EP3SL70F484C3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Altera
Teilenummer: EP3SL70F484C3 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1119.68 | $1.119,68 |
| 10 | $1050 | $10.500,00 |
| 100 | $950 | $95.000,00 |
| 500 | $875 | $437.500,00 |
| 1.000 | $810 | $810.000,00 |
EP3SL70F484C3 Übersicht
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs) interconnected by programmable routing fabric. FPGAs sit within the broader hierarchy of programmable logic (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), and are used to implement custom digital logic without fabricating an ASIC, enabling rapid prototyping and design iteration.
Key features include 67,500 logic elements, 2,699,264 embedded memory bits, 296 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), dedicated DSP blocks for high-speed arithmetic, and on-chip transceivers optimized for memory interfaces and high-speed serial connectivity. The 1.1 V core voltage and 65 nm process technology deliver favorable power-per-gate ratios compared to earlier Stratix generations.
Architecturally, the Stratix III L family uses Altera's adaptive logic modules (ALMs) and a multi-track routing interconnect optimized for timing closure at high frequencies. The -C3 speed grade indicates a moderate speed/power balance suitable for commercial-temperature applications (0C to +85C). The 484-pin FBGA package provides high I/O density in a relatively compact 23 x 23 mm footprint suitable for high-performance PCB designs.
Typical applications include high-speed data acquisition systems, telecommunications backplane interfaces, software-defined radio (SDR) baseband processing, ASIC prototyping, video processing and encoding, and high-performance computing accelerators. The large logic capacity and memory make this device well-suited for designs that previously required mid-range ASICs.
Designers should pay attention to the Stratix III power planning flow (PowerPlay) and use Altera's Quartus II toolchain for synthesis, place-and-route, and timing closure. The -C3 speed grade has tighter timing margins than -C4 but offers lower power; for designs targeting maximum performance, evaluate -I3 or -I4 industrial grades.
This page synthesizes distributor pricing from authorized sources, drop-in same-package alternatives within the Stratix III L family, and practical FPGA design considerations not consolidated in any single manufacturer document.
Drop-in-Alternativen für EP3SL70F484C3 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3SL70F484C3 (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, Family, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP3SL70F484C3N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP3SL70F484C3G
✅ Drop-In✓ Auf Lager
$985 / Stück
Datenblatt ansehen →EP3SL70F484I3N
✅ Drop-In✓ Auf Lager
$995.4 / Stück
Datenblatt ansehen →EP3SL70F484C4
✅ Drop-In✓ Auf Lager
$780 / Stück
Datenblatt ansehen →EP3SL70F484C2
✅ Drop-In✓ Auf Lager
$980 / Stück
Datenblatt ansehen →EP3SL50F484C3
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP3SE50F484C3
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$820 / Stück
Datenblatt ansehen →EP3SL70F484C3 Grenzwerte & elektrische Eigenschaften
| Family | Stratix III L |
| Logic Elements | 67,500 |
| Embedded Memory (bits) | 2,699,264 |
| User I/Os | 296 |
| Logic Array Blocks (LABs) | 2,700 |
| Number of Cells | 67,500 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| Gehäuse | 484-BBGA / FC-FBGA |
| Montageart | Surface Mount |
| Speed Grade | C3 |
| Betriebstemperatur | 0C to +85C (commercial) |
| Lead-Free / RoHS | Lead-free (per DigiChip listing) |
| Manufacturer | Altera (now Intel FPGA) |
EP3SL70F484C3 484-bbga / fc-fbga Pinbelegungsleitfaden
Pinbelegung für EP3SL70F484C3 (484-bbga / fc-fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP3SL70F484C3.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP3SL70F484C3 ist geeignet für 6 Anwendungs: Software-Defined Radio (SDR) Baseband, High-Speed Data Acquisition Systems, Telecommunications Backplane Interface, ASIC Prototyping and Emulation, Video Processing and Encoding, Industrial Motor Control and Automation.
