EP3SL70F484C3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Altera
MPN： EP3SL70F484C3 ✗ 停產EP3SL70F484C3 概覽
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs) interconnected by programmable routing fabric. FPGAs sit within the broader hierarchy of programmable logic (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor), and are used to implement custom digital logic without fabricating an ASIC, enabling rapid prototyping and design iteration.
Key features include 67,500 logic elements, 2,699,264 embedded memory bits, 296 user I/O pins, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), dedicated DSP blocks for high-speed arithmetic, and on-chip transceivers optimized for memory interfaces and high-speed serial connectivity. The 1.1 V core voltage and 65 nm process technology deliver favorable power-per-gate ratios compared to earlier Stratix generations.
Architecturally, the Stratix III L family uses Altera's adaptive logic modules (ALMs) and a multi-track routing interconnect optimized for timing closure at high frequencies. The -C3 speed grade indicates a moderate speed/power balance suitable for commercial-temperature applications (0C to +85C). The 484-pin FBGA package provides high I/O density in a relatively compact 23 x 23 mm footprint suitable for high-performance PCB designs.
Typical applications include high-speed data acquisition systems, telecommunications backplane interfaces, software-defined radio (SDR) baseband processing, ASIC prototyping, video processing and encoding, and high-performance computing accelerators. The large logic capacity and memory make this device well-suited for designs that previously required mid-range ASICs.
Designers should pay attention to the Stratix III power planning flow (PowerPlay) and use Altera's Quartus II toolchain for synthesis, place-and-route, and timing closure. The -C3 speed grade has tighter timing margins than -C4 but offers lower power; for designs targeting maximum performance, evaluate -I3 or -I4 industrial grades.
This page synthesizes distributor pricing from authorized sources, drop-in same-package alternatives within the Stratix III L family, and practical FPGA design considerations not consolidated in any single manufacturer document.
直接替換替代品，適用於 EP3SL70F484C3 — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： EP3SL70F484C3 （相同外形與佔位） — 差異在於 Package, Speed Grade, Operating Temperature, Family, Process Technology.
EP3SL70F484C3N
✅ 直接替換📋 參考替代品（不在目錄中）
EP3SL70F484C3G
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F484I3N
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F484C4
✅ 直接替換聯絡詢價
查看資料表 →EP3SL70F484C2
✅ 直接替換聯絡詢價
查看資料表 →EP3SL50F484C3
✅ 直接替換聯絡詢價
查看資料表 →EP3SE50F484C3
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →EP3SL70F484C3 最大額定值與電氣特性
| Family | Stratix III L |
| Logic Elements | 67,500 |
| Embedded Memory (bits) | 2,699,264 |
| User I/Os | 296 |
| Logic Array Blocks (LABs) | 2,700 |
| Number of Cells | 67,500 |
| Core Voltage | 1.1 V |
| Process Technology | 65 nm |
| 封裝 | 484-BBGA / FC-FBGA |
| 安裝類型 | Surface Mount |
| Speed Grade | C3 |
| 工作溫度 | 0C to +85C (commercial) |
| Lead-Free / RoHS | Lead-free (per DigiChip listing) |
| Manufacturer | Altera (now Intel FPGA) |
EP3SL70F484C3 484-bbga / fc-fbga 腳位配置指南
EP3SL70F484C3（484-bbga / fc-fbga 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： EP3SL70F484C3.
請參閱 資料表 以查看完整腳位配置。
典型應用
EP3SL70F484C3 適用於 6 應用s: Software-Defined Radio (SDR) Baseband, High-Speed Data Acquisition Systems, Telecommunications Backplane Interface, ASIC Prototyping and Emulation, Video Processing and Encoding, Industrial Motor Control and Automation.
