.5 V core rail and to provide thermal spreading. Decoupling requires at least twenty 0.1 uF X7R capacitors distributed under the BGA footprint, plus four 10 uF bulk capacitors near the package perimeter.
Do not assume the EP1S30B956C6 is RoHS-compliant without explicit lot documentation - the original Stratix family predates the RoHS transition. Verify lead finish (SnPb vs lead-free) with the supplier before assembly. Also, do not connect JTAG TCK at voltages above 3.3 V without a level shifter - the Stratix I configuration pins are 3.3 V LVCMOS tolerant but can be damaged by 5 V signals. When migrating designs from Stratix to Stratix II, do not reuse the EPCS configuration memory bitstream - the configuration file formats differ and require fresh compilation in Quartus II.
Place the EPCS configuration memory within 50 mm of the FPGA DATA0/DCLK/nCONFIG/nSTATUS pins and route the configuration bus as a short point-to-point link with a 100 ohm differential-style termination if the trace exceeds 25 mm. Keep all 12 PLL power supply pins (VCCA_PLL, VCCD_PLL) isolated from digital switching noise with their own filter network (ferrite bead + 10 uF + 0.1 uF). For high-speed LVDS pairs (above 500 Mbps), match trace lengths to within 0.13 mm and maintain 100 ohm differential impedance with a tight ground-side coupling.
Compliance-Informationen
Original Stratix family pre-dates many modern compliance mandates; lot-by-lot verification required with supplier. Not AEC-Q100 qualified (commercial temperature grade only).