Software-Defined Radio (SDR) Baseband
The EP3SL70F484C3 is well-suited for software-defined radio baseband signal processing where 67,500 logic elements and 2.7 Mbit of embedded memory support complex FFT, channelization, and demodulation datapaths at 100-200 MHz baseband rates. The 484-FBGA package provides 296 user I/Os, sufficient for parallel ADC/DAC interfaces (LVDS at hundreds of Msps) and digital data links to host processors. Compared with DSP processors, the FPGA's parallel architecture delivers 10-100x throughput for FFT and matrix operations while maintaining flexibility to support multiple waveform standards. The 65nm process and 1.1V core yield reasonable power efficiency for embedded radio modules, and the M-RAM memory blocks enable wide ping-pong buffers for streaming I/Q samples.
Empfohlen
High-Speed Data Acquisition Systems
In multi-channel data acquisition systems, the EP3SL70F484C3 captures and processes LVDS data from parallel ADCs at sample rates up to 250 Msps per channel, using its 296 user I/Os for differential pair fan-in. The 2.7 Mbit embedded memory provides FIFO buffering for sample streams, while the 67,500 logic elements implement digital down-conversion (DDC), decimation filters, and trigger logic. Designers typically pair this FPGA with 14-16 bit ADCs and external DDR2/QDR memory for full-rate capture-to-storage pipelines. The C3 speed grade supports 250 MHz internal logic, sufficient for DDC and FIR filter operations in radar, lidar, and electronic warfare front-ends.
Empfohlen
Telecommunications Backplane Interface
The EP3SL70F484C3 implements 10G Ethernet MAC, Interlaken, and custom SERDES aggregation logic in telecommunications backplanes where deterministic latency and high throughput are critical. With 67,500 LEs the device handles multiple 6.144 Gbps lanes plus packet classification and traffic shaping. The 484-FBGA provides differential pairs with controlled impedance suitable for backplane signaling (3-5 Gbps NRZ) and includes on-chip termination. Compared with ASIC implementations, the FPGA enables rapid iteration on Layer 2/3 processing pipelines, and the Stratix III L family supports PCIe Gen1 hard IP for host interface integration.
Empfohlen
ASIC Prototyping and Emulation
The EP3SL70F484C3 is widely used for ASIC prototyping because 67,500 logic elements map effectively to 1-2 million gates of typical ASIC logic, and 296 user I/Os provide breadboard-style connectivity for cut-down ASIC pinouts. Engineers partition the ASIC design across multiple Stratix III L devices using TDM or chip-on-chip interconnect schemes. The C3 speed grade supports 100-150 MHz ASIC-equivalent operation, sufficient for functional verification and software bring-up. Compared with commercial emulation platforms, building an in-house FPGA prototype with EP3SL70F484C3 cuts cost by 10-50x for sub-million-gate designs.
Empfohlen
Video Processing and Encoding
Broadcast video processing systems leverage the EP3SL70F484C3 for H.264/AVC or JPEG2000 encoding, deinterlacing, and color-space conversion at 1080p60 resolutions. The 67,500 logic elements implement real-time motion estimation, transform blocks, and entropy coding pipelines, while 2.7 Mbit embedded memory holds reference frames and macroblock lines. The 296 I/Os enable parallel connection to HDMI/DVI receivers, video ADCs/DACs, and external DDR2 frame buffers. The 1.1V core and Stratix III L power-optimized architecture keep encoder board power within 5-8W typical, suitable for broadcast video appliances.