Software-Defined Radio (SDR) Baseband
The EP3SL70F484C3 is well-suited for software-defined radio baseband signal processing where 67,500 logic elements and 2.7 Mbit of embedded memory support complex FFT, channelization, and demodulation datapaths at 100-200 MHz baseband rates. The 484-FBGA package provides 296 user I/Os, sufficient for parallel ADC/DAC interfaces (LVDS at hundreds of Msps) and digital data links to host processors. Compared with DSP processors, the FPGA's parallel architecture delivers 10-100x throughput for FFT and matrix operations while maintaining flexibility to support multiple waveform standards. The 65nm process and 1.1V core yield reasonable power efficiency for embedded radio modules, and the M-RAM memory blocks enable wide ping-pong buffers for streaming I/Q samples.
推薦
High-Speed Data Acquisition Systems
In multi-channel data acquisition systems, the EP3SL70F484C3 captures and processes LVDS data from parallel ADCs at sample rates up to 250 Msps per channel, using its 296 user I/Os for differential pair fan-in. The 2.7 Mbit embedded memory provides FIFO buffering for sample streams, while the 67,500 logic elements implement digital down-conversion (DDC), decimation filters, and trigger logic. Designers typically pair this FPGA with 14-16 bit ADCs and external DDR2/QDR memory for full-rate capture-to-storage pipelines. The C3 speed grade supports 250 MHz internal logic, sufficient for DDC and FIR filter operations in radar, lidar, and electronic warfare front-ends.
推薦
Telecommunications Backplane Interface
The EP3SL70F484C3 implements 10G Ethernet MAC, Interlaken, and custom SERDES aggregation logic in telecommunications backplanes where deterministic latency and high throughput are critical. With 67,500 LEs the device handles multiple 6.144 Gbps lanes plus packet classification and traffic shaping. The 484-FBGA provides differential pairs with controlled impedance suitable for backplane signaling (3-5 Gbps NRZ) and includes on-chip termination. Compared with ASIC implementations, the FPGA enables rapid iteration on Layer 2/3 processing pipelines, and the Stratix III L family supports PCIe Gen1 hard IP for host interface integration.
推薦
ASIC Prototyping and Emulation
The EP3SL70F484C3 is widely used for ASIC prototyping because 67,500 logic elements map effectively to 1-2 million gates of typical ASIC logic, and 296 user I/Os provide breadboard-style connectivity for cut-down ASIC pinouts. Engineers partition the ASIC design across multiple Stratix III L devices using TDM or chip-on-chip interconnect schemes. The C3 speed grade supports 100-150 MHz ASIC-equivalent operation, sufficient for functional verification and software bring-up. Compared with commercial emulation platforms, building an in-house FPGA prototype with EP3SL70F484C3 cuts cost by 10-50x for sub-million-gate designs.
推薦
Video Processing and Encoding
Broadcast video processing systems leverage the EP3SL70F484C3 for H.264/AVC or JPEG2000 encoding, deinterlacing, and color-space conversion at 1080p60 resolutions. The 67,500 logic elements implement real-time motion estimation, transform blocks, and entropy coding pipelines, while 2.7 Mbit embedded memory holds reference frames and macroblock lines. The 296 I/Os enable parallel connection to HDMI/DVI receivers, video ADCs/DACs, and external DDR2 frame buffers. The 1.1V core and Stratix III L power-optimized architecture keep encoder board power within 5-8W typical, suitable for broadcast video appliances.
推薦
Industrial Motor Control and Automation
In factory automation and high-end motor drives, the EP3SL70F484C3 implements field-oriented control (FOC), space-vector PWM, and multi-axis servo loops with sub-microsecond update rates. The 65 nm Stratix III L family provides deterministic latency needed for tight current control loops, while 296 I/Os handle encoder feedback (EnDat, BiSS), resolver excitation, and gate-drive PWM for IGBT bridges. The commercial-temp C3 variant suits cabinet-mounted drives; the I3N industrial variant suits -40C outdoor or vehicle applications. Designers typically pair the FPGA with EP3SE50F484C3 for lower-power companion logic where LE count is sufficient.
