EP1SGX25DF1020C7N - 25,660 LEs Stratix GX FPGA, 1020-FBGA | Intel
Teilenummer: EP1SGX25DF1020C7N ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $171 | $171.000,00 |
EP1SGX25DF1020C7N Übersicht
An FPGA is a reconfigurable integrated circuit that lets engineers implement arbitrary digital logic, memory blocks, and high-speed I/O through a programmable fabric of look-up tables, flip-flops, routing, and hard IP cores. FPGAs occupy a tier above microcontrollers (fixed instruction set) and below application-specific integrated circuits (ASICs) in the design-flexibility spectrum. The Stratix GX family specifically targets serial connectivity, embedding transceiver physical coding sublayers, byte serializers, and rate-matching FIFOs directly in silicon, which dramatically reduces external PHY count and BOM cost compared to FPGA-plus-discrete-PHY designs.
Key features include 25,660 logic elements, 1,944,576 embedded RAM bits, 607 user I/O pins, 2,566 LABs/CLBs, and 20 embedded transceivers supporting protocols such as PCI Express x1/x4/x8, SerialLite II, Gigabit Ethernet, and XAUI. The 33 mm × 33 mm FC-FBGA-1020 package uses a 1.0 mm ball pitch, enabling high-density board routing while remaining compatible with mainstream PCB fabrication processes. On-chip PLL count and global clock network details vary by configuration; the Quartus II design software generates the exact resource utilization report at compile time.
The Stratix GX architecture combines a TriMatrix embedded memory structure (M512/M4K/M-RAM blocks) with dedicated DSP blocks and embedded transceivers to support DSP-intensive and high-bandwidth designs in a single device. Hard PCI Express endpoint and physical coding sublayer cores allow direct connection to a host CPU or backplane without external bridges, which is a major advantage over soft-IP implementations on pure-logic FPGAs. The 1.5 V core supply with 130 nm process technology balances performance and power for the Stratix generation.
Typical applications include 10 Gbps network switching, wireless baseband processing, radar and SIGINT front-ends, high-performance computing coprocessors, and broadcast video processing. The combination of multi-gigabit transceivers, large memory bandwidth, and PCI Express endpoint IP makes the EP1SGX25DF1020C7N particularly well suited to line cards, soft routers, and protocol offload engines. The 1020-FBGA footprint also supports high I/O count, which is required when aggregating many lower-speed interfaces alongside high-speed serial links.
When designing with this device, plan power sequencing carefully: Stratix GX requires multiple supply rails (VCCINT, VCCIO, VCCA, VCCP, and transceiver supplies VCCE/VCCT) and strict ramp-rate control. Use the Quartus II PowerPlay early power estimator before final pin assignment to size decoupling, regulators, and thermal management. Signal integrity on 3.125 Gbps links requires matched-differential routing, AC coupling capacitors near the transmitter, and reference-clock jitter below the protocol's maximum tolerable value.
This page synthesizes distributor pricing, drop-in package-compatible variants, and practical design notes for the EP1SGX25DF1020C7N that are not aggregated on the manufacturer datasheet alone.
Drop-in-Alternativen für EP1SGX25DF1020C7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1SGX25DF1020C7N (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package Type, Package, Speed Grade, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1SGX25DF1020C6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$195 / Stück
Datenblatt ansehen →EP1SGX25DF1020C5N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$650 / Stück
Datenblatt ansehen →EP1SGX25DF1020C7
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$145 / Stück
Datenblatt ansehen →EP1SGX25DF1020C7ES
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1950 / Stück
Datenblatt ansehen →EP1SGX25DF1020C6
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$289 / Stück
Datenblatt ansehen →EP1SGX25DF1020C6ES
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$285 / Stück
Datenblatt ansehen →EP1SGX25DF1020C6L
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1485 / Stück
Datenblatt ansehen →EP1SGX25DF1020C7N Grenzwerte & elektrische Eigenschaften
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Number of LABs/CLBs | 2,566 |
| Total RAM Bits | 1,944,576 |
| Number of I/O | 607 |
| Number of Transceivers | 20 (embedded multi-gigabit) |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Speed Grade | C7 (commercial) |
| Betriebstemperatur | 0 °C to 85 °C |
| Package Type | 1020-ball FC-FBGA |
| Package Dimensions | 33 mm × 33 mm, 1.0 mm ball pitch |
| Montageart | Surface Mount |
| Lead Free | Yes |
| RoHS-Status | Compliant |
EP1SGX25DF1020C7N 33 mm × 33 mm, 1.0 mm ball pitch Pinbelegungsleitfaden
Pinbelegung für EP1SGX25DF1020C7N (33 mm × 33 mm, 1.0 mm ball pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1SGX25DF1020C7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1SGX25DF1020C7N ist geeignet für 7 Anwendungs: 10 Gbps Network Switching and Routing, Wireless Baseband Processing, Radar and SIGINT Front-End Processing, Broadcast Video Processing and Conversion, High-Performance Computing Coprocessor, Industrial Imaging and Machine Vision, Protocol Offload Engine for Storage and Networking.
