EP1S40F1020C5N - Stratix FPGA 41,250 LE | Intel | FBGA-1020
Teilenummer: EP1S40F1020C5N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $385 | $385,00 |
| 10 | $365 | $3.650,00 |
| 100 | $332 | $33.200,00 |
| 250 | $305 | $76.250,00 |
| 500 | $280 | $140.000,00 |
EP1S40F1020C5N Übersicht
An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit that combines programmable logic blocks, configurable interconnects, and embedded memory/DSP blocks into a single die. In the system hierarchy, FPGAs sit between general-purpose processors (CPUs/MCUs) and ASICs - offering hardware-level parallelism and I/O flexibility that microcontrollers cannot match, while avoiding the high NRE cost and long lead time of an ASIC. The Stratix family was Altera's (now Intel) flagship high-performance FPGA line, targeting telecom, DSP, and ASIC-prototyping workloads.
Key features of the EP1S40F1020C5N include 4,125 Logic Array Blocks (LABs), embedded DSP blocks for high-speed multiply-accumulate operations, multiple phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and FCRAM. The device also includes dedicated high-speed transceiver-ready I/O banks and tri-state buffering on every pin.
Architecturally, the Stratix I family introduced embedded TriMatrix memory (three sizes of memory blocks per LAB region), dedicated multiplier blocks, and the DirectDrive technology that ensures consistent signal integrity across the die. The C5 speed grade denotes the slowest of the commercial speed bins, trading maximum Fmax for lower dynamic power and improved timing margin - often the preferred choice for production ASIC prototyping where timing closure matters more than peak clock rate.
Typical applications include high-speed digital signal processing (DSP), telecom baseband processing, ASIC prototyping and emulation, network packet processing, video and image processing pipelines, and military/aerospace signal intelligence systems. The 1020-ball FBGA package enables the large logic and memory capacity while supporting the high pin count required by wide external memory buses.
When designing with this device, plan the power-decoupling network carefully - the FBGA-1020 package demands a multilayer PCB with dedicated power and ground planes, and the Quartus II tool flow should be used for place-and-route. The C5 speed grade may require additional pipelining stages compared to C6/C7 grades; verify timing closure before committing to this bin in volume.
This page synthesizes distributor pricing, drop-in same-family Stratix alternatives, and practical design considerations not found in the manufacturer datasheet alone, helping engineers select and source the right Stratix variant for legacy and new designs.
Drop-in-Alternativen für EP1S40F1020C5N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1S40F1020C5N (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, DSP Blocks, Embedded Memory, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1S40F1020C6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$695 / Stück
Datenblatt ansehen →EP1S40F1020C7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$926.78 / Stück
Datenblatt ansehen →EP1S40F1020C5
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$165 / Stück
Datenblatt ansehen →EP1S40F1020C5AA
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$195.4 / Stück
Datenblatt ansehen →EP1S60F1020C5N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$2050 / Stück
Datenblatt ansehen →EP1S40F1020C5N Grenzwerte & elektrische Eigenschaften
| Family | Stratix |
| Logic Elements (LE) | 41,250 |
| Logic Array Blocks (LAB) | 4,125 |
| Embedded Memory Bits | 3,423,744 |
| Maximum User I/Os | 773 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Maximum Internal Frequency | 500 MHz |
| Speed Grade | C5 (commercial, slowest) |
| Temperature Grade | Commercial Extended |
| Gehäuse | 1020-ball FBGA (FineLine BGA) |
| Montageart | Surface Mount |
| PLLs | Yes (multiple, enhanced PLL) |
| DSP Blocks | Yes (embedded multiplier blocks) |
| External Memory Support | DDR SDRAM, QDR SRAM, FCRAM, ZBT |
| Configuration Scheme | Passive serial, active serial, JTAG |
| RoHS-Status | Unknown - verify with manufacturer |
| Lead-Free | Unknown |
EP1S40F1020C5N 1020-ball fbga (fineline bga) Pinbelegungsleitfaden
Pinbelegung für EP1S40F1020C5N (1020-ball fbga (fineline bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1S40F1020C5N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1S40F1020C5N ist geeignet für 6 Anwendungs: ASIC Prototyping and Emulation, Telecom Baseband Processing, High-Speed Digital Signal Processing, Network Packet Processing, Video and Image Processing Pipelines, Military and Aerospace Signal Intelligence.