推薦
推薦產品摘要
工程參考資料，適用於 EP3SL70F484C3 — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | EP3SL70F484C3N | EP3SL70F484I3N | EP3SL70F484C4 | EP3SL70F484C2 | EP3SL50F484C3 | EP3SE50F484C3 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 67,500 | 67,500 (identical) | 67,500 | 67,500 | 67,500 | 50,000 (-26%) | 50,000 (-26%) |
| Embedded Memory (bits) | 2,699,264 | 2,699,264 (identical) | 2,699,264 | 2,699,264 | 2,699,264 | ~2,100,000 (-22%) | ~2,100,000 (-22%) |
| User I/Os | 296 | 296 (identical) | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | C3 | C3 (identical) | I3 (industrial temp, slightly slower) | C4 (slower) | C2 (faster) | C3 | C3 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.1 V | 1.1 V (identical) | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
主要差異化特點
- Same-package pin compatibility with -C3N RoHS variant (對比EP3SL70F484C3N)
- Stratix III L logic density tier (對比EP3SL50F484C3 (50K LE))
- Commercial vs industrial temperature variants (對比EP3SL70F484I3N (industrial -40C to +100C))
- C3 vs C2 speed grade trade-off (對比EP3SL70F484C2)
- Stratix III L vs Stratix III E family positioning (對比EP3SE50F484C3 (Stratix III E))
設計說明
Estimated: At typical Stratix III L utilization (70% LE, 50% memory, 50% I/O toggle) with the C3 speed grade at 250 MHz, total on-chip power dissipation is roughly 4-6W. The 484-FBGA package requires a thermal pad landed to an inner PCB ground plane with thermal vias; without this, junction temperature can exceed 100C even at commercial ambient. Use Altera's PowerPlay Early Power Estimator (EPE) spreadsheet before board layout to size the cooling solution.
The 484-FBGA has 1.0 mm ball pitch per the Stratix III packaging specifications. PCB fabrication requires laser-drilled micro-vias or 4-6 mil via-in-pad with filled/capped plating for reliable assembly. Use a 4-layer stackup minimum with continuous ground planes on layers 2 and 4. All differential pairs (LVDS) must be length-matched within 50 mils at 1 Gbps and routed over a continuous reference plane with 100 ohm differential impedance.
Do not assume Stratix III silicon is pin-compatible with Stratix IV or V in the same FBGA footprint - the I/O bank assignments and configuration pin mapping differ between families. Quartus II pin assignments from a Stratix III design will not work directly on a Stratix IV board. Use only same-family (Stratix III L) or same-silicon variants of EP3SL70F484C3 (such as EP3SL70F484C3N, EP3SL70F484I3N) for guaranteed drop-in compatibility.
Place configuration devices (EPCS series flash) within 4 inches of the FPGA's configuration pins and route the configuration clock (DCLK) away from high-frequency switching signals. The 1.1V core supply requires a low-noise LDO or DC-DC regulator with output ripple below 30 mVpp; shared supplies with noisy digital logic will cause jitter in LVDS and SERDES interfaces. Decouple each VCCINT and VCCIO pin with 0.1 uF and 10 uF ceramic capacitors within 100 mils of the package ball.
Stratix III L supports up to 1.6 Gbps LVDS on select I/O banks. To achieve full data rate, maintain 100 ohm differential impedance with 4-8 mil trace width and 4-5 mil spacing on the top microstrip layer over a continuous ground plane. Avoid via stubs on high-speed LVDS routes by using back-drilling for thicker stackups. Perform post-layout IBIS simulation in Quartus II or HyperLynx before board fab release.
合規資訊
Per the DigiChip listing, EP3SL70F484C3 is lead-free. RoHS compliance confirmed by Altera/Intel FPGA datasheet. AEC-Q100 is not applicable for FPGAs. REACH and conflict-minerals status not stated in the available data.
