EP3SL70F484C3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Altera
부품 번호: EP3SL70F484C3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1119.68 | $1,119.68 |
| 10 | $1050 | $10,500.00 |
| 100 | $950 | $95,000.00 |
| 500 | $875 | $437,500.00 |
| 1,000 | $810 | $810,000.00 |
EP3SL70F484C3 개요
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs) interconnected by programmable routing fabric. FPGAs sit within the broader hierarchy of programmable logic (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), and are used to implement custom digital logic without fabricating an ASIC, enabling rapid prototyping and design iteration.
Key features include 67,500 logic elements, 2,699,264 embedded memory bits, 296 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), dedicated DSP blocks for high-speed arithmetic, and on-chip transceivers optimized for memory interfaces and high-speed serial connectivity. The 1.1 V core voltage and 65 nm process technology deliver favorable power-per-gate ratios compared to earlier Stratix generations.
Architecturally, the Stratix III L family uses Altera's adaptive logic modules (ALMs) and a multi-track routing interconnect optimized for timing closure at high frequencies. The -C3 speed grade indicates a moderate speed/power balance suitable for commercial-temperature applications (0C to +85C). The 484-pin FBGA package provides high I/O density in a relatively compact 23 x 23 mm footprint suitable for high-performance PCB designs.
Typical applications include high-speed data acquisition systems, telecommunications backplane interfaces, software-defined radio (SDR) baseband processing, ASIC prototyping, video processing and encoding, and high-performance computing accelerators. The large logic capacity and memory make this device well-suited for designs that previously required mid-range ASICs.
Designers should pay attention to the Stratix III power planning flow (PowerPlay) and use Altera's Quartus II toolchain for synthesis, place-and-route, and timing closure. The -C3 speed grade has tighter timing margins than -C4 but offers lower power; for designs targeting maximum performance, evaluate -I3 or -I4 industrial grades.
This page synthesizes distributor pricing from authorized sources, drop-in same-package alternatives within the Stratix III L family, and practical FPGA design considerations not consolidated in any single manufacturer document.
드롭인 대체품: EP3SL70F484C3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL70F484C3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Family, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL70F484C3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP3SL70F484C3G
✅ 드롭인✓ 재고 있음
$985 / 개
데이터시트 보기 →EP3SL70F484I3N
✅ 드롭인✓ 재고 있음
$995.4 / 개
데이터시트 보기 →EP3SL70F484C4
✅ 드롭인✓ 재고 있음
$780 / 개
데이터시트 보기 →EP3SL70F484C2
✅ 드롭인✓ 재고 있음
$980 / 개
데이터시트 보기 →EP3SL50F484C3
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP3SE50F484C3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$820 / 개
데이터시트 보기 →EP3SL70F484C3 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements | 67,500 |
| Embedded Memory (bits) | 2,699,264 |
| User I/Os | 296 |
| Logic Array Blocks (LABs) | 2,700 |
| Number of Cells | 67,500 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| 패키지 | 484-BBGA / FC-FBGA |
| 실장 유형 | Surface Mount |
| Speed Grade | C3 |
| 동작 온도 | 0C to +85C (commercial) |
| Lead-Free / RoHS | Lead-free (per DigiChip listing) |
| Manufacturer | Altera (now Intel FPGA) |
EP3SL70F484C3 484-bbga / fc-fbga 핀 구성 가이드
EP3SL70F484C3(484-bbga / fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL70F484C3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL70F484C3 적합 용도: 6 애플리케이션s: Software-Defined Radio (SDR) Baseband, High-Speed Data Acquisition Systems, Telecommunications Backplane Interface, ASIC Prototyping and Emulation, Video Processing and Encoding, Industrial Motor Control and Automation.
Software-Defined Radio (SDR) Baseband
The EP3SL70F484C3 is well-suited for software-defined radio baseband signal processing where 67,500 logic elements and 2.7 Mbit of embedded memory support complex FFT, channelization, and demodulation datapaths at 100-200 MHz baseband rates. The 484-FBGA package provides 296 user I/Os, sufficient for parallel ADC/DAC interfaces (LVDS at hundreds of Msps) and digital data links to host processors. Compared with DSP processors, the FPGA's parallel architecture delivers 10-100x throughput for FFT and matrix operations while maintaining flexibility to support multiple waveform standards. The 65nm process and 1.1V core yield reasonable power efficiency for embedded radio modules, and the M-RAM memory blocks enable wide ping-pong buffers for streaming I/Q samples.
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High-Speed Data Acquisition Systems
In multi-channel data acquisition systems, the EP3SL70F484C3 captures and processes LVDS data from parallel ADCs at sample rates up to 250 Msps per channel, using its 296 user I/Os for differential pair fan-in. The 2.7 Mbit embedded memory provides FIFO buffering for sample streams, while the 67,500 logic elements implement digital down-conversion (DDC), decimation filters, and trigger logic. Designers typically pair this FPGA with 14-16 bit ADCs and external DDR2/QDR memory for full-rate capture-to-storage pipelines. The C3 speed grade supports 250 MHz internal logic, sufficient for DDC and FIR filter operations in radar, lidar, and electronic warfare front-ends.
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Telecommunications Backplane Interface
The EP3SL70F484C3 implements 10G Ethernet MAC, Interlaken, and custom SERDES aggregation logic in telecommunications backplanes where deterministic latency and high throughput are critical. With 67,500 LEs the device handles multiple 6.144 Gbps lanes plus packet classification and traffic shaping. The 484-FBGA provides differential pairs with controlled impedance suitable for backplane signaling (3-5 Gbps NRZ) and includes on-chip termination. Compared with ASIC implementations, the FPGA enables rapid iteration on Layer 2/3 processing pipelines, and the Stratix III L family supports PCIe Gen1 hard IP for host interface integration.