10 Gbps Network Switching and Routing
The EP1SGX25DF1020C7N is well suited to 10 Gbps line-card designs where 20 embedded multi-gigabit transceivers up to 3.1875 Gbps can be aggregated into XAUI / 10 GbE links or SerialLite II backplane channels. With 25,660 logic elements, 1,944,576 embedded RAM bits, and hardened PCI Express endpoint IP, the device can implement forwarding tables, traffic managers, and protocol offload alongside the high-speed serial I/O. Engineers typically use the FC-FBGA-1020 footprint to escape four XAUI ports plus several lower-speed SGMII links on a single 12-layer board.
Empfohlen
Wireless Baseband Processing
The 25,660 logic elements combined with 1,944,576 bits of TriMatrix embedded memory and dedicated DSP blocks make the EP1SGX25DF1020C7N a strong fit for wireless baseband PHY implementations such as WCDMA, LTE, and WiMAX pre-aggregation. The embedded transceivers handle CPRI or OBSAI links to the RF front-end, while the fabric runs channel decoding, FFT/iFFT, and rate-matching. Commercial 0°C to 85°C operation covers indoor and outdoor cabinet environments typical of base-station deployments.
Empfohlen
Radar and SIGINT Front-End Processing
Defense and electronic-warfare applications leverage the EP1SGX25DF1020C7N's combination of 20 multi-gigabit transceivers, large TriMatrix memory, and DSP blocks to implement high-speed ADC capture, digital downconversion, and pulse compression. The transceivers accept LVDS or serial data directly from high-speed ADCs, and the embedded RAM buffers raw I/Q samples for FFT and matched-filter processing. The 1020-ball FC-FBGA package provides the I/O and power distribution required for heat-dissipating, high-clock-rate defense designs.
Empfohlen
Broadcast Video Processing and Conversion
The EP1SGX25DF1020C7N's 25,660 logic elements and 1,944,576 embedded RAM bits enable multi-stream SD/HD/3G-SDI processing, format conversion, and on-screen graphics overlay. Serial digital interface transceivers interface directly to SDI PHY chips, while the FPGA fabric handles scaling, de-interlacing, and color-space conversion. The C7 speed grade supports the clock rates required for 3G-SDI at 2.97 Gbps through external PHY plus internal data-path processing.
Empfohlen
High-Performance Computing Coprocessor
The EP1SGX25DF1020C7N functions as a PCI Express endpoint coprocessor in HPC servers and storage arrays, offloading search, compression, encryption, or DSP workloads from the host CPU. The hard PCI Express core provides x1/x4/x8 connectivity up to Gen1 rates, while the transceivers carry 10 GbE or SerialLite II to neighboring FPGAs or backplanes. The 607 user I/O pins expose local memory buses (DDR/DDR2) and QDR II SRAM interfaces for high-bandwidth working memory.
Empfohlen
Industrial Imaging and Machine Vision
Multi-camera machine-vision systems use the EP1SGX25DF1020C7N to aggregate Camera Link, CoaXPress, or LVDS image streams via the embedded transceivers, then perform real-time preprocessing, color conversion, and feature extraction in the FPGA fabric. The 1,944,576 embedded RAM bits buffer line-scan or area-scan frames, while the 25,660 logic elements host the image-processing pipeline. The commercial 0°C to 85°C range covers typical factory-floor thermal envelopes.
