EP1S25F1020C6N - Stratix 25K LE FPGA, 706 I/O, FBGA-1020 | Intel
Teilenummer: EP1S25F1020C6N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $555 | $555,00 |
| 10 | $540 | $5.400,00 |
| 100 | $510 | $51.000,00 |
| 500 | $475 | $237.500,00 |
| 1.000 | $450 | $450.000,00 |
EP1S25F1020C6N Übersicht
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that can be customized after manufacturing using a hardware description language (HDL) bitstream. FPGAs occupy a specific tier of the digital semiconductor hierarchy: they sit above general-purpose microcontrollers in raw parallel computational throughput but below ASICs in per-unit cost efficiency. Stratix family FPGAs target high-bandwidth signal processing, telecom/datacom line cards, and prototyping platforms where time-to-market outweighs the cost-per-gate penalty of structured ASIC.
Key differentiating specifications include 706 user I/O pins, embedded multiplier blocks, up to 12 transceiver channels (per Stratix family architecture), and a maximum internal clock frequency near 450 MHz. The FC-FBGA-1020 package uses flip-chip interconnect for improved electrical and thermal performance, enabling higher I/O counts at finer pitches than wire-bonded BGAs of equivalent area. The commercial grade temperature range makes the EP1S25F1020C6N suitable for controlled-environment applications rather than industrial or automotive deployments.
Typical applications include telecom line cards, high-speed data acquisition backplanes, video broadcast equipment, and ASIC prototyping for protocol bridges and DSP pipelines. The high I/O count (706 pins) and substantial embedded memory (1,944,576 bits) make this device well-suited for multi-channel baseband processing where parallel data paths are required. Designers transitioning to newer process nodes should evaluate Cyclone IV/V or Stratix IV/V equivalents for active lifecycle and toolchain support, since the original Stratix family is no longer in active production.
When designing with this part, ensure a proper decoupling network on each core and I/O voltage rail, follow Altera's flip-chip PCB layout guidelines for the 1 mm-pitch BGA, and use Quartus II (legacy versions) for synthesis, place-and-route, and bitstream generation. The Stratix family uses 1.5 V VCCINT, and reliable configuration requires the EPC configuration device family or JTAG download cable compatible with legacy Quartus Programmer.
Drop-in-Alternativen für EP1S25F1020C6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1S25F1020C6N (gleiche Bauform und Footprint) – abweichend in Operating Temperature, DSP Blocks, Package, Speed Grade, Configuration Method.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1S25F1020C6
✅ Drop-In✓ Auf Lager
$425 / Stück
Datenblatt ansehen →EP1S25F1020C5N
✅ Drop-In✓ Auf Lager
$640 / Stück
Datenblatt ansehen →EP1S25F1020C5
✅ Drop-In✓ Auf Lager
$650 / Stück
Datenblatt ansehen →EP1S25B672C7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$620.15 / Stück
Datenblatt ansehen →EP1S25F1020C6N Grenzwerte & elektrische Eigenschaften
| Family | Stratix |
| Logic Elements (LE) | 25,660 |
| Logic Cells | 25,660 |
| Embedded Memory (bits) | 1,944,576 |
| User I/O Pins | 706 |
| LABs (Logic Array Blocks) | 2,566 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Gehäuse | 1020-ball FC-FBGA (33 x 33 mm, 1.0 mm pitch) |
| Maximum Internal Clock Frequency | 450.05 MHz |
| Betriebstemperatur | 0C to +85C (Commercial) |
| Montageart | Surface Mount |
| Configuration Method | JTAG or EPC configuration device |
| Family Generation | Stratix (1st generation) |
EP1S25F1020C6N 1020-ball fc-fbga (33 x 33 mm, 1.0 mm pitch) Pinbelegungsleitfaden
Pinbelegung für EP1S25F1020C6N (1020-ball fc-fbga (33 x 33 mm, 1.0 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1S25F1020C6N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1S25F1020C6N ist geeignet für 6 Anwendungs: Telecom Line Card Aggregation, ASIC Prototyping and Emulation, High-Speed Data Acquisition Backplane, Video Broadcast and Image Processing, DSP Pipeline Aggregation, Legacy Industrial Control and Test Equipment.
Telecom Line Card Aggregation
The EP1S25F1020C6N's 25,660 logic elements and 706 user I/O pins make it well-suited for telecom line card aggregation where multiple lower-speed serial links are multiplexed onto a higher-speed backplane. Its 1,944,576 bits of embedded TriMatrix memory provide on-chip buffering for packet re-assembly without external SRAM, while the 1.5 V core and high-speed I/O support LVDS and HSTL signaling common in backplane designs. Legacy SONET/SDH and early Ethernet switch fabrics were designed around this exact device family.
Empfohlen
ASIC Prototyping and Emulation
With 25,660 logic elements and abundant M4K/M-RAM memory blocks, the EP1S25F1020C6N is widely deployed in ASIC prototyping platforms where a single chip can host a large block of pre-silicon RTL. The FC-FBGA-1020 package exposes 706 I/Os, allowing designers to bring out wide internal buses for chip-to-chip multi-FPGA partitioning. Quartus II legacy synthesis supports incremental compile, so design teams can iterate on sub-modules without full place-and-route rebuilds.
