EP1SGX40DF1020C5 - Stratix GX FPGA, 41,250 LE, 624 I/O, FBGA-1020 | Intel
Teilenummer: EP1SGX40DF1020C5 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4483.16 | $4.483,16 |
| 10 | $4258 | $42.580,00 |
| 25 | $4080 | $102.000,00 |
| 100 | $3850 | $385.000,00 |
| 250 | $3650 | $912.500,00 |
EP1SGX40DF1020C5 Übersicht
An FPGA is a reconfigurable semiconductor device whose logic function is defined by user-programmed configuration bitstreams, rather than fixed at the fab. FPGAs sit above fixed-function ASICs and microcontrollers in the programmable-logic hierarchy, and are used to accelerate parallel workloads, prototype ASICs, and integrate high-speed serial interfaces. The Stratix GX family specifically targets high-bandwidth serial I/O (multi-gigabit transceivers), making it a bridge between FPGA fabric and standards such as PCI Express, Serial RapidIO, and Gigabit Ethernet.
Key features include 3,423,744 bits of embedded memory, embedded multiplier blocks for DSP, dedicated high-speed transceiver channels supporting multi-gigabit serial connectivity, and the configurable Logic Array Blocks (LABs) that compose the user-programmable fabric. The part ships in tray packaging and is part of the broader EP1SGX family, with the 'C5' suffix indicating the speed grade (5) and commercial temperature range.
Typical applications include high-throughput serial backplanes, base-station signal processing, ASIC prototyping, telecom line-card designs, and test & measurement platforms. The 33 x 33 mm FBGA-1020 package provides the high pin count required for parallel interfaces plus the signal integrity demanded by multi-gigabit serial links.
When designing with this device, plan for the high pin-count BGA fanout, multi-rail power sequencing (core, I/O, PLL, transceiver supplies), and an FPGA configuration scheme (JTAG, AS, or PS) suitable for the production flow. Reference the Stratix GX Device Family Data Sheet for pinout, transceiver parameters, and Quartus-II device support.
This page synthesizes distributor pricing, parametric cross-references, and practical design notes not found in the manufacturer datasheet alone. The Stratix GX family is now mature - engineers specifying new designs should evaluate whether a Cyclone, Arria, or Stratix V/10 device is more appropriate for long-term availability.
Drop-in-Alternativen für EP1SGX40DF1020C5 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1SGX40DF1020C5 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Speed Grade, RoHS Status, Package Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1SGX40DF1020C7N
✅ Drop-In✓ Auf Lager
$315 / Stück
Datenblatt ansehen →EP1SGX40DF1020C
✅ Drop-In✓ Auf Lager
$1950 / Stück
Datenblatt ansehen →EP1S40F1020C5
✅ Drop-In✓ Auf Lager
$165 / Stück
Datenblatt ansehen →EP1S40F1020C5N
✅ Drop-In✓ Auf Lager
$280 / Stück
Datenblatt ansehen →EP1SGX25DF1020C5
✅ Drop-In✓ Auf Lager
$1720 / Stück
Datenblatt ansehen →EP1SGX40DF1020C5 Grenzwerte & elektrische Eigenschaften
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Number of LABs/CLBs | 4,125 |
| Total Memory Bits | 3,423,744 |
| Number of I/O | 624 |
| Gehäuse | 1020-BBGA (FC-FBGA), 33 x 33 mm, 1.0 mm pitch |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Logic Family | CMOS |
| Betriebstemperatur | 0 °C to 85 °C (Commercial) |
| Anzahl der Pins | 1020 |
| Speed Grade | 5 |
| Packaging | Tray |
| Montageart | Surface Mount (BGA) |
EP1SGX40DF1020C5 1020-bbga (fc-fbga), 33 x 33 mm, 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EP1SGX40DF1020C5 (1020-bbga (fc-fbga), 33 x 33 mm, 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1SGX40DF1020C5.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1SGX40DF1020C5 ist geeignet für 6 Anwendungs: Telecom Line-Card Signal Processing, Wireless Base-Station Baseband, ASIC Prototyping and Emulation, High-Speed Serial Backplane Aggregation, Test & Measurement Instrumentation, Industrial Imaging and Video Processing.