Empfohlen
Protocol Offload Engine for Storage and Networking
Storage OEMs deploy the EP1SGX25DF1020C7N as a TCP/IP offload engine, iSCSI accelerator, or RAID accelerator card, using the PCI Express hard core for host connectivity and the 20 transceivers for SAS/SATA aggregation or 10 GbE uplink. The 1,944,576 embedded RAM bits hold descriptor rings and reassembly buffers, while the 25,660 logic elements execute the offload state machines. The 1020-ball FC-FBGA package provides sufficient I/O to interface with multiple SAS/SATA PHYs and external DDR2 memory.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1SGX25DF1020C7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1SGX25DF1020C6N | EP1SGX25DF1020C5N | EP1SGX25DF1020C7 | EP1SGX25DF1020C7ES |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FC-FBGA (33x33 mm) | 1020-ball FC-FBGA (33x33 mm) - same | 1020-ball FC-FBGA (33x33 mm) - same | 1020-ball FC-FBGA (33x33 mm) - same | 1020-ball FC-FBGA (33x33 mm) - same |
| Speed Grade | C7 | C6 (one bin faster) | C5 (two bins faster) | C7 (same) | C7 engineering sample |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Transceivers | 20 (up to 3.1875 Gbps) | 20 (up to 3.1875 Gbps) | 20 (up to 3.1875 Gbps) | 20 (up to 3.1875 Gbps) | 20 (up to 3.1875 Gbps) |
| User I/O | 607 | 607 | 607 | 607 | 607 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Wichtigste Unterscheidungsmerkmale
- 20 embedded multi-gigabit transceivers at 3.1875 Gbps in a single device (vs. EP1SGX25CF672C7N (672-ball variant))
- Hardened PCI Express endpoint IP core (vs. Soft PCI Express IP on a logic-only FPGA)
- Last Time Buy status means prompt action is required (vs. Active Stratix IV GX (EP1SGX40F1508C7N))
Designhinweise
The Stratix GX family requires multiple independently-decoupled supply rails: VCCINT (1.5 V core), VCCIO (1.5/1.8/2.5/3.3 V I/O banks), VCCA (PLL analog), VCCP (PCI Express), and transceiver-specific VCCE/VCCT/RREF rails. Each rail needs its own bulk capacitors plus 0.1 µF and 0.01 µF high-frequency decoupling placed within 100 mils of the relevant balls. Sequencer ICs such as the LTC2923 or ADP1828 should enforce the required power-up and power-down ordering documented in the Stratix GX handbook to avoid latch-up.
Estimated: at typical utilization (60% logic, 50% RAM, all 20 transceivers active at 3.125 Gbps), the EP1SGX25DF1020C7N dissipates approximately 12-15 W. The 33 mm × 33 mm FC-FBGA-1020 package has a junction-to-ambient thermal resistance (θJA) of approximately 8 °C/W with a properly designed 12-layer PCB thermal via array under the package. Without thermal vias, junction temperature can exceed 100 °C; thermal simulation in the Quartus II PowerPlay tool is required before sign-off.
The 1020-ball FC-FBGA with 1.0 mm ball pitch requires high-density interconnect (HDI) PCB fabrication with laser-drilled microvias. Stack-up should be 12 layers minimum to escape all 20 transceiver channels plus 607 user I/O without excessive via stubs. Transceiver differential pairs must be 100 Ω ±10% with intra-pair length matching within 5 mil, and length-matched to the reference clock within 50 mil for 3.125 Gbps operation.
Do not confuse the EP1SGX25DF1020C7N (1020-ball FC-FBGA, 20 transceivers) with the EP1SGX25CF672C7N (672-ball FBGA, fewer transceivers) - the two are NOT drop-in compatible despite sharing the same silicon die. The Quartus II fitter must be re-run for any speed-grade or package change because I/O assignment files (.qsf) are package-specific.
Compliance-Informationen
RoHS and lead-free per manufacturer datasheet. Not AEC-Q100 qualified - this is a commercial-grade FPGA. Conflict-mineral compliance per Intel published statement.