Empfohlen
High-Speed Data Acquisition Backplane
The 706 user I/O and 1 mm pitch FC-FBGA package support high-density LVDS interfaces typical of multi-channel data acquisition cards digitizing analog signals at 100+ MSPS per channel. The embedded DSP blocks perform per-channel decimation, FIR filtering, and FFT preprocessing on-chip before storing results in the 1.9 Mbit TriMatrix memory, dramatically reducing downstream processor loading. Industrial, medical imaging, and radar prototypes were common Stratix-family use cases.
Empfohlen
Video Broadcast and Image Processing
The EP1S25F1020C6N's embedded multiplier blocks and high internal clock frequency (up to 450 MHz) are well-matched to SDI video processing, color-space conversion, and real-time video filtering pipelines. The TriMatrix memory subsystem handles line buffers and frame-delay elements directly, eliminating external SRAM. SD/HD-SDI, DVB-ASI, and early HDMI processing designs frequently targeted this exact Stratix part because of its I/O count and on-chip memory density.
Empfohlen
DSP Pipeline Aggregation
The Stratix DSP blocks deliver 18 x 18-bit signed multiplication with optional accumulation, and the EP1S25F1020C6N offers enough DSP blocks for multi-channel FIR, IIR, and FFT pipelines at baseband sample rates. Combined with 25,660 LEs for control logic and 706 I/Os for streaming interfaces, a single chip can replace multiple DSP processors in cost-sensitive designs. Legacy software-defined radio and baseband modem designs were built on this part.
Empfohlen
Legacy Industrial Control and Test Equipment
Long-life-cycle industrial platforms - including test equipment, machine vision controllers, and process automation - continue to specify the EP1S25F1020C6N because re-validation costs make migration away from proven Stratix silicon impractical. The commercial 0C to +85C temperature range suits factory-floor enclosures, and the FC-FBGA-1020 package provides the ruggedness required by IPC-A-610 Class 2 assembly. Secondary-market channels stock this part precisely to support such legacy installations.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1S25F1020C6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1S25F1020C6 | EP1S25F1020C5N | EP1S25F1020C5 | EP1S25B672C7N |
|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (33x33 mm, 1.0 mm pitch) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 672-ball BGA (different) |
| Brand | Altera (now Intel) | Altera (same) | Altera (same) | Altera (same) | Altera (same) |
| Logic Elements | 25,660 | 25,660 (same) | 25,660 (same) | 25,660 (same) | 25,660 (same die) |
| User I/O Pins | 706 | 706 (same) | 706 (same) | 706 (same) | 493 (different package, fewer balls) |
| Speed Grade | 6 (C6N) | 6 (same) | 5 (faster) | 5 (faster) | 7 (slower) |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same) | 1,944,576 (same die) |
| Lead-Free Designator (N suffix) | Yes (Pb-free) | No (standard) | Yes (Pb-free) | No (standard) | Yes (Pb-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Identical silicon and package as EP1S25F1020C6 (non-N suffix) (vs. EP1S25F1020C6)
- Speed grade 6 with full 1020-ball FC-FBGA availability (vs. EP1S25F1020C5N)
- Mid-density Stratix with maximum I/O count in this family tier (vs. EP1S25B672C7N)
Designhinweise
The FC-FBGA-1020 package uses 1.0 mm pitch flip-chip solder balls. PCB fabrication must use laser-drilled or mechanically drilled micro-vias with 0.2 mm via-pad and 0.4 mm capture pad. Follow Altera AN 471: 'High-Density BGA Design Guidelines' for stack-up recommendations (typically 8-layer 1 oz copper) and via-in-pad plating for thermal relief. Skip-via or dog-bone fan-out is acceptable but increases board area; via-in-pad yields a more compact 35 x 35 mm keep-out.
Estimated: at 100% logic utilization with toggling rates near 25%, the EP1S25F1020C6N core current draw reaches approximately 3 A from the 1.5 V VCCINT rail. Provide at least 4 low-ESR decoupling capacitors (220 uF bulk + 22 uF + 1 uF + 0.1 uF) physically placed within 5 mm of the BGA balls feeding VCCINT. The PLL analog VCCA rail (2.5 V) needs a dedicated ferrite-isolated LDO with 10 uF + 0.1 uF local decoupling, per the Stratix Device Handbook chapter on power distribution.
Do not confuse the EP1S25F1020 (1020-ball) variant with the EP1S25B672 (672-ball) variant - they share the same silicon die but the package pinout is entirely different, so HDL bitstreams are not interchangeable across packages. Always re-run full Quartus place-and-route when targeting a different speed grade (C6N -> C5N) because timing optimization differs. The original Stratix family is not supported in Quartus II versions after 9.0; do not attempt to open the project in Quartus Prime 18.0+.
Compliance-Informationen
RoHS and lead-free status marked as [DATA_NEEDED]; 'N' suffix in C6N suggests Pb-free per Altera naming convention but a current material declaration certificate should be requested from the supplier. Not AEC-Q100 qualified (commercial grade FPGA). IPC-A-610 Class 2 or Class 3 assembly recommended.