Telecom Line-Card Signal Processing
The EP1SGX40DF1020C5's 41,250 logic elements, 4,125 LABs, and integrated multi-gigabit transceivers make it a strong fit for telecom line cards where serial backplane protocols such as Serial RapidIO or custom LVDS links run alongside parallel TDM buses. The 624 user I/O pins allow direct connection to parallel data converters, framer ASICs, and clock distribution networks without external bus expanders, reducing BOM cost and signal-path latency. Quartus II supports the Stratix GX IP library for telecom DSP, CRC, and framer functions, enabling rapid development. The 33 x 33 mm FBGA-1020 package is standard for line-card form factors used in ATCA and proprietary backplane designs, and the 1.5 V core supply simplifies legacy power-tree reuse.
Empfohlen
Wireless Base-Station Baseband
In wireless base-station baseband designs, the EP1SGX40DF1020C5 provides DSP-oriented embedded multiplier blocks, large embedded memory (3,423,744 bits), and multi-gigabit transceivers to interface with ADC/DAC front-ends and CPRI/OBSAI backhaul links. The logic and memory budget supports multi-antenna MIMO processing, channel coding, and crest-factor reduction (CFR) or digital predistortion (DPD) algorithms. The commercial 0-85 °C temperature range suits environmentally controlled base-station enclosures. While the device is obsolete, existing base-station deployments continue to use it where the firmware and toolchain are already validated, with maintenance via safety stock rather than new builds.
Empfohlen
ASIC Prototyping and Emulation
Engineers use the EP1SGX40DF1020C5 as an ASIC prototyping and emulation vehicle: its 41,250 logic elements, 4,125 LABs, and 624 I/O pins enable large multi-million-gate ASIC designs to be partitioned across multiple Stratix GX devices in a multi-FPGA emulation board. Embedded memory blocks serve as cache/queue emulation, while the multi-gigabit transceivers model high-speed ASIC SERDES interfaces with cycle-accurate fidelity. Quartus II's incremental compilation and LogicLock regions simplify partitioning across FPGAs. Although newer prototyping platforms favor Stratix V or Stratix 10, the EP1SGX40 remains in service for legacy emulation flows where the ASIC RTL is tied to a specific Stratix GX pinout and timing model.
Empfohlen
High-Speed Serial Backplane Aggregation
Multi-gigabit backplane aggregation in switches and routers leverages the EP1SGX40DF1020C5's integrated transceivers and 624 I/O. The FPGA aggregates multiple 3.125 Gbps or 6.375 Gbps links from line cards and re-times them onto the switch fabric, providing per-port statistics, OAM, and protocol bridging. The 1020-ball FC-FBGA package provides the signal-integrity margin needed for 6+ Gbps SERDES routing, and the 1.5 V core supply aligns with classic switch-ASIC power trees. Designers typically use the Stratix GX ALTGX megafunction in Quartus II to configure the transceivers and the PHY IP for PCI Express, XAUI, or custom protocols.
Empfohlen
Test & Measurement Instrumentation
Test and measurement platforms (logic analyzers, protocol testers, BERT equipment, oscilloscope acquisition cards) use the EP1SGX40DF1020C5 to combine high-speed serial pattern generation with deep pattern memory, parallel bus capture, and on-board DSP. The 3,423,744 embedded memory bits support large capture buffers and pattern sequences, while the 624 I/O pins and multi-gigabit transceivers deliver both parallel LVDS acquisition and serial stimulus. Quartus II IP for UART, I2C, SPI, and custom serial protocols simplifies instrument front-panel integration. Although the part is obsolete, long-lifecycle test platforms in industrial QA continue to depend on it for spare-part and calibration continuity.