ASIC Prototyping and Emulation
The EP1S40F1020C5N's 41,250 logic elements and 3.42 Mbit embedded memory make it a strong fit for ASIC prototyping where designers map RTL from a target ASIC into multiple Stratix FPGAs. The 773 user I/Os at 500 MHz internal clock support wide external memory buses and high-throughput chip-to-chip links. Designers prefer the C5 speed grade because timing closure on a large prototype is easier at the slowest bin; once verified, the same netlist runs unchanged on C6/C7 production parts. The 130 nm process provides predictable timing behavior that matches the synthesized RTL closely. Quartus II synthesis and place-and-route handle multi-FPGA partitioning. Trade-off: large designs require careful thermal management since the FBGA-1020 package dissipates significant power at full utilization.
Empfohlen
Telecom Baseband Processing
Telecom baseband designs leverage the EP1S40F1020C5N's embedded DSP multiplier blocks and high I/O count for parallel channel processing. The Stratix I architecture's TriMatrix memory (M512, M4K, M-RAM blocks) is ideal for storing filter coefficients and intermediate sample buffers. The 500 MHz maximum internal frequency supports symbol-rate processing for many wireless standards, and the multiple enhanced PLLs handle the complex clock trees needed for serial transceivers and external memory interfaces. The 1020-ball FBGA exposes enough I/O to drive DDR SDRAM banks for high-bandwidth sample storage. Trade-off vs ASIC: the FPGA's per-unit cost is higher than a production ASIC at high volume, but the time-to-market advantage is decisive for early deployment.
Empfohlen
High-Speed Digital Signal Processing
The EP1S40F1020C5N excels at high-throughput DSP workloads including FIR filters, FFT engines, and video codecs. Its dedicated multiplier blocks deliver multiply-accumulate operations per clock cycle, dramatically outperforming LE-based implementations. The 3.42 Mbit of embedded memory provides low-latency storage for sample windows and twiddle-factor tables, while the 773 I/Os enable direct connection to high-speed ADCs and DACs. The C5 speed grade trades peak Fmax for improved timing margin, which is often beneficial in pipelined DSP where every register stage must close timing. Trade-off: for purely serial DSP, a DSP-optimized device may be more power-efficient; the Stratix I is preferred when design flexibility matters.
Empfohlen
Network Packet Processing
Network routers and switches benefit from the EP1S40F1020C5N's combination of logic density, embedded memory, and high I/O bandwidth. Packet headers, lookup tables, and queue descriptors fit in the 3.42 Mbit TriMatrix memory, eliminating the latency of off-chip lookups. The 773 user I/Os accommodate multiple 10/100 Gigabit Ethernet MACs and SPI-4.2 interfaces. Hardware parallelism enables line-rate processing at full wire speed without the overhead of a CPU-based design. The C5 speed grade suits most packet-processing clock rates. Trade-off: high-density packet processing at 100G+ may require multiple FPGAs or migration to Stratix IV/V/10 with integrated transceivers, as the Stratix I lacks hardened SerDes.
Empfohlen
Video and Image Processing Pipelines
The EP1S40F1020C5N supports real-time video pipelines including HD-SDI ingest, color-space conversion, scaling, and overlay composition. Embedded memory blocks buffer full video frames, while DSP blocks perform per-pixel operations at hundreds of MHz. The 1020-ball FBGA package exposes enough I/Os to drive DDR2 SDRAM frame buffers and BT.656/1120 video interfaces. Designers leverage the C5 speed grade for reliable timing closure on long combinational paths through the pixel pipeline. Quartus II provides IP cores for common video standards. Trade-off: for 4K/UHD pipelines, designers should migrate to newer families (Stratix V/10) with higher logic density and integrated transceivers.