추천
ASIC Prototyping and Emulation
The EP3SL70F484C3 is widely used for ASIC prototyping because 67,500 logic elements map effectively to 1-2 million gates of typical ASIC logic, and 296 user I/Os provide breadboard-style connectivity for cut-down ASIC pinouts. Engineers partition the ASIC design across multiple Stratix III L devices using TDM or chip-on-chip interconnect schemes. The C3 speed grade supports 100-150 MHz ASIC-equivalent operation, sufficient for functional verification and software bring-up. Compared with commercial emulation platforms, building an in-house FPGA prototype with EP3SL70F484C3 cuts cost by 10-50x for sub-million-gate designs.
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Video Processing and Encoding
Broadcast video processing systems leverage the EP3SL70F484C3 for H.264/AVC or JPEG2000 encoding, deinterlacing, and color-space conversion at 1080p60 resolutions. The 67,500 logic elements implement real-time motion estimation, transform blocks, and entropy coding pipelines, while 2.7 Mbit embedded memory holds reference frames and macroblock lines. The 296 I/Os enable parallel connection to HDMI/DVI receivers, video ADCs/DACs, and external DDR2 frame buffers. The 1.1V core and Stratix III L power-optimized architecture keep encoder board power within 5-8W typical, suitable for broadcast video appliances.
추천
Industrial Motor Control and Automation
In factory automation and high-end motor drives, the EP3SL70F484C3 implements field-oriented control (FOC), space-vector PWM, and multi-axis servo loops with sub-microsecond update rates. The 65 nm Stratix III L family provides deterministic latency needed for tight current control loops, while 296 I/Os handle encoder feedback (EnDat, BiSS), resolver excitation, and gate-drive PWM for IGBT bridges. The commercial-temp C3 variant suits cabinet-mounted drives; the I3N industrial variant suits -40C outdoor or vehicle applications. Designers typically pair the FPGA with EP3SE50F484C3 for lower-power companion logic where LE count is sufficient.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL70F484C3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL70F484C3N | EP3SL70F484I3N | EP3SL70F484C4 | EP3SL70F484C2 | EP3SL50F484C3 | EP3SE50F484C3 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 67,500 | 67,500 (identical) | 67,500 | 67,500 | 67,500 | 50,000 (-26%) | 50,000 (-26%) |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 (identical) | 2,699,264 | 2,699,264 | 2,699,264 | ~2,100,000 (-22%) | ~2,100,000 (-22%) |
| User I/Os | 296 | 296 (identical) | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | C3 | C3 (identical) | I3 (industrial temp, slightly slower) | C4 (slower) | C2 (faster) | C3 | C3 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.1 V | 1.1 V (identical) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
주요 차별점
- Same-package pin compatibility with -C3N RoHS variant (vs EP3SL70F484C3N)
- Stratix III L logic density tier (vs EP3SL50F484C3 (50K LE))
- Commercial vs industrial temperature variants (vs EP3SL70F484I3N (industrial -40C to +100C))
- C3 vs C2 speed grade trade-off (vs EP3SL70F484C2)
- Stratix III L vs Stratix III E family positioning (vs EP3SE50F484C3 (Stratix III E))
설계 노트
Estimated: At typical Stratix III L utilization (70% LE, 50% memory, 50% I/O toggle) with the C3 speed grade at 250 MHz, total on-chip power dissipation is roughly 4-6W. The 484-FBGA package requires a thermal pad landed to an inner PCB ground plane with thermal vias; without this, junction temperature can exceed 100C even at commercial ambient. Use Altera's PowerPlay Early Power Estimator (EPE) spreadsheet before board layout to size the cooling solution.
The 484-FBGA has 1.0 mm ball pitch per the Stratix III packaging specifications. PCB fabrication requires laser-drilled micro-vias or 4-6 mil via-in-pad with filled/capped plating for reliable assembly. Use a 4-layer stackup minimum with continuous ground planes on layers 2 and 4. All differential pairs (LVDS) must be length-matched within 50 mils at 1 Gbps and routed over a continuous reference plane with 100 ohm differential impedance.
Do not assume Stratix III silicon is pin-compatible with Stratix IV or V in the same FBGA footprint - the I/O bank assignments and configuration pin mapping differ between families. Quartus II pin assignments from a Stratix III design will not work directly on a Stratix IV board. Use only same-family (Stratix III L) or same-silicon variants of EP3SL70F484C3 (such as EP3SL70F484C3N, EP3SL70F484I3N) for guaranteed drop-in compatibility.
Place configuration devices (EPCS series flash) within 4 inches of the FPGA's configuration pins and route the configuration clock (DCLK) away from high-frequency switching signals. The 1.1V core supply requires a low-noise LDO or DC-DC regulator with output ripple below 30 mVpp; shared supplies with noisy digital logic will cause jitter in LVDS and SERDES interfaces. Decouple each VCCINT and VCCIO pin with 0.1 uF and 10 uF ceramic capacitors within 100 mils of the package ball.
Stratix III L supports up to 1.6 Gbps LVDS on select I/O banks. To achieve full data rate, maintain 100 ohm differential impedance with 4-8 mil trace width and 4-5 mil spacing on the top microstrip layer over a continuous ground plane. Avoid via stubs on high-speed LVDS routes by using back-drilling for thicker stackups. Perform post-layout IBIS simulation in Quartus II or HyperLynx before board fab release.
규정 준수 정보
Per the DigiChip listing, EP3SL70F484C3 is lead-free. RoHS compliance confirmed by Altera/Intel FPGA datasheet. AEC-Q100 is not applicable for FPGAs. REACH and conflict-minerals status not stated in the available data.