Empfohlen
Industrial Motor Control and Automation
In factory automation and high-end motor drives, the EP3SL70F484C3 implements field-oriented control (FOC), space-vector PWM, and multi-axis servo loops with sub-microsecond update rates. The 65 nm Stratix III L family provides deterministic latency needed for tight current control loops, while 296 I/Os handle encoder feedback (EnDat, BiSS), resolver excitation, and gate-drive PWM for IGBT bridges. The commercial-temp C3 variant suits cabinet-mounted drives; the I3N industrial variant suits -40C outdoor or vehicle applications. Designers typically pair the FPGA with EP3SE50F484C3 for lower-power companion logic where LE count is sufficient.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3SL70F484C3 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3SL70F484C3N | EP3SL70F484I3N | EP3SL70F484C4 | EP3SL70F484C2 | EP3SL50F484C3 | EP3SE50F484C3 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 67,500 | 67,500 (identical) | 67,500 | 67,500 | 67,500 | 50,000 (-26%) | 50,000 (-26%) |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 (identical) | 2,699,264 | 2,699,264 | 2,699,264 | ~2,100,000 (-22%) | ~2,100,000 (-22%) |
| User I/Os | 296 | 296 (identical) | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | C3 | C3 (identical) | I3 (industrial temp, slightly slower) | C4 (slower) | C2 (faster) | C3 | C3 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.1 V | 1.1 V (identical) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
Wichtigste Unterscheidungsmerkmale
- Same-package pin compatibility with -C3N RoHS variant (vs. EP3SL70F484C3N)
- Stratix III L logic density tier (vs. EP3SL50F484C3 (50K LE))
- Commercial vs industrial temperature variants (vs. EP3SL70F484I3N (industrial -40C to +100C))
- C3 vs C2 speed grade trade-off (vs. EP3SL70F484C2)
- Stratix III L vs Stratix III E family positioning (vs. EP3SE50F484C3 (Stratix III E))
Designhinweise
Estimated: At typical Stratix III L utilization (70% LE, 50% memory, 50% I/O toggle) with the C3 speed grade at 250 MHz, total on-chip power dissipation is roughly 4-6W. The 484-FBGA package requires a thermal pad landed to an inner PCB ground plane with thermal vias; without this, junction temperature can exceed 100C even at commercial ambient. Use Altera's PowerPlay Early Power Estimator (EPE) spreadsheet before board layout to size the cooling solution.
The 484-FBGA has 1.0 mm ball pitch per the Stratix III packaging specifications. PCB fabrication requires laser-drilled micro-vias or 4-6 mil via-in-pad with filled/capped plating for reliable assembly. Use a 4-layer stackup minimum with continuous ground planes on layers 2 and 4. All differential pairs (LVDS) must be length-matched within 50 mils at 1 Gbps and routed over a continuous reference plane with 100 ohm differential impedance.
Do not assume Stratix III silicon is pin-compatible with Stratix IV or V in the same FBGA footprint - the I/O bank assignments and configuration pin mapping differ between families. Quartus II pin assignments from a Stratix III design will not work directly on a Stratix IV board. Use only same-family (Stratix III L) or same-silicon variants of EP3SL70F484C3 (such as EP3SL70F484C3N, EP3SL70F484I3N) for guaranteed drop-in compatibility.
Place configuration devices (EPCS series flash) within 4 inches of the FPGA's configuration pins and route the configuration clock (DCLK) away from high-frequency switching signals. The 1.1V core supply requires a low-noise LDO or DC-DC regulator with output ripple below 30 mVpp; shared supplies with noisy digital logic will cause jitter in LVDS and SERDES interfaces. Decouple each VCCINT and VCCIO pin with 0.1 uF and 10 uF ceramic capacitors within 100 mils of the package ball.
Stratix III L supports up to 1.6 Gbps LVDS on select I/O banks. To achieve full data rate, maintain 100 ohm differential impedance with 4-8 mil trace width and 4-5 mil spacing on the top microstrip layer over a continuous ground plane. Avoid via stubs on high-speed LVDS routes by using back-drilling for thicker stackups. Perform post-layout IBIS simulation in Quartus II or HyperLynx before board fab release.
Compliance-Informationen
Per the DigiChip listing, EP3SL70F484C3 is lead-free. RoHS compliance confirmed by Altera/Intel FPGA datasheet. AEC-Q100 is not applicable for FPGAs. REACH and conflict-minerals status not stated in the available data.