Empfohlen
Military and Aerospace Signal Intelligence
The EP1S40F1020C5N's commercial-extended temperature grade and the availability of military-processed variants (e.g., EP1S40F1020C5AA) make it suitable for defense signal-intelligence systems. Its high logic density supports wideband digital receivers, channelizers, and encryption engines, while embedded DSP blocks accelerate FFTs and polyphase filterbanks. The 1020-ball FBGA's high I/O count enables direct connection to high-speed ADC/DAC arrays used in EW and SIGINT systems. The C5 speed grade provides the timing margin required for safety-critical and long-lifecycle defense programs. Trade-off: aerospace programs often require the -AA or -DM screened variants with full MIL-STD-883 processing, which carry longer lead times.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1S40F1020C5N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1S40F1020C6N | EP1S40F1020C7N | EP1S40F1020C5 | EP1S40F1020C5AA | EP1S60F1020C5N |
|---|---|---|---|---|---|---|
| Package | 1020-ball FBGA | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LE) | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 57,120 (+38%) |
| Speed Grade | C5 (slowest commercial) | C6 (mid) | C7 (fastest) | C5 | C5 | C5 |
| Embedded Memory | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 5,215,104 bits |
| Maximum User I/Os | 773 | 773 | 773 | 773 | 773 | 773 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible upgrade path to higher logic capacity (vs. EP1S60F1020C5N)
- Best timing margin among Stratix I speed grades (vs. EP1S40F1020C7N)
- Military-processed option available (vs. EP1S40F1020C5AA)
Designhinweise
The EP1S40F1020C5N requires multiple supply rails: 1.5 V VCCINT (core), 1.5/1.8/2.5/3.3 V VCCIO (I/O banks), 2.5 V VCC_PLL (PLL analog), and VCCPD for pre-drivers. Each PLL analog supply must be filtered with a ferrite bead and decoupled with 0.1 uF and 10 uF capacitors per the Stratix handbook. Estimated: at 50% logic utilization and 300 MHz operation, total power dissipation typically ranges 4-8 W; use a multilayer PCB with dedicated ground and power planes to minimize supply noise.
The 1020-ball FBGA package has a theta_JA of approximately 8-12 C/W with proper thermal via array under the exposed die pad (per typical Stratix I datasheet). For continuous operation above 5 W, attach a heatsink or use forced-air cooling; without thermal management, junction temperature can exceed 100 C in enclosed enclosures. Estimated: at 6 W dissipation, expect a 50-70 C junction temperature rise above ambient. Use thermal vias under the package BGA balls to conduct heat to inner copper planes.
Route all 773 user I/O signals on inner PCB layers with microstrip or stripline topology to control impedance (typically 50 ohm single-ended, 100 ohm differential). The 1020-ball FBGA at 1.00 mm pitch requires laser-drilled microvias or 4-mil via-in-pad technology for breakout; standard 8-mil through-vias will not escape the inner rows. Maintain continuous ground return paths under all high-speed signals to control crosstalk and EMI.
Common pitfalls with the EP1S40F1020C5N: (1) omitting PLL power filtering causes PLL lock failures; (2) failing to configure all unused I/O banks to a defined VCCIO leads to floating inputs and excess Icc; (3) using the wrong JTAG chain order when programming via passive serial causes configuration failure; (4) selecting C5 when the design requires C7 timing margin leads to Fmax violations; (5) the 'N' suffix denotes lead-free - older designs may require the non-N variant for backwards compatibility. Always run Quartus II timing analysis before tapeout.
Compliance-Informationen
The 'N' suffix in EP1S40F1020C5N denotes lead-free (Pb-free) per Altera/Intel legacy packaging conventions. RoHS, REACH, and halogen-free status not confirmed in provided web data - verify with manufacturer for current compliance certificates. Not AEC-Q100 qualified - FPGAs are not automotive-grade ICs in the traditional sense, but may be used in automotive designs after qualification.