EP2SGX60DF780I4 vs EP2SGX60DF780C3N Vergleich
Detaillierter Direktvergleich von EP2SGX60DF780I4 von Intel und EP2SGX60DF780C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel
EP2SGX60DF780I4 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2SGX60DF780I4 | EP2SGX60DF780C3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.550,00 | $188,00 |
| Family | Stratix II GX | Stratix II GX |
| Device Logic Elements | 60,440 | — |
| Logic Cells / CLBs | 60,440 | — |
| Total RAM Bits | 2,544,192 bits | — |
| User I/O Count | 364 | — |
| Transceivers | Embedded multi-gigabit transceivers (MGTs) | — |
| Transceiver Data Rate | [DATA_NEEDED: transceiver data rate in Gbps] | — |
| Internal Maximum Frequency | 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay] | [DATA_NEEDED: propagation delay ns] |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Gehäuse | 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | -40C to +100C (Industrial) | [DATA_NEEDED: operating temperature range C] |
| Speed Grade | I4 (Industrial, speed grade 4) | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | Compliant | Compliant (per distributor listing) |
| Device Type | — | FPGA |
| Logic Elements | — | 60,440 |
| LABs/CLBs | — | 3,022 |
| Total Memory Bits | — | 2,544,192 |
| User I/Os | — | 364 |
| Package Type | — | 780-pin FC-FBGA (DF780) |
| Package Dimensions | — | 23 x 23 mm |
| Pitch | — | 1 mm |
| Internal Frequency | — | 717 MHz |