Empfohlen
Industrial Imaging and Video Processing
Industrial imaging systems - machine vision, medical imaging, broadcast video processing - leverage the EP1SGX40DF1020C5's logic density and embedded memory to implement real-time image pipelines: Bayer demosaicing, color-space conversion, filtering, and compression (JPEG, MPEG, custom). The 624 I/O pins accept high-speed Camera Link, LVDS, or HDMI inputs and drive DDR memory controllers and display outputs. Embedded multipliers accelerate convolution and FFT kernels for image preprocessing. While the part is mature, it remains in service for legacy industrial imaging lines where the firmware stack is qualified and long-term reproducibility is critical.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1SGX40DF1020C5 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1SGX40DF1020C7N | EP1SGX40DF1020C | EP1S40F1020C5 | EP1S40F1020C5N | EP1SGX25DF1020C5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-BBGA (FC-FBGA), 33 x 33 mm, 1.0 mm pitch | 1020-BBGA (FC-FBGA), 33 x 33 mm - same | 1020-BBGA (FC-FBGA), 33 x 33 mm - same | 1020-BBGA (FC-FBGA) - same | 1020-BBGA (FC-FBGA) - same | 1020-BBGA (FC-FBGA) - same |
| Logic Elements | 41,250 | 41,250 (same) | 41,250 (same) | 41,250 (same die class, fewer transceivers) | 41,250 (same) | 25,640 (lower) |
| Number of LABs/CLBs | 4,125 | 4,125 (same) | 4,125 (same) | 4,125 (same) | 4,125 (same) | ~2,565 (lower) |
| Speed Grade | 5 | 7 (faster) | Unspecified | 5 (same) | 5 (same) | 5 (same) |
| Core Voltage | 1.5 V | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) | 1.5 V (same) |
| Lifecycle Status | Obsolete | Active | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Faster speed grade (7) with industrial temperature range, same package (vs. EP1SGX40DF1020C7N)
- Same 41,250 LE / 4,125 LAB fabric as the target (vs. EP1S40F1020C5)
- Same FBGA-1020 package, lower logic density (vs. EP1SGX25DF1020C5)
Designhinweise
The EP1SGX40DF1020C5 requires multiple power rails: 1.5 V core, 3.3 V I/O, plus dedicated PLL analog supplies (typically 1.5 V filtered from the core rail) and transceiver analog supplies (1.4 V/2.5 V depending on data rate). Power sequencing must follow Altera's recommended order to avoid latch-up; consult the Stratix GX Device Family Data Sheet, Volume 1, Chapter 4. Use a multi-rail power management IC such as the LTM4644 or similar to reduce BOM and ensure sequencing. Estimated: at 1.5 V core with typical Stratix GX power profile and 50% toggle rate, expect 5-8 W core power plus 0.5-1.5 W per active transceiver channel.
The 1020-ball FC-FBGA package at 1.0 mm pitch demands a high-density PCB with microvia stack-ups (at least 6 layers, 8+ recommended for transceiver signal integrity). Use a 1-2-1 or 1-2-2-1 stack-up with stripline for high-speed SERDES routing, and maintain 100 ohm differential impedance for transceiver channels and 50 ohm single-ended for general-purpose I/O. Place decoupling capacitors on the BGA underside using 0201 or 0402 sizes, one per power pin pair, with via-in-pad if budget allows. The thermal pad is on the package top side; use a heatsink or thermal interface material for designs exceeding 8 W total power.
Common pitfalls: (1) using a 130 nm FPGA in production without planning for obsolescence - the Stratix GX family is obsolete; (2) assuming Quartus Prime supports the device - Quartus II (legacy) is required; (3) ignoring the industrial-temperature variants for non-controlled environments; (4) underestimating configuration time for bitstreams larger than 10 Mbits; (5) forgetting to enable the JTAG chain for boundary-scan test. For new designs, validate the Quartus II version against the device support list before committing to the architecture.
Transceiver channel routing: maintain length matching within 0.127 mm (5 mil) for differential pairs, avoid right-angle bends (use 45-degree or curved), keep vias to a minimum (max 2 per channel), and isolate from noisy digital signals with a continuous ground reference plane. Each transceiver channel typically requires 4-6 PCB layers in its routing region. Reference the Altera Stratix GX Transceiver Layout Guide for detailed routing topologies, breakout patterns, and AC-coupling capacitor placement near the FPGA pin.
Compliance-Informationen
Compliance status not present in verified web data; manufacturer page and 2003-era Stratix GX datasheet do not explicitly state RoHS/REACH. Mark as unknown pending manufacturer confirmation. AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Designers in regulated industries should request compliance documentation directly from Intel